GB1356157A - Semiconductor device with polymeric passivant bonded preform - Google Patents

Semiconductor device with polymeric passivant bonded preform

Info

Publication number
GB1356157A
GB1356157A GB1675671A GB1675671A GB1356157A GB 1356157 A GB1356157 A GB 1356157A GB 1675671 A GB1675671 A GB 1675671A GB 1675671 A GB1675671 A GB 1675671A GB 1356157 A GB1356157 A GB 1356157A
Authority
GB
United Kingdom
Prior art keywords
preform
wafer
passivant
polymeric
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1675671A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of GB1356157A publication Critical patent/GB1356157A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type

Landscapes

  • Die Bonding (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Thyristors (AREA)
GB1675671A 1970-05-22 1971-05-24 Semiconductor device with polymeric passivant bonded preform Expired GB1356157A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US3965070A 1970-05-22 1970-05-22

Publications (1)

Publication Number Publication Date
GB1356157A true GB1356157A (en) 1974-06-12

Family

ID=21906611

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1675671A Expired GB1356157A (en) 1970-05-22 1971-05-24 Semiconductor device with polymeric passivant bonded preform

Country Status (4)

Country Link
DE (2) DE7119711U (https=)
FR (1) FR2090206A1 (https=)
GB (1) GB1356157A (https=)
IE (1) IE35063B1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2239774A1 (de) * 2009-04-11 2010-10-13 SEMIKRON Elektronik GmbH & Co. KG Leistungshalbleiterbauelement mit einer Randpassivierung und Verfahren zu dessen Herstellung
CN104124215A (zh) * 2014-06-26 2014-10-29 江苏省宜兴电子器件总厂 一种焊接、键合和密封同步完成的封装结构和封装工艺

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5754043B2 (https=) * 1973-05-21 1982-11-16
GB1553243A (en) * 1975-08-04 1979-09-26 Gen Electric Semiconductor
GB1563421A (en) * 1975-12-18 1980-03-26 Gen Electric Polyimide-siloxane copolymer protective coating for semiconductor devices
DE4040753A1 (de) * 1990-12-19 1992-06-25 Siemens Ag Leistungshalbleiterbauelement

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2239774A1 (de) * 2009-04-11 2010-10-13 SEMIKRON Elektronik GmbH & Co. KG Leistungshalbleiterbauelement mit einer Randpassivierung und Verfahren zu dessen Herstellung
CN104124215A (zh) * 2014-06-26 2014-10-29 江苏省宜兴电子器件总厂 一种焊接、键合和密封同步完成的封装结构和封装工艺
CN104124215B (zh) * 2014-06-26 2017-02-15 江苏省宜兴电子器件总厂 一种焊接、键合和密封同步完成的封装结构和封装工艺

Also Published As

Publication number Publication date
FR2090206A1 (https=) 1972-01-14
IE35063L (en) 1971-11-22
DE2125106A1 (de) 1971-12-02
DE7119711U (de) 1972-02-03
IE35063B1 (en) 1975-10-29

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees