DE8801970U1 - Kontaktvorrichtung - Google Patents

Kontaktvorrichtung

Info

Publication number
DE8801970U1
DE8801970U1 DE8801970U DE8801970U DE8801970U1 DE 8801970 U1 DE8801970 U1 DE 8801970U1 DE 8801970 U DE8801970 U DE 8801970U DE 8801970 U DE8801970 U DE 8801970U DE 8801970 U1 DE8801970 U1 DE 8801970U1
Authority
DE
Germany
Prior art keywords
contact device
insulating plate
conductor tracks
contact
contact surfaces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8801970U
Other languages
German (de)
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE8801970U priority Critical patent/DE8801970U1/de
Publication of DE8801970U1 publication Critical patent/DE8801970U1/de
Priority to DE3904542A priority patent/DE3904542C2/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R31/00—Coupling parts supported only by co-operation with counterpart
    • H01R31/02—Intermediate parts for distributing energy to two or more circuits in parallel, e.g. splitter
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09172—Notches between edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10704—Pin grid array [PGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
DE8801970U 1988-02-16 1988-02-16 Kontaktvorrichtung Expired DE8801970U1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE8801970U DE8801970U1 (de) 1988-02-16 1988-02-16 Kontaktvorrichtung
DE3904542A DE3904542C2 (de) 1988-02-16 1989-02-15 Kontaktvorrichtung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE8801970U DE8801970U1 (de) 1988-02-16 1988-02-16 Kontaktvorrichtung

Publications (1)

Publication Number Publication Date
DE8801970U1 true DE8801970U1 (de) 1988-04-14

Family

ID=6820714

Family Applications (2)

Application Number Title Priority Date Filing Date
DE8801970U Expired DE8801970U1 (de) 1988-02-16 1988-02-16 Kontaktvorrichtung
DE3904542A Expired - Fee Related DE3904542C2 (de) 1988-02-16 1989-02-15 Kontaktvorrichtung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE3904542A Expired - Fee Related DE3904542C2 (de) 1988-02-16 1989-02-15 Kontaktvorrichtung

Country Status (1)

Country Link
DE (2) DE8801970U1 (ru)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0378016A1 (fr) * 1988-12-09 1990-07-18 Thomson-Csf Dispositif de raccordement de composants et module fonctionnel l'utilisant
EP0395609A1 (en) * 1989-04-12 1990-10-31 Nokia Mobile Phones Ltd. Surface connector for radio frequency signals

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10316512A1 (de) * 2003-04-09 2004-10-21 Werma Signaltechnik Gmbh + Co. Kg Signalgerät

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2830918A (en) * 1952-07-05 1958-04-15 Motorola Inc Printed circuit panel
DE6901829U (de) * 1969-01-18 1969-07-03 Licentia Isolierstoffplatte mit beidseitig aufgebrachten elektrisch leitenden bahnen
DE1933731A1 (de) * 1968-07-05 1970-02-12 Gen Electric Information Syste Verbindungselemente fuer Halbleiterschaltungselemente und integrierte Schaltungsanordnungen
DE1952569A1 (de) * 1968-10-24 1970-05-06 Texas Instruments Inc Traeger fuer elektrische Bauteile und integrierte Schaltungen
DE1765092C (de) * 1972-06-08 International Standard Electric Corp., New York, N.Y. (V.StA.) Verfahren zur Herstellung von Randverbindungen
DE2722736A1 (de) * 1977-05-17 1978-11-23 Auergesellschaft Gmbh Mehrpolige anschlussleiste
DE7903833U1 (de) * 1979-02-12 1979-10-25 Felten & Guilleaume Carlswerk Ag, 5000 Koeln Gelochte Metallplatte mit einem isolierenden Überzug zur Herstellung gedruckter Schaltungen im Additiwerfahren
DE8206855U1 (de) * 1982-03-11 1982-07-08 Siemens AG, 1000 Berlin und 8000 München Leiterplatte mit in den bohrungen der leiterplatte verloeteten bauelement-anschluessen
US4366342A (en) * 1978-06-21 1982-12-28 Minnesota Mining And Manufacturing Company Conductively coated embossed articles
DE3531235A1 (de) * 1984-09-25 1986-04-03 VEB Kombinat Robotron, DDR 8010 Dresden Kompaktschaltungsanordnung und verfahren zur behuegelung

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3741827A1 (de) * 1987-12-10 1989-06-22 Adtec Soft Und Hardware Entwic Vorrichtung zum verbinden eines steckersockels mit mehreren inneren kontaktfahnen mit einem testgeraet

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1765092C (de) * 1972-06-08 International Standard Electric Corp., New York, N.Y. (V.StA.) Verfahren zur Herstellung von Randverbindungen
US2830918A (en) * 1952-07-05 1958-04-15 Motorola Inc Printed circuit panel
DE1933731A1 (de) * 1968-07-05 1970-02-12 Gen Electric Information Syste Verbindungselemente fuer Halbleiterschaltungselemente und integrierte Schaltungsanordnungen
DE1952569A1 (de) * 1968-10-24 1970-05-06 Texas Instruments Inc Traeger fuer elektrische Bauteile und integrierte Schaltungen
DE6901829U (de) * 1969-01-18 1969-07-03 Licentia Isolierstoffplatte mit beidseitig aufgebrachten elektrisch leitenden bahnen
DE2722736A1 (de) * 1977-05-17 1978-11-23 Auergesellschaft Gmbh Mehrpolige anschlussleiste
US4366342A (en) * 1978-06-21 1982-12-28 Minnesota Mining And Manufacturing Company Conductively coated embossed articles
DE7903833U1 (de) * 1979-02-12 1979-10-25 Felten & Guilleaume Carlswerk Ag, 5000 Koeln Gelochte Metallplatte mit einem isolierenden Überzug zur Herstellung gedruckter Schaltungen im Additiwerfahren
DE8206855U1 (de) * 1982-03-11 1982-07-08 Siemens AG, 1000 Berlin und 8000 München Leiterplatte mit in den bohrungen der leiterplatte verloeteten bauelement-anschluessen
DE3531235A1 (de) * 1984-09-25 1986-04-03 VEB Kombinat Robotron, DDR 8010 Dresden Kompaktschaltungsanordnung und verfahren zur behuegelung

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0378016A1 (fr) * 1988-12-09 1990-07-18 Thomson-Csf Dispositif de raccordement de composants et module fonctionnel l'utilisant
EP0395609A1 (en) * 1989-04-12 1990-10-31 Nokia Mobile Phones Ltd. Surface connector for radio frequency signals

Also Published As

Publication number Publication date
DE3904542C2 (de) 1998-07-23
DE3904542A1 (de) 1989-09-28

Similar Documents

Publication Publication Date Title
DE2242337C2 (de) Vorrichtung zur Halterung von Schaltungskarten
DE69314955T2 (de) Anordnung einer bildwandlereinheit.
DE69400655T2 (de) Haltesystem für leiterplattemontierte elektrische Verbinder
DE3600361A1 (de) Substrathalter in integralbauweise
DE2051228B2 (de) Steckfassung für einen integrierten Schaltungsmodul
EP0092086B1 (de) Anschlussvorrichtung für ein plattenförmiges elektrisches Gerät
EP0144923A2 (de) Frontplatten-Einbaubaugruppe für eine Leiterplatte
DE69609009T2 (de) Verbinder hoher Geschwindigkeit ind hoher Dichte für elektronische Signale
DE2441405A1 (de) Verfahren und vorrichtung zum verbinden der anschluesse von ic-bausteinen mit gedruckten schaltungen
DE8801970U1 (de) Kontaktvorrichtung
DE1934752A1 (de) Pruefadapter fuer elektrische Bausteine
DE10100081B4 (de) Elektrische Klemme zur Bildung eines Klemmenblocks oder einer Klemmenleiste
DE9013456U1 (de) Leiterplatine mit Verbindungselementen für eine Steckverbindung
DE3624682C2 (ru)
DE2332556C2 (de) Steckkontaktverbindung
DE2525864C3 (de) Anordnung zur Erhöhung der Kontaktanzahl bei Steckverbindern von steckbaren Flachbaugruppen
DE68922664T2 (de) Ausrichtungssystem für gedruckte Schaltungskarten.
DE69801576T2 (de) Unter 45 grad gebogene elektronische platte
EP0249646A1 (de) Leiterplattenanschlussklemme
DE3200729C2 (de) Einrichtung zur Befestigung von Leiterplatten in einem Trägerrahmen
DE2714563C2 (de) Baugruppenträger
DE10342047A1 (de) Elektrisches Verbindungselement
BE1025656B1 (de) Lötkontakt und Kontaktmodul und Verfahren zur Herstellung eines Kontaktmoduls
DE3730203C2 (de) Lagesicherungselement für Bauteile
DE102022122933A1 (de) Elektronikmodul mit integrierter Leiterplattenaufnahme zur Kontaktierung zumindest eines Drahtes mit einer in der Leiterplattenaufnahme anordenbaren Leiterplatte sowie zugehöriges Verfahren