IE35063B1 - Semiconductor device with polymeric passivant bonded preform - Google Patents

Semiconductor device with polymeric passivant bonded preform

Info

Publication number
IE35063B1
IE35063B1 IE473/71A IE47371A IE35063B1 IE 35063 B1 IE35063 B1 IE 35063B1 IE 473/71 A IE473/71 A IE 473/71A IE 47371 A IE47371 A IE 47371A IE 35063 B1 IE35063 B1 IE 35063B1
Authority
IE
Ireland
Prior art keywords
preform
wafer
passivant
polymeric
contact
Prior art date
Application number
IE473/71A
Other languages
English (en)
Other versions
IE35063L (en
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of IE35063L publication Critical patent/IE35063L/xx
Publication of IE35063B1 publication Critical patent/IE35063B1/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type

Landscapes

  • Die Bonding (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Thyristors (AREA)
IE473/71A 1970-05-22 1971-04-16 Semiconductor device with polymeric passivant bonded preform IE35063B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US3965070A 1970-05-22 1970-05-22

Publications (2)

Publication Number Publication Date
IE35063L IE35063L (en) 1971-11-22
IE35063B1 true IE35063B1 (en) 1975-10-29

Family

ID=21906611

Family Applications (1)

Application Number Title Priority Date Filing Date
IE473/71A IE35063B1 (en) 1970-05-22 1971-04-16 Semiconductor device with polymeric passivant bonded preform

Country Status (4)

Country Link
DE (2) DE7119711U (https=)
FR (1) FR2090206A1 (https=)
GB (1) GB1356157A (https=)
IE (1) IE35063B1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5754043B2 (https=) * 1973-05-21 1982-11-16
GB1553243A (en) * 1975-08-04 1979-09-26 Gen Electric Semiconductor
GB1563421A (en) * 1975-12-18 1980-03-26 Gen Electric Polyimide-siloxane copolymer protective coating for semiconductor devices
DE4040753A1 (de) * 1990-12-19 1992-06-25 Siemens Ag Leistungshalbleiterbauelement
DE102009017732A1 (de) * 2009-04-11 2010-10-21 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleiterbauelement mit einer Randpassivierung und Verfahren zu dessen Herstellung
CN104124215B (zh) * 2014-06-26 2017-02-15 江苏省宜兴电子器件总厂 一种焊接、键合和密封同步完成的封装结构和封装工艺

Also Published As

Publication number Publication date
FR2090206A1 (https=) 1972-01-14
IE35063L (en) 1971-11-22
GB1356157A (en) 1974-06-12
DE2125106A1 (de) 1971-12-02
DE7119711U (de) 1972-02-03

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