IE34521B1 - Semiconductor devices - Google Patents
Semiconductor devicesInfo
- Publication number
- IE34521B1 IE34521B1 IE1188/70A IE118870A IE34521B1 IE 34521 B1 IE34521 B1 IE 34521B1 IE 1188/70 A IE1188/70 A IE 1188/70A IE 118870 A IE118870 A IE 118870A IE 34521 B1 IE34521 B1 IE 34521B1
- Authority
- IE
- Ireland
- Prior art keywords
- stack
- conductors
- resin
- moulded
- connectors
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US86320869A | 1969-10-02 | 1969-10-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IE34521L IE34521L (en) | 1971-04-02 |
| IE34521B1 true IE34521B1 (en) | 1975-05-28 |
Family
ID=25340554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IE1188/70A IE34521B1 (en) | 1969-10-02 | 1970-09-24 | Semiconductor devices |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPS50353B1 (https=) |
| DE (2) | DE7036187U (https=) |
| FR (1) | FR2064104B1 (https=) |
| GB (1) | GB1320412A (https=) |
| IE (1) | IE34521B1 (https=) |
| SE (1) | SE365067B (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5623759A (en) * | 1979-08-01 | 1981-03-06 | Hitachi Ltd | Resin-sealed semiconductor device and manufacture thereof |
| JPS59198740A (ja) * | 1983-04-25 | 1984-11-10 | Mitsubishi Electric Corp | 樹脂封止形半導体複合素子 |
| JPS63193160U (https=) * | 1987-05-30 | 1988-12-13 | ||
| JP2024545097A (ja) | 2021-12-10 | 2024-12-05 | ヴィシャイ ジェネラル セミコンダクター,エルエルシー | 積層マルチチップの保護を強化した構造体 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB716243A (en) * | 1951-04-05 | 1954-09-29 | Standard Telephones Cables Ltd | Improvements in or relating to electrically conducting cements |
| FR1481857A (fr) * | 1964-08-07 | 1967-05-19 | Rca Corp | Procédé de fabrication de dispositifs semiconducteurs à empilage et dispositifs semiconducteurs obtenus par ce procédé |
| US3423638A (en) * | 1964-09-02 | 1969-01-21 | Gti Corp | Micromodular package with compression means holding contacts engaged |
| US3416046A (en) * | 1965-12-13 | 1968-12-10 | Dickson Electronics Corp | Encased zener diode assembly and method of producing same |
| FR1544424A (fr) * | 1966-11-14 | 1968-10-31 | Gen Electric | Perfectionnements aux dispositifs à semiconducteurs encapsulés |
-
1970
- 1970-09-24 IE IE1188/70A patent/IE34521B1/xx unknown
- 1970-09-25 GB GB4589570A patent/GB1320412A/en not_active Expired
- 1970-09-30 DE DE7036187U patent/DE7036187U/de not_active Expired
- 1970-09-30 DE DE19702048067 patent/DE2048067A1/de active Pending
- 1970-09-30 SE SE13268/70A patent/SE365067B/xx unknown
- 1970-10-01 FR FR7035545A patent/FR2064104B1/fr not_active Expired
- 1970-10-02 JP JP45086320A patent/JPS50353B1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE7036187U (de) | 1972-04-27 |
| GB1320412A (en) | 1973-06-13 |
| JPS50353B1 (https=) | 1975-01-08 |
| IE34521L (en) | 1971-04-02 |
| FR2064104B1 (https=) | 1974-04-26 |
| DE2048067A1 (de) | 1971-04-22 |
| FR2064104A1 (https=) | 1971-07-16 |
| SE365067B (https=) | 1974-03-11 |
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