EP2305856A1 - Processus d'application d'un revêtement métallique sur un substrat non conducteur - Google Patents

Processus d'application d'un revêtement métallique sur un substrat non conducteur Download PDF

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Publication number
EP2305856A1
EP2305856A1 EP09171442A EP09171442A EP2305856A1 EP 2305856 A1 EP2305856 A1 EP 2305856A1 EP 09171442 A EP09171442 A EP 09171442A EP 09171442 A EP09171442 A EP 09171442A EP 2305856 A1 EP2305856 A1 EP 2305856A1
Authority
EP
European Patent Office
Prior art keywords
metal
substrate
solution
process according
foregoing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09171442A
Other languages
German (de)
English (en)
Inventor
Ke Liang Pan
Wei Jie Wu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Priority to EP09171442A priority Critical patent/EP2305856A1/fr
Priority to US13/394,165 priority patent/US20120160697A1/en
Priority to KR1020127007986A priority patent/KR20120081107A/ko
Priority to CN201080043209.6A priority patent/CN102549196B/zh
Priority to PCT/EP2010/005851 priority patent/WO2011035921A1/fr
Priority to EP10759590A priority patent/EP2483443A1/fr
Priority to TW099132257A priority patent/TW201120254A/zh
Publication of EP2305856A1 publication Critical patent/EP2305856A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
EP09171442A 2009-09-28 2009-09-28 Processus d'application d'un revêtement métallique sur un substrat non conducteur Withdrawn EP2305856A1 (fr)

Priority Applications (7)

Application Number Priority Date Filing Date Title
EP09171442A EP2305856A1 (fr) 2009-09-28 2009-09-28 Processus d'application d'un revêtement métallique sur un substrat non conducteur
US13/394,165 US20120160697A1 (en) 2009-09-28 2010-09-22 Process for applying a metal coating to a non-conductive substrate
KR1020127007986A KR20120081107A (ko) 2009-09-28 2010-09-22 비전도성 기판에 금속 코팅을 적용하기 위한 프로세스
CN201080043209.6A CN102549196B (zh) 2009-09-28 2010-09-22 用于将金属涂层施加到非电导性基体上的方法
PCT/EP2010/005851 WO2011035921A1 (fr) 2009-09-28 2010-09-22 Procédé d'application de revêtement métallique sur un substrat non conducteur
EP10759590A EP2483443A1 (fr) 2009-09-28 2010-09-22 Procédé d'application de revêtement métallique sur un substrat non conducteur
TW099132257A TW201120254A (en) 2009-09-28 2010-09-23 Process for applying a metal coating to a non-conductive substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP09171442A EP2305856A1 (fr) 2009-09-28 2009-09-28 Processus d'application d'un revêtement métallique sur un substrat non conducteur

Publications (1)

Publication Number Publication Date
EP2305856A1 true EP2305856A1 (fr) 2011-04-06

Family

ID=41698392

Family Applications (2)

Application Number Title Priority Date Filing Date
EP09171442A Withdrawn EP2305856A1 (fr) 2009-09-28 2009-09-28 Processus d'application d'un revêtement métallique sur un substrat non conducteur
EP10759590A Withdrawn EP2483443A1 (fr) 2009-09-28 2010-09-22 Procédé d'application de revêtement métallique sur un substrat non conducteur

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP10759590A Withdrawn EP2483443A1 (fr) 2009-09-28 2010-09-22 Procédé d'application de revêtement métallique sur un substrat non conducteur

Country Status (6)

Country Link
US (1) US20120160697A1 (fr)
EP (2) EP2305856A1 (fr)
KR (1) KR20120081107A (fr)
CN (1) CN102549196B (fr)
TW (1) TW201120254A (fr)
WO (1) WO2011035921A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2305856A1 (fr) * 2009-09-28 2011-04-06 ATOTECH Deutschland GmbH Processus d'application d'un revêtement métallique sur un substrat non conducteur
EP2639333A1 (fr) * 2012-03-15 2013-09-18 Atotech Deutschland GmbH Procédé de métallisation de surfaces en matière synthétique non conductrices
US20150285756A1 (en) * 2014-04-02 2015-10-08 King Fahd University Of Petroleum And Minerals Pencil graphite electrode modified with porous copper for nitrophenol electrochemical detection
JP2018512719A (ja) * 2015-03-19 2018-05-17 プリマス パワー コーポレイション キレート剤および金属めっき促進剤を含むフロー電池電解質組成物
US11035051B2 (en) * 2016-08-15 2021-06-15 Atotech Deutschland Gmbh Acidic aqueous composition for electrolytic copper plating
FR3061601B1 (fr) * 2016-12-29 2022-12-30 Aveni Solution d'electrodeposition de cuivre et procede pour des motifs de facteur de forme eleve
CN110952118A (zh) * 2019-11-20 2020-04-03 中电国基南方集团有限公司 一种陶瓷电路无氰镀铜溶液、配制方法及电镀工艺

Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3011920A (en) 1959-06-08 1961-12-05 Shipley Co Method of electroless deposition on a substrate and catalyst solution therefor
US3682671A (en) 1970-02-05 1972-08-08 Kollmorgen Corp Novel precious metal sensitizing solutions
US3984290A (en) 1973-10-01 1976-10-05 Georgy Avenirovich Kitaev Method of forming intralayer junctions in a multilayer structure
US4005051A (en) 1973-11-05 1977-01-25 Josef Klemens Brunner Water-compatible solvents for film-forming resins and resin solutions made therewith
US4671968A (en) * 1985-04-01 1987-06-09 Macdermid, Incorporated Method for electroless deposition of copper on conductive surfaces and on substrates containing conductive surfaces
EP0298298A2 (fr) 1987-07-10 1989-01-11 Shipley Company Inc. Procédé d'électroplacage et pièce obtenne
EP0320601A2 (fr) 1987-12-14 1989-06-21 Shipley Company Inc. Procédé d'électroplacage
WO1989008375A1 (fr) 1988-03-03 1989-09-08 Blasberg-Oberflächentechnik Gmbh Nouvelle carte de circuits imprimes a trous metallises et procede de fabrication d'une telle carte
US4919768A (en) 1989-09-22 1990-04-24 Shipley Company Inc. Electroplating process
US4938853A (en) * 1989-05-10 1990-07-03 Macdermid, Incorporated Electrolytic method for the dissolution of copper particles formed during electroless copper deposition
EP0456982A1 (fr) 1990-05-15 1991-11-21 Shipley Company Inc. Nouvel accélérateur métallique
EP0616053A1 (fr) 1993-03-18 1994-09-21 Atotech Usa, Inc. Bain de revêtement par immersion sans formaldéhyde, auto-accélérant et auto-rajeunissant, méthode et composition
WO1996029452A1 (fr) 1995-03-17 1996-09-26 Atotech Deutschland Gmbh Procede de metallisation electrolytique selective ou partielle de surfaces de substrats composes de materiaux non conducteurs
DE19850359A1 (de) 1998-11-02 2000-05-04 Bayer Ag Verfahren zur Herstellung von Asparaginsäurederivaten
US20020079226A1 (en) * 1999-04-06 2002-06-27 Daiwa Fine Chemicals Co., Ltd. Plating method and plating bath precursor used therefor
EP1988192A1 (fr) * 2007-05-03 2008-11-05 Atotech Deutschland Gmbh Procédé d'application d'un revêtement métallique sur un substrat non conducteur

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2836510A (en) * 1953-05-21 1958-05-27 Gen Motors Corp Nickel plating by chemical reduction
ZA834937B (en) * 1983-01-17 1984-03-28 Kollmorgen Tech Corp Edtp-containing electroless copper baths
JPH0633499B2 (ja) * 1988-12-27 1994-05-02 上村工業株式会社 非導電体へのめっき方法
JPH0544075A (ja) * 1991-08-15 1993-02-23 Nippon Riironaale Kk 無電解銅めつき代替銅ストライクめつき方法
US5376248A (en) * 1991-10-15 1994-12-27 Enthone-Omi, Inc. Direct metallization process
EP1734156B1 (fr) * 2005-06-10 2017-03-01 Enthone, Inc. Procédé de métallisation directe des substrat non-conductive
EP2305856A1 (fr) * 2009-09-28 2011-04-06 ATOTECH Deutschland GmbH Processus d'application d'un revêtement métallique sur un substrat non conducteur

Patent Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3011920A (en) 1959-06-08 1961-12-05 Shipley Co Method of electroless deposition on a substrate and catalyst solution therefor
US3682671A (en) 1970-02-05 1972-08-08 Kollmorgen Corp Novel precious metal sensitizing solutions
US3984290A (en) 1973-10-01 1976-10-05 Georgy Avenirovich Kitaev Method of forming intralayer junctions in a multilayer structure
US4005051A (en) 1973-11-05 1977-01-25 Josef Klemens Brunner Water-compatible solvents for film-forming resins and resin solutions made therewith
US4671968A (en) * 1985-04-01 1987-06-09 Macdermid, Incorporated Method for electroless deposition of copper on conductive surfaces and on substrates containing conductive surfaces
EP0298298A2 (fr) 1987-07-10 1989-01-11 Shipley Company Inc. Procédé d'électroplacage et pièce obtenne
EP0320601A2 (fr) 1987-12-14 1989-06-21 Shipley Company Inc. Procédé d'électroplacage
WO1989008375A1 (fr) 1988-03-03 1989-09-08 Blasberg-Oberflächentechnik Gmbh Nouvelle carte de circuits imprimes a trous metallises et procede de fabrication d'une telle carte
US4938853A (en) * 1989-05-10 1990-07-03 Macdermid, Incorporated Electrolytic method for the dissolution of copper particles formed during electroless copper deposition
US4919768A (en) 1989-09-22 1990-04-24 Shipley Company Inc. Electroplating process
EP0456982A1 (fr) 1990-05-15 1991-11-21 Shipley Company Inc. Nouvel accélérateur métallique
EP0616053A1 (fr) 1993-03-18 1994-09-21 Atotech Usa, Inc. Bain de revêtement par immersion sans formaldéhyde, auto-accélérant et auto-rajeunissant, méthode et composition
WO1996029452A1 (fr) 1995-03-17 1996-09-26 Atotech Deutschland Gmbh Procede de metallisation electrolytique selective ou partielle de surfaces de substrats composes de materiaux non conducteurs
DE19850359A1 (de) 1998-11-02 2000-05-04 Bayer Ag Verfahren zur Herstellung von Asparaginsäurederivaten
WO2000026398A1 (fr) 1998-11-02 2000-05-11 Bayer Aktiengesellschaft Procede pour la production de derives d'acide aspartique
US20020079226A1 (en) * 1999-04-06 2002-06-27 Daiwa Fine Chemicals Co., Ltd. Plating method and plating bath precursor used therefor
EP1988192A1 (fr) * 2007-05-03 2008-11-05 Atotech Deutschland Gmbh Procédé d'application d'un revêtement métallique sur un substrat non conducteur
WO2008135179A1 (fr) 2007-05-03 2008-11-13 Atotech Deutschland Gmbh Procédé d'application d'une couche métallique sur un substrat non-conducteur

Also Published As

Publication number Publication date
EP2483443A1 (fr) 2012-08-08
KR20120081107A (ko) 2012-07-18
WO2011035921A1 (fr) 2011-03-31
US20120160697A1 (en) 2012-06-28
TW201120254A (en) 2011-06-16
CN102549196B (zh) 2015-07-22
CN102549196A (zh) 2012-07-04

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