DE69941399D1 - Laminate für einkapselung von oled-vorrichtungen - Google Patents

Laminate für einkapselung von oled-vorrichtungen

Info

Publication number
DE69941399D1
DE69941399D1 DE69941399T DE69941399T DE69941399D1 DE 69941399 D1 DE69941399 D1 DE 69941399D1 DE 69941399 T DE69941399 T DE 69941399T DE 69941399 T DE69941399 T DE 69941399T DE 69941399 D1 DE69941399 D1 DE 69941399D1
Authority
DE
Germany
Prior art keywords
laminates
inclusion
oled devices
electrical device
encapsulation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69941399T
Other languages
English (en)
Inventor
Ewald Karl Guenther
Wei Wang
Soo Jin Chua
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Institute of Materials Research and Engineering
Original Assignee
Osram Opto Semiconductors GmbH
Institute of Materials Research and Engineering
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH, Institute of Materials Research and Engineering filed Critical Osram Opto Semiconductors GmbH
Application granted granted Critical
Publication of DE69941399D1 publication Critical patent/DE69941399D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/841Self-supporting sealing arrangements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/12Light sources with substantially two-dimensional radiating surfaces
    • H05B33/22Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8426Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8428Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • H10K59/8722Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • H10K59/8723Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/873Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301Details of OLEDs
    • H10K2102/311Flexible OLED

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Laminated Bodies (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
DE69941399T 1999-07-09 1999-07-09 Laminate für einkapselung von oled-vorrichtungen Expired - Lifetime DE69941399D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SG1999/000070 WO2001005205A1 (en) 1999-07-09 1999-07-09 Laminates for encapsulating devices

Publications (1)

Publication Number Publication Date
DE69941399D1 true DE69941399D1 (de) 2009-10-22

Family

ID=20430225

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69941399T Expired - Lifetime DE69941399D1 (de) 1999-07-09 1999-07-09 Laminate für einkapselung von oled-vorrichtungen

Country Status (11)

Country Link
US (2) US6949825B1 (de)
EP (1) EP1112674B1 (de)
JP (1) JP4950400B2 (de)
KR (1) KR20010106472A (de)
CN (1) CN1227731C (de)
AT (1) ATE442765T1 (de)
AU (1) AU4951099A (de)
CA (1) CA2342363A1 (de)
DE (1) DE69941399D1 (de)
TW (1) TWI231739B (de)
WO (1) WO2001005205A1 (de)

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EP1112674B1 (de) * 1999-07-09 2009-09-09 Institute of Materials Research & Engineering Laminate für einkapselung von oled-vorrichtungen
US6814642B2 (en) * 2001-04-04 2004-11-09 Eastman Kodak Company Touch screen display and method of manufacture
US6590157B2 (en) * 2001-09-21 2003-07-08 Eastman Kodak Company Sealing structure for highly moisture-sensitive electronic device element and method for fabrication
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DE10236855B4 (de) * 2002-08-07 2006-03-16 Samsung SDI Co., Ltd., Suwon Gehäuseeinheit zur Verkapselung von Bauelementen und Verfahren zu deren Herstellung
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US20110008525A1 (en) * 2009-07-10 2011-01-13 General Electric Company Condensation and curing of materials within a coating system
TWI470704B (zh) 2010-07-14 2015-01-21 Ind Tech Res Inst 環境敏感電子元件的封裝方法
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CN103258955B (zh) * 2012-02-20 2016-02-03 中国科学院微电子研究所 有机电子器件的封装方法
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CN103904232A (zh) * 2012-12-25 2014-07-02 海洋王照明科技股份有限公司 一种有机电致发光器件及其制备方法
CN104167507A (zh) * 2013-05-20 2014-11-26 海洋王照明科技股份有限公司 一种有机电致发光器件及其制备方法
CN104576970A (zh) * 2013-10-12 2015-04-29 昆山工研院新型平板显示技术中心有限公司 一种柔性显示装置的制备方法及其制备的柔性显示装置
US9156678B2 (en) 2013-12-12 2015-10-13 Qualcomm Mems Technologies, Inc. MEMS encapsulation by multilayer film lamination
US9831054B2 (en) * 2014-03-27 2017-11-28 Littelfuse, Inc. Insulated thermal cut-off device
CN103996796B (zh) * 2014-04-29 2015-07-15 京东方科技集团股份有限公司 一种柔性基板和oled器件
CN104167426B (zh) * 2014-06-03 2017-08-01 上海天马有机发光显示技术有限公司 一种有机发光二极管显示面板及其制作方法和显示装置
CN104143609A (zh) * 2014-08-07 2014-11-12 张家港康得新光电材料有限公司 阻隔膜及其制作方法
CN112895660A (zh) * 2021-03-25 2021-06-04 江苏日久光电股份有限公司 一种高阻隔膜及其制备方法

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Also Published As

Publication number Publication date
JP4950400B2 (ja) 2012-06-13
CA2342363A1 (en) 2001-01-18
EP1112674A1 (de) 2001-07-04
WO2001005205A1 (en) 2001-01-18
CN1227731C (zh) 2005-11-16
TWI231739B (en) 2005-04-21
KR20010106472A (ko) 2001-11-29
EP1112674B1 (de) 2009-09-09
US6949825B1 (en) 2005-09-27
JP2003504894A (ja) 2003-02-04
US7262441B2 (en) 2007-08-28
US20050236640A1 (en) 2005-10-27
CN1317225A (zh) 2001-10-10
ATE442765T1 (de) 2009-09-15
AU4951099A (en) 2001-01-30

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