DK0616053T3 - Selvaccelererende og genopfyldende neddypningsovertræksfremgangsmåde uden formaldehyd - Google Patents

Selvaccelererende og genopfyldende neddypningsovertræksfremgangsmåde uden formaldehyd

Info

Publication number
DK0616053T3
DK0616053T3 DK94104003T DK94104003T DK0616053T3 DK 0616053 T3 DK0616053 T3 DK 0616053T3 DK 94104003 T DK94104003 T DK 94104003T DK 94104003 T DK94104003 T DK 94104003T DK 0616053 T3 DK0616053 T3 DK 0616053T3
Authority
DK
Denmark
Prior art keywords
metal
compsn
accelerating
self
formaldehyde
Prior art date
Application number
DK94104003T
Other languages
Danish (da)
English (en)
Inventor
Nayan Harsukhrai Joshi
John Edward Mccaskie
Michael Thomas Boyle
Original Assignee
Atotech Usa Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26711015&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DK0616053(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Atotech Usa Inc filed Critical Atotech Usa Inc
Application granted granted Critical
Publication of DK0616053T3 publication Critical patent/DK0616053T3/da

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/50Electroplating: Baths therefor from solutions of platinum group metals
    • C25D3/52Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/423Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03Metal processing
    • H05K2203/0392Pretreatment of metal, e.g. before finish plating, etching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
DK94104003T 1993-03-18 1994-03-15 Selvaccelererende og genopfyldende neddypningsovertræksfremgangsmåde uden formaldehyd DK0616053T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US3448593A 1993-03-18 1993-03-18
US12145593A 1993-09-16 1993-09-16

Publications (1)

Publication Number Publication Date
DK0616053T3 true DK0616053T3 (da) 2001-06-18

Family

ID=26711015

Family Applications (1)

Application Number Title Priority Date Filing Date
DK94104003T DK0616053T3 (da) 1993-03-18 1994-03-15 Selvaccelererende og genopfyldende neddypningsovertræksfremgangsmåde uden formaldehyd

Country Status (12)

Country Link
US (2) US5543182A (fr)
EP (2) EP0616053B9 (fr)
JP (1) JP3009326B2 (fr)
KR (1) KR100226178B1 (fr)
AT (2) ATE199413T1 (fr)
CA (2) CA2222158C (fr)
CZ (2) CZ287924B6 (fr)
DE (2) DE69426732T3 (fr)
DK (1) DK0616053T3 (fr)
ES (2) ES2155075T3 (fr)
GR (1) GR3035822T3 (fr)
PT (1) PT616053E (fr)

Families Citing this family (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9425031D0 (en) * 1994-12-09 1995-02-08 Alpha Metals Ltd Printed circuit board manufacture
GB9425030D0 (en) 1994-12-09 1995-02-08 Alpha Metals Ltd Silver plating
DE19510855C2 (de) * 1995-03-17 1998-04-30 Atotech Deutschland Gmbh Verfahren zum selektiven oder partiellen elektrolytischen Metallisieren von Substraten aus nichtleitenden Materialien
US6905587B2 (en) 1996-03-22 2005-06-14 Ronald Redline Method for enhancing the solderability of a surface
US6544397B2 (en) 1996-03-22 2003-04-08 Ronald Redline Method for enhancing the solderability of a surface
US5908543A (en) * 1997-02-03 1999-06-01 Okuno Chemical Industries Co., Ltd. Method of electroplating non-conductive materials
JP3208410B2 (ja) 1997-04-07 2001-09-10 奥野製薬工業株式会社 非導電性プラスチック成形品への電気めっき方法
US6121678A (en) 1997-12-19 2000-09-19 Stmicroelectronics, Inc. Wrap-around interconnect for fine pitch ball grid array
US6555170B2 (en) 1998-01-30 2003-04-29 Duratech Industries, Inc. Pre-plate treating system
JP2000096252A (ja) * 1998-09-18 2000-04-04 C Uyemura & Co Ltd ハードディスク基板へのめっき方法
USRE45842E1 (en) 1999-02-17 2016-01-12 Ronald Redline Method for enhancing the solderability of a surface
DE19918833C2 (de) * 1999-04-22 2002-10-31 Atotech Deutschland Gmbh Verfahren zum elektrolytischen Abscheiden einer Metallschicht auf Oberflächen eines elektrisch nichtleitenden Substrats und Anwendung des Verfahrens
TW555892B (en) * 2000-02-08 2003-10-01 Duratech Ind Inc Method of electroplating a substrate
DE10054544A1 (de) 2000-11-01 2002-05-08 Atotech Deutschland Gmbh Verfahren zum chemischen Metallisieren von Oberflächen
KR20030026470A (ko) * 2001-09-25 2003-04-03 전정식 비전도성 물질의 금 도금을 위한 전처리 방법
US6645557B2 (en) 2001-10-17 2003-11-11 Atotech Deutschland Gmbh Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions
US20050006339A1 (en) 2003-07-11 2005-01-13 Peter Mardilovich Electroless deposition methods and systems
US7078816B2 (en) * 2004-03-31 2006-07-18 Endicott Interconnect Technologies, Inc. Circuitized substrate
US20060024481A1 (en) * 2004-07-29 2006-02-02 Eastman Kodak Company Jet printing of patterned metal
CN1876891B (zh) * 2005-06-10 2013-07-03 恩通公司 使不导电基底直接金属化的方法
CN101268142B (zh) 2005-11-30 2012-01-11 大科能树脂有限公司 直接金属镀用树脂组合物、成形品以及金属镀成形品
JP2007239003A (ja) * 2006-03-07 2007-09-20 Univ Nagoya Auメッキ方法及びAuメッキによるAu回路の製造方法
EP1988192B1 (fr) 2007-05-03 2012-12-05 Atotech Deutschland GmbH Procédé d'application d'un revêtement métallique sur un substrat non conducteur
US8877565B2 (en) * 2007-06-28 2014-11-04 Intel Corporation Method of forming a multilayer substrate core structure using sequential microvia laser drilling and substrate core structure formed according to the method
US8440916B2 (en) 2007-06-28 2013-05-14 Intel Corporation Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method
EP2180770A1 (fr) 2008-10-21 2010-04-28 Atotech Deutschland Gmbh Procédé pour la formation de dépôts de soudure sur des substrats
EP2244285A1 (fr) 2009-04-24 2010-10-27 ATOTECH Deutschland GmbH Procédé pour la formation de dépôts de soudure sur des substrats
JP5371393B2 (ja) 2008-11-27 2013-12-18 ユーエムジー・エービーエス株式会社 めっき用樹脂組成物、及び樹脂めっき製品
US8734934B2 (en) * 2008-12-26 2014-05-27 Fujifilm Corporation Surface metal film material, method of producing surface metal film material, method of producing metal pattern material, and metal pattern material
EP2305856A1 (fr) * 2009-09-28 2011-04-06 ATOTECH Deutschland GmbH Processus d'application d'un revêtement métallique sur un substrat non conducteur
PL2360294T3 (pl) 2010-02-12 2013-09-30 Atotech Deutschland Gmbh Sposób metalizowania przedmiotów wykazujących na powierzchni co najmniej dwa różne tworzywa sztuczne
US8497359B2 (en) * 2010-02-26 2013-07-30 Ppg Industries Ohio, Inc. Cationic electrodepositable coating composition comprising lignin
DE102010012204B4 (de) * 2010-03-19 2019-01-24 MacDermid Enthone Inc. (n.d.Ges.d. Staates Delaware) Verbessertes Verfahren zur Direktmetallisierung von nicht leitenden Substraten
EP2405468A1 (fr) 2010-07-05 2012-01-11 ATOTECH Deutschland GmbH Procédé pour la formation de dépôts de soudure sur des substrats
EP2405469B1 (fr) 2010-07-05 2016-09-21 ATOTECH Deutschland GmbH Procédé pour la formation de dépôts d'alliage de soudure sur des substrats
PT2601822T (pt) 2010-08-02 2019-10-28 Atotech Deutschland Gmbh Método para formar depósitos de solda e estruturas protuberantes não fundentes sobre substratos
EP2506690A1 (fr) 2011-03-28 2012-10-03 Atotech Deutschland GmbH Procédé pour la formation de dépôts de soudure et des structures de bosses non fondantes sur des substrats
EP2416634A1 (fr) 2010-08-02 2012-02-08 ATOTECH Deutschland GmbH Procédé pour la formation de dépôts de soudure sur des substrats
WO2012019982A1 (fr) 2010-08-09 2012-02-16 Basf Se Compositions thermoplastiques à mouler ayant une adhérence améliorée sur une couche de métal électroplaquée
KR101842312B1 (ko) 2010-12-16 2018-03-26 이네오스 스티롤루션 유럽 게엠베하 반복된 충격에 대한 개선된 내성을 갖는 금속 도금 물품을 위한 열가소성 성형 조성물
EP2602357A1 (fr) 2011-12-05 2013-06-12 Atotech Deutschland GmbH Nouveaux agents de promotion d'adhésion pour la métallisation des surfaces de substrats
JP6180441B2 (ja) 2012-02-01 2017-08-16 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングAtotech Deutschland GmbH 無電解ニッケルめっき浴
EP2639334A1 (fr) 2012-03-15 2013-09-18 Atotech Deutschland GmbH Procédé de métallisation de surfaces en matière synthétique non conductrices
EP2644744A1 (fr) 2012-03-29 2013-10-02 Atotech Deutschland GmbH Procédé pour favoriser l'adhésion entre des substrats diélectriques et de couches métalliques
EP2709160B1 (fr) 2012-09-14 2016-03-30 ATOTECH Deutschland GmbH Procédé de métallisation de substrats de cellules solaires
JP6035540B2 (ja) 2012-12-21 2016-11-30 奥野製薬工業株式会社 導電性皮膜形成浴
EP3049550B1 (fr) * 2013-09-25 2018-05-23 ATOTECH Deutschland GmbH Procédé de dépôt d'une couche de germe de cuivre sur une couche barrière et bain de cuivrage
KR102378658B1 (ko) 2013-09-26 2022-03-28 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 기판 표면들의 금속화를 위한 신규한 접착 촉진 프로세스
CN105765104A (zh) 2014-01-27 2016-07-13 奥野制药工业株式会社 导电膜形成浴
EP3126547B1 (fr) 2014-04-01 2020-03-04 ATOTECH Deutschland GmbH Composition et procédé de métallisation de surfaces non conductrices en plastique
CN104668232A (zh) * 2015-03-05 2015-06-03 苏州市凯业金属制品有限公司 一种塑胶制品表面处理方法
CN105112966A (zh) * 2015-09-22 2015-12-02 太仓市金鹿电镀有限公司 一种高耐磨洗衣机门圈表面环保塑料电镀工艺
US11032914B2 (en) 2016-12-23 2021-06-08 Atotech Deutschland Gmbh Method of forming a solderable solder deposit on a contact pad
JP2022530669A (ja) 2019-05-01 2022-06-30 フジフイルム エレクトロニック マテリアルズ ユー.エス.エー., インコーポレイテッド エッチング組成物
JP2022536763A (ja) * 2019-06-13 2022-08-18 フジフイルム エレクトロニック マテリアルズ ユー.エス.エー., インコーポレイテッド エッチング組成物
CN111018273A (zh) * 2020-01-16 2020-04-17 泉州南京大学环保产业研究院 一种电催化-生物联合处理甲醛废水的方法

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2702253A (en) 1950-11-01 1955-02-15 Gasaccumulator Svenska Ab Surface metallizing method
US3011920A (en) 1959-06-08 1961-12-05 Shipley Co Method of electroless deposition on a substrate and catalyst solution therefor
US3099608A (en) 1959-12-30 1963-07-30 Ibm Method of electroplating on a dielectric base
US3340164A (en) * 1963-12-26 1967-09-05 Sperry Rand Corp Method of copper plating anodized aluminum
USRE29015E (en) * 1968-04-09 1976-10-26 Western Electric Company, Inc. Method of generating precious metal-reducing patterns
US3748109A (en) 1968-05-06 1973-07-24 Hooker Chemical Corp Conductive designs and process for their manufacture
US3817774A (en) * 1969-08-14 1974-06-18 Macdermid Inc Preparation of plastic substrates for electroless plating
US3682671A (en) 1970-02-05 1972-08-08 Kollmorgen Corp Novel precious metal sensitizing solutions
US3682786A (en) * 1970-02-18 1972-08-08 Macdermid Inc Method of treating plastic substrates and process for plating thereon
US3874882A (en) * 1972-02-09 1975-04-01 Shipley Co Catalyst solution for electroless deposition of metal on substrate
US3904792A (en) * 1972-02-09 1975-09-09 Shipley Co Catalyst solution for electroless metal deposition on a substrate
US3793038A (en) * 1973-01-02 1974-02-19 Crown City Plating Co Process for electroless plating
US4035227A (en) * 1973-09-21 1977-07-12 Oxy Metal Industries Corporation Method for treating plastic substrates prior to plating
US3984290A (en) 1973-10-01 1976-10-05 Georgy Avenirovich Kitaev Method of forming intralayer junctions in a multilayer structure
AT331943B (de) 1973-11-05 1976-08-25 Erz & Stahl Ges M B H Losungsmittel fur lacke
US3962497A (en) * 1975-03-11 1976-06-08 Oxy Metal Industries Corporation Method for treating polymeric substrates prior to plating
US4279948A (en) * 1978-05-25 1981-07-21 Macdermid Incorporated Electroless copper deposition solution using a hypophosphite reducing agent
US4229218A (en) * 1979-02-05 1980-10-21 Shipley Company Inc. Self-monitoring electroless plating solution
US4311551A (en) * 1979-04-12 1982-01-19 Philip A. Hunt Chemical Corp. Composition and method for etching copper substrates
DE3149919A1 (de) * 1981-12-11 1983-06-23 Schering Ag, 1000 Berlin Und 4619 Bergkamen Verfahren zum haftfesten metallisieren von polyimid
US4863758A (en) * 1982-05-26 1989-09-05 Macdermid, Incorporated Catalyst solutions for activating non-conductive substrates and electroless plating process
US4683036A (en) 1983-06-10 1987-07-28 Kollmorgen Technologies Corporation Method for electroplating non-metallic surfaces
US4525390A (en) * 1984-03-09 1985-06-25 International Business Machines Corporation Deposition of copper from electroless plating compositions
US4725314A (en) * 1984-05-07 1988-02-16 Shipley Company Inc. Catalytic metal of reduced particle size
US4617205A (en) * 1984-12-21 1986-10-14 Omi International Corporation Formaldehyde-free autocatalytic electroless copper plating
US4639380A (en) * 1985-05-06 1987-01-27 International Business Machines Corporation Process for preparing a substrate for subsequent electroless deposition of a metal
US5202151A (en) * 1985-10-14 1993-04-13 Hitachi, Ltd. Electroless gold plating solution, method of plating with gold by using the same, and electronic device plated with gold by using the same
US4891069A (en) 1986-06-06 1990-01-02 Techno Instruments Investments 1983 Ltd. Composition for the electrolytic coating of circuit boards without an electroless metal coating
AU7752287A (en) * 1986-08-06 1988-02-24 Macdermid, Inc. Method for manufacture of printed circuit boards
US4751106A (en) * 1986-09-25 1988-06-14 Shipley Company Inc. Metal plating process
US4814009A (en) * 1986-11-14 1989-03-21 Nippondenso Co., Ltd. Electroless copper plating solution
US4810333A (en) 1987-12-14 1989-03-07 Shipley Company Inc. Electroplating process
US4895739A (en) 1988-02-08 1990-01-23 Shipley Company Inc. Pretreatment for electroplating process
US4818286A (en) * 1988-03-08 1989-04-04 International Business Machines Corporation Electroless copper plating bath
US4919768A (en) 1989-09-22 1990-04-24 Shipley Company Inc. Electroplating process
US5071517A (en) 1989-11-21 1991-12-10 Solution Technology Systems Method for directly electroplating a dielectric substrate and plated substrate so produced
US5015339A (en) * 1990-03-26 1991-05-14 Olin Hunt Sub Iii Corp. Process for preparing nonconductive substrates
US5213841A (en) * 1990-05-15 1993-05-25 Shipley Company Inc. Metal accelerator
EP0590046B1 (fr) 1991-06-20 1999-05-06 HARNDEN, Eric F. Solutions d'acceleration basiques pour galvanoplastie directe
JPH0544075A (ja) * 1991-08-15 1993-02-23 Nippon Riironaale Kk 無電解銅めつき代替銅ストライクめつき方法
US5376248A (en) * 1991-10-15 1994-12-27 Enthone-Omi, Inc. Direct metallization process

Also Published As

Publication number Publication date
ATE199413T1 (de) 2001-03-15
CA2222158C (fr) 2001-01-30
EP0616053B3 (fr) 2010-05-05
EP0616053B1 (fr) 2001-02-28
KR100226178B1 (ko) 1999-10-15
EP1054081B1 (fr) 2006-02-01
ES2257987T3 (es) 2006-08-16
EP0616053A1 (fr) 1994-09-21
CA2119050A1 (fr) 1994-09-19
EP1054081A3 (fr) 2001-12-05
DE69426732D1 (de) 2001-04-05
US5543182A (en) 1996-08-06
CZ64194A3 (en) 1995-08-16
EP1054081A2 (fr) 2000-11-22
KR940021765A (ko) 1994-10-19
ES2155075T3 (es) 2001-05-01
DE69434619D1 (de) 2006-04-13
CA2119050C (fr) 1999-11-23
CZ290390B6 (cs) 2002-07-17
EP0616053B9 (fr) 2010-09-15
GR3035822T3 (en) 2001-07-31
ATE317026T1 (de) 2006-02-15
JP3009326B2 (ja) 2000-02-14
DE69426732T3 (de) 2010-11-25
DE69426732T2 (de) 2001-06-13
JPH0711487A (ja) 1995-01-13
US5725640A (en) 1998-03-10
CA2222158A1 (fr) 1994-09-19
DE69434619T2 (de) 2006-08-17
PT616053E (pt) 2001-07-31
CZ287924B6 (cs) 2001-03-14

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