DE7036187U - Halbleiteranordnung. - Google Patents

Halbleiteranordnung.

Info

Publication number
DE7036187U
DE7036187U DE7036187U DE7036187U DE7036187U DE 7036187 U DE7036187 U DE 7036187U DE 7036187 U DE7036187 U DE 7036187U DE 7036187 U DE7036187 U DE 7036187U DE 7036187 U DE7036187 U DE 7036187U
Authority
DE
Germany
Prior art keywords
semiconductor
stack
assembly
connection means
head piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE7036187U
Other languages
German (de)
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of DE7036187U publication Critical patent/DE7036187U/de
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/10Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/10Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40Fillings or auxiliary members in containers, e.g. centering rings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE7036187U 1969-10-02 1970-09-30 Halbleiteranordnung. Expired DE7036187U (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86320869A 1969-10-02 1969-10-02

Publications (1)

Publication Number Publication Date
DE7036187U true DE7036187U (de) 1972-04-27

Family

ID=25340554

Family Applications (2)

Application Number Title Priority Date Filing Date
DE7036187U Expired DE7036187U (de) 1969-10-02 1970-09-30 Halbleiteranordnung.
DE19702048067 Pending DE2048067A1 (de) 1969-10-02 1970-09-30 Halbleiteranordnung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE19702048067 Pending DE2048067A1 (de) 1969-10-02 1970-09-30 Halbleiteranordnung

Country Status (6)

Country Link
JP (1) JPS50353B1 (https=)
DE (2) DE7036187U (https=)
FR (1) FR2064104B1 (https=)
GB (1) GB1320412A (https=)
IE (1) IE34521B1 (https=)
SE (1) SE365067B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5623759A (en) * 1979-08-01 1981-03-06 Hitachi Ltd Resin-sealed semiconductor device and manufacture thereof
JPS59198740A (ja) * 1983-04-25 1984-11-10 Mitsubishi Electric Corp 樹脂封止形半導体複合素子
JPS63193160U (https=) * 1987-05-30 1988-12-13
JP2024545097A (ja) 2021-12-10 2024-12-05 ヴィシャイ ジェネラル セミコンダクター,エルエルシー 積層マルチチップの保護を強化した構造体

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB716243A (en) * 1951-04-05 1954-09-29 Standard Telephones Cables Ltd Improvements in or relating to electrically conducting cements
FR1481857A (fr) * 1964-08-07 1967-05-19 Rca Corp Procédé de fabrication de dispositifs semiconducteurs à empilage et dispositifs semiconducteurs obtenus par ce procédé
US3423638A (en) * 1964-09-02 1969-01-21 Gti Corp Micromodular package with compression means holding contacts engaged
US3416046A (en) * 1965-12-13 1968-12-10 Dickson Electronics Corp Encased zener diode assembly and method of producing same
FR1544424A (fr) * 1966-11-14 1968-10-31 Gen Electric Perfectionnements aux dispositifs à semiconducteurs encapsulés

Also Published As

Publication number Publication date
GB1320412A (en) 1973-06-13
JPS50353B1 (https=) 1975-01-08
IE34521L (en) 1971-04-02
IE34521B1 (en) 1975-05-28
FR2064104B1 (https=) 1974-04-26
DE2048067A1 (de) 1971-04-22
FR2064104A1 (https=) 1971-07-16
SE365067B (https=) 1974-03-11

Similar Documents

Publication Publication Date Title
DE2542518C3 (https=)
DE112013007214B4 (de) Halbleitervorrichtung-Herstellungsverfahren und Halbleitervorrichtung
DE1933731A1 (de) Verbindungselemente fuer Halbleiterschaltungselemente und integrierte Schaltungsanordnungen
DE3233195A1 (de) Halbleitervorrichtung
DE2116828A1 (de) Elektrischer (Sicherungs ) Schmelzeinsatz
DE2617272A1 (de) Elektrischer verbinder
EP2652785B1 (de) Träger für einen optoelektronischen halbleiterchip und halbleiterchip
DE3221199A1 (de) Halbleiteranordnung des isolierten typs
DE2041497B2 (de) Verfahren zum Herstellen eines Halbleiterbauelementes
DE112016006332T5 (de) Leistungsmodul
DE102013217801B4 (de) Halbleiteranordnung, verfahren zur herstellung einer anzahl von chipbaugruppen, verfahren zur herstellung einer halbleiteranordnung und verfahren zum betrieb einer halbleiteranordnung
DE1539863A1 (de) Transistor
DE102012214917A1 (de) Halbleitervorrichtung und Verfahren zu deren Herstellung
DE2806099A1 (de) Halbleiter-baugruppe
DE6606125U (de) Halbleiterelement fuer ein stosspanungsfestes halbleiterventil
DE1589854A1 (de) Loetstellenfreier Halbleitergleichrichter
DE2238185A1 (de) Metalloxid-varistorkoerper mit elektronischer schaltungseinheit
DE68913823T2 (de) Lösbare elektrische Verbindung.
DE112016007197T5 (de) Überspannungsschutzvorrichtung mit integrierter sicherung
DE2004776C2 (de) Halbleiterbauelement
DE2649935A1 (de) Referenzdiode
DE7036187U (de) Halbleiteranordnung.
DE3211975A1 (de) Montagegehaeuse fuer halbleiterbauteile mittlerer leistung
DE1279201B (de) Halbleiteranordnung
EP1220314B1 (de) Leistungshalbleitermodul