DE7119711U - Halbleiterbauelement - Google Patents

Halbleiterbauelement

Info

Publication number
DE7119711U
DE7119711U DE19717119711U DE7119711U DE7119711U DE 7119711 U DE7119711 U DE 7119711U DE 19717119711 U DE19717119711 U DE 19717119711U DE 7119711 U DE7119711 U DE 7119711U DE 7119711 U DE7119711 U DE 7119711U
Authority
DE
Germany
Prior art keywords
insulating body
semiconductor component
component according
semiconductor
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE19717119711U
Other languages
German (de)
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of DE7119711U publication Critical patent/DE7119711U/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type

Landscapes

  • Die Bonding (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Thyristors (AREA)
DE19717119711U 1970-05-22 1971-05-21 Halbleiterbauelement Expired DE7119711U (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US3965070A 1970-05-22 1970-05-22

Publications (1)

Publication Number Publication Date
DE7119711U true DE7119711U (de) 1972-02-03

Family

ID=21906611

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19717119711U Expired DE7119711U (de) 1970-05-22 1971-05-21 Halbleiterbauelement
DE19712125106 Pending DE2125106A1 (de) 1970-05-22 1971-05-21 Halbleiterbauelement

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE19712125106 Pending DE2125106A1 (de) 1970-05-22 1971-05-21 Halbleiterbauelement

Country Status (4)

Country Link
DE (2) DE7119711U (https=)
FR (1) FR2090206A1 (https=)
GB (1) GB1356157A (https=)
IE (1) IE35063B1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5754043B2 (https=) * 1973-05-21 1982-11-16
GB1553243A (en) * 1975-08-04 1979-09-26 Gen Electric Semiconductor
GB1563421A (en) * 1975-12-18 1980-03-26 Gen Electric Polyimide-siloxane copolymer protective coating for semiconductor devices
DE4040753A1 (de) * 1990-12-19 1992-06-25 Siemens Ag Leistungshalbleiterbauelement
DE102009017732A1 (de) * 2009-04-11 2010-10-21 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleiterbauelement mit einer Randpassivierung und Verfahren zu dessen Herstellung
CN104124215B (zh) * 2014-06-26 2017-02-15 江苏省宜兴电子器件总厂 一种焊接、键合和密封同步完成的封装结构和封装工艺

Also Published As

Publication number Publication date
FR2090206A1 (https=) 1972-01-14
IE35063L (en) 1971-11-22
GB1356157A (en) 1974-06-12
DE2125106A1 (de) 1971-12-02
IE35063B1 (en) 1975-10-29

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