DK0616053T3 - Selvaccelererende og genopfyldende neddypningsovertræksfremgangsmåde uden formaldehyd - Google Patents
Selvaccelererende og genopfyldende neddypningsovertræksfremgangsmåde uden formaldehydInfo
- Publication number
- DK0616053T3 DK0616053T3 DK94104003T DK94104003T DK0616053T3 DK 0616053 T3 DK0616053 T3 DK 0616053T3 DK 94104003 T DK94104003 T DK 94104003T DK 94104003 T DK94104003 T DK 94104003T DK 0616053 T3 DK0616053 T3 DK 0616053T3
- Authority
- DK
- Denmark
- Prior art keywords
- metal
- compsn
- accelerating
- self
- formaldehyde
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
- C25D3/52—Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Phenolic Resins Or Amino Resins (AREA)
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Electrodes Of Semiconductors (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US3448593A | 1993-03-18 | 1993-03-18 | |
US12145593A | 1993-09-16 | 1993-09-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
DK0616053T3 true DK0616053T3 (da) | 2001-06-18 |
Family
ID=26711015
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK94104003T DK0616053T3 (da) | 1993-03-18 | 1994-03-15 | Selvaccelererende og genopfyldende neddypningsovertræksfremgangsmåde uden formaldehyd |
Country Status (12)
Country | Link |
---|---|
US (2) | US5543182A (fr) |
EP (2) | EP0616053B9 (fr) |
JP (1) | JP3009326B2 (fr) |
KR (1) | KR100226178B1 (fr) |
AT (2) | ATE199413T1 (fr) |
CA (2) | CA2222158C (fr) |
CZ (2) | CZ287924B6 (fr) |
DE (2) | DE69426732T3 (fr) |
DK (1) | DK0616053T3 (fr) |
ES (2) | ES2155075T3 (fr) |
GR (1) | GR3035822T3 (fr) |
PT (1) | PT616053E (fr) |
Families Citing this family (56)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB9425031D0 (en) * | 1994-12-09 | 1995-02-08 | Alpha Metals Ltd | Printed circuit board manufacture |
GB9425030D0 (en) | 1994-12-09 | 1995-02-08 | Alpha Metals Ltd | Silver plating |
DE19510855C2 (de) * | 1995-03-17 | 1998-04-30 | Atotech Deutschland Gmbh | Verfahren zum selektiven oder partiellen elektrolytischen Metallisieren von Substraten aus nichtleitenden Materialien |
US6905587B2 (en) | 1996-03-22 | 2005-06-14 | Ronald Redline | Method for enhancing the solderability of a surface |
US6544397B2 (en) | 1996-03-22 | 2003-04-08 | Ronald Redline | Method for enhancing the solderability of a surface |
US5908543A (en) * | 1997-02-03 | 1999-06-01 | Okuno Chemical Industries Co., Ltd. | Method of electroplating non-conductive materials |
JP3208410B2 (ja) | 1997-04-07 | 2001-09-10 | 奥野製薬工業株式会社 | 非導電性プラスチック成形品への電気めっき方法 |
US6121678A (en) | 1997-12-19 | 2000-09-19 | Stmicroelectronics, Inc. | Wrap-around interconnect for fine pitch ball grid array |
US6555170B2 (en) | 1998-01-30 | 2003-04-29 | Duratech Industries, Inc. | Pre-plate treating system |
JP2000096252A (ja) * | 1998-09-18 | 2000-04-04 | C Uyemura & Co Ltd | ハードディスク基板へのめっき方法 |
USRE45842E1 (en) | 1999-02-17 | 2016-01-12 | Ronald Redline | Method for enhancing the solderability of a surface |
DE19918833C2 (de) * | 1999-04-22 | 2002-10-31 | Atotech Deutschland Gmbh | Verfahren zum elektrolytischen Abscheiden einer Metallschicht auf Oberflächen eines elektrisch nichtleitenden Substrats und Anwendung des Verfahrens |
TW555892B (en) * | 2000-02-08 | 2003-10-01 | Duratech Ind Inc | Method of electroplating a substrate |
DE10054544A1 (de) | 2000-11-01 | 2002-05-08 | Atotech Deutschland Gmbh | Verfahren zum chemischen Metallisieren von Oberflächen |
KR20030026470A (ko) * | 2001-09-25 | 2003-04-03 | 전정식 | 비전도성 물질의 금 도금을 위한 전처리 방법 |
US6645557B2 (en) | 2001-10-17 | 2003-11-11 | Atotech Deutschland Gmbh | Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions |
US20050006339A1 (en) | 2003-07-11 | 2005-01-13 | Peter Mardilovich | Electroless deposition methods and systems |
US7078816B2 (en) * | 2004-03-31 | 2006-07-18 | Endicott Interconnect Technologies, Inc. | Circuitized substrate |
US20060024481A1 (en) * | 2004-07-29 | 2006-02-02 | Eastman Kodak Company | Jet printing of patterned metal |
CN1876891B (zh) * | 2005-06-10 | 2013-07-03 | 恩通公司 | 使不导电基底直接金属化的方法 |
CN101268142B (zh) | 2005-11-30 | 2012-01-11 | 大科能树脂有限公司 | 直接金属镀用树脂组合物、成形品以及金属镀成形品 |
JP2007239003A (ja) * | 2006-03-07 | 2007-09-20 | Univ Nagoya | Auメッキ方法及びAuメッキによるAu回路の製造方法 |
EP1988192B1 (fr) | 2007-05-03 | 2012-12-05 | Atotech Deutschland GmbH | Procédé d'application d'un revêtement métallique sur un substrat non conducteur |
US8877565B2 (en) * | 2007-06-28 | 2014-11-04 | Intel Corporation | Method of forming a multilayer substrate core structure using sequential microvia laser drilling and substrate core structure formed according to the method |
US8440916B2 (en) | 2007-06-28 | 2013-05-14 | Intel Corporation | Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method |
EP2180770A1 (fr) | 2008-10-21 | 2010-04-28 | Atotech Deutschland Gmbh | Procédé pour la formation de dépôts de soudure sur des substrats |
EP2244285A1 (fr) | 2009-04-24 | 2010-10-27 | ATOTECH Deutschland GmbH | Procédé pour la formation de dépôts de soudure sur des substrats |
JP5371393B2 (ja) | 2008-11-27 | 2013-12-18 | ユーエムジー・エービーエス株式会社 | めっき用樹脂組成物、及び樹脂めっき製品 |
US8734934B2 (en) * | 2008-12-26 | 2014-05-27 | Fujifilm Corporation | Surface metal film material, method of producing surface metal film material, method of producing metal pattern material, and metal pattern material |
EP2305856A1 (fr) * | 2009-09-28 | 2011-04-06 | ATOTECH Deutschland GmbH | Processus d'application d'un revêtement métallique sur un substrat non conducteur |
PL2360294T3 (pl) | 2010-02-12 | 2013-09-30 | Atotech Deutschland Gmbh | Sposób metalizowania przedmiotów wykazujących na powierzchni co najmniej dwa różne tworzywa sztuczne |
US8497359B2 (en) * | 2010-02-26 | 2013-07-30 | Ppg Industries Ohio, Inc. | Cationic electrodepositable coating composition comprising lignin |
DE102010012204B4 (de) * | 2010-03-19 | 2019-01-24 | MacDermid Enthone Inc. (n.d.Ges.d. Staates Delaware) | Verbessertes Verfahren zur Direktmetallisierung von nicht leitenden Substraten |
EP2405468A1 (fr) | 2010-07-05 | 2012-01-11 | ATOTECH Deutschland GmbH | Procédé pour la formation de dépôts de soudure sur des substrats |
EP2405469B1 (fr) | 2010-07-05 | 2016-09-21 | ATOTECH Deutschland GmbH | Procédé pour la formation de dépôts d'alliage de soudure sur des substrats |
PT2601822T (pt) | 2010-08-02 | 2019-10-28 | Atotech Deutschland Gmbh | Método para formar depósitos de solda e estruturas protuberantes não fundentes sobre substratos |
EP2506690A1 (fr) | 2011-03-28 | 2012-10-03 | Atotech Deutschland GmbH | Procédé pour la formation de dépôts de soudure et des structures de bosses non fondantes sur des substrats |
EP2416634A1 (fr) | 2010-08-02 | 2012-02-08 | ATOTECH Deutschland GmbH | Procédé pour la formation de dépôts de soudure sur des substrats |
WO2012019982A1 (fr) | 2010-08-09 | 2012-02-16 | Basf Se | Compositions thermoplastiques à mouler ayant une adhérence améliorée sur une couche de métal électroplaquée |
KR101842312B1 (ko) | 2010-12-16 | 2018-03-26 | 이네오스 스티롤루션 유럽 게엠베하 | 반복된 충격에 대한 개선된 내성을 갖는 금속 도금 물품을 위한 열가소성 성형 조성물 |
EP2602357A1 (fr) | 2011-12-05 | 2013-06-12 | Atotech Deutschland GmbH | Nouveaux agents de promotion d'adhésion pour la métallisation des surfaces de substrats |
JP6180441B2 (ja) | 2012-02-01 | 2017-08-16 | アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングAtotech Deutschland GmbH | 無電解ニッケルめっき浴 |
EP2639334A1 (fr) | 2012-03-15 | 2013-09-18 | Atotech Deutschland GmbH | Procédé de métallisation de surfaces en matière synthétique non conductrices |
EP2644744A1 (fr) | 2012-03-29 | 2013-10-02 | Atotech Deutschland GmbH | Procédé pour favoriser l'adhésion entre des substrats diélectriques et de couches métalliques |
EP2709160B1 (fr) | 2012-09-14 | 2016-03-30 | ATOTECH Deutschland GmbH | Procédé de métallisation de substrats de cellules solaires |
JP6035540B2 (ja) | 2012-12-21 | 2016-11-30 | 奥野製薬工業株式会社 | 導電性皮膜形成浴 |
EP3049550B1 (fr) * | 2013-09-25 | 2018-05-23 | ATOTECH Deutschland GmbH | Procédé de dépôt d'une couche de germe de cuivre sur une couche barrière et bain de cuivrage |
KR102378658B1 (ko) | 2013-09-26 | 2022-03-28 | 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 | 기판 표면들의 금속화를 위한 신규한 접착 촉진 프로세스 |
CN105765104A (zh) | 2014-01-27 | 2016-07-13 | 奥野制药工业株式会社 | 导电膜形成浴 |
EP3126547B1 (fr) | 2014-04-01 | 2020-03-04 | ATOTECH Deutschland GmbH | Composition et procédé de métallisation de surfaces non conductrices en plastique |
CN104668232A (zh) * | 2015-03-05 | 2015-06-03 | 苏州市凯业金属制品有限公司 | 一种塑胶制品表面处理方法 |
CN105112966A (zh) * | 2015-09-22 | 2015-12-02 | 太仓市金鹿电镀有限公司 | 一种高耐磨洗衣机门圈表面环保塑料电镀工艺 |
US11032914B2 (en) | 2016-12-23 | 2021-06-08 | Atotech Deutschland Gmbh | Method of forming a solderable solder deposit on a contact pad |
JP2022530669A (ja) | 2019-05-01 | 2022-06-30 | フジフイルム エレクトロニック マテリアルズ ユー.エス.エー., インコーポレイテッド | エッチング組成物 |
JP2022536763A (ja) * | 2019-06-13 | 2022-08-18 | フジフイルム エレクトロニック マテリアルズ ユー.エス.エー., インコーポレイテッド | エッチング組成物 |
CN111018273A (zh) * | 2020-01-16 | 2020-04-17 | 泉州南京大学环保产业研究院 | 一种电催化-生物联合处理甲醛废水的方法 |
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DE3149919A1 (de) * | 1981-12-11 | 1983-06-23 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Verfahren zum haftfesten metallisieren von polyimid |
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-
1994
- 1994-03-15 EP EP94104003A patent/EP0616053B9/fr not_active Expired - Lifetime
- 1994-03-15 ES ES94104003T patent/ES2155075T3/es not_active Expired - Lifetime
- 1994-03-15 PT PT94104003T patent/PT616053E/pt unknown
- 1994-03-15 DK DK94104003T patent/DK0616053T3/da active
- 1994-03-15 CA CA002222158A patent/CA2222158C/fr not_active Expired - Lifetime
- 1994-03-15 ES ES00117279T patent/ES2257987T3/es not_active Expired - Lifetime
- 1994-03-15 EP EP00117279A patent/EP1054081B1/fr not_active Expired - Lifetime
- 1994-03-15 DE DE69426732T patent/DE69426732T3/de not_active Expired - Lifetime
- 1994-03-15 DE DE69434619T patent/DE69434619T2/de not_active Expired - Lifetime
- 1994-03-15 AT AT94104003T patent/ATE199413T1/de active
- 1994-03-15 AT AT00117279T patent/ATE317026T1/de not_active IP Right Cessation
- 1994-03-15 CA CA002119050A patent/CA2119050C/fr not_active Expired - Lifetime
- 1994-03-17 KR KR1019940005301A patent/KR100226178B1/ko not_active IP Right Cessation
- 1994-03-18 JP JP6072801A patent/JP3009326B2/ja not_active Expired - Lifetime
- 1994-03-18 CZ CZ1994641A patent/CZ287924B6/cs not_active IP Right Cessation
-
1995
- 1995-02-16 US US08/389,565 patent/US5543182A/en not_active Expired - Lifetime
-
1996
- 1996-05-14 US US08/645,743 patent/US5725640A/en not_active Expired - Lifetime
-
2000
- 2000-08-30 CZ CZ20003161A patent/CZ290390B6/cs not_active IP Right Cessation
-
2001
- 2001-04-30 GR GR20010400670T patent/GR3035822T3/el unknown
Also Published As
Publication number | Publication date |
---|---|
ATE199413T1 (de) | 2001-03-15 |
CA2222158C (fr) | 2001-01-30 |
EP0616053B3 (fr) | 2010-05-05 |
EP0616053B1 (fr) | 2001-02-28 |
KR100226178B1 (ko) | 1999-10-15 |
EP1054081B1 (fr) | 2006-02-01 |
ES2257987T3 (es) | 2006-08-16 |
EP0616053A1 (fr) | 1994-09-21 |
CA2119050A1 (fr) | 1994-09-19 |
EP1054081A3 (fr) | 2001-12-05 |
DE69426732D1 (de) | 2001-04-05 |
US5543182A (en) | 1996-08-06 |
CZ64194A3 (en) | 1995-08-16 |
EP1054081A2 (fr) | 2000-11-22 |
KR940021765A (ko) | 1994-10-19 |
ES2155075T3 (es) | 2001-05-01 |
DE69434619D1 (de) | 2006-04-13 |
CA2119050C (fr) | 1999-11-23 |
CZ290390B6 (cs) | 2002-07-17 |
EP0616053B9 (fr) | 2010-09-15 |
GR3035822T3 (en) | 2001-07-31 |
ATE317026T1 (de) | 2006-02-15 |
JP3009326B2 (ja) | 2000-02-14 |
DE69426732T3 (de) | 2010-11-25 |
DE69426732T2 (de) | 2001-06-13 |
JPH0711487A (ja) | 1995-01-13 |
US5725640A (en) | 1998-03-10 |
CA2222158A1 (fr) | 1994-09-19 |
DE69434619T2 (de) | 2006-08-17 |
PT616053E (pt) | 2001-07-31 |
CZ287924B6 (cs) | 2001-03-14 |
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