DE69938271D1 - Hochfrequenzmodul - Google Patents
HochfrequenzmodulInfo
- Publication number
- DE69938271D1 DE69938271D1 DE69938271T DE69938271T DE69938271D1 DE 69938271 D1 DE69938271 D1 DE 69938271D1 DE 69938271 T DE69938271 T DE 69938271T DE 69938271 T DE69938271 T DE 69938271T DE 69938271 D1 DE69938271 D1 DE 69938271D1
- Authority
- DE
- Germany
- Prior art keywords
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0239—Signal transmission by AC coupling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6605—High-frequency electrical connections
- H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15192—Resurf arrangement of the internal vias
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
- H01L2924/16153—Cap enclosing a plurality of side-by-side cavities [e.g. E-shaped cap]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/162—Disposition
- H01L2924/16251—Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1903—Structure including wave guides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09054—Raised area or protrusion of metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Waveguide Connection Structure (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14937898 | 1998-05-29 | ||
JP14937798A JP3554193B2 (ja) | 1998-05-29 | 1998-05-29 | 高周波用配線基板およびその製造方法 |
JP14937898A JP3556470B2 (ja) | 1998-05-29 | 1998-05-29 | 高周波用モジュール |
JP14937798 | 1998-05-29 | ||
JP27620098 | 1998-09-29 | ||
JP27620098 | 1998-09-29 | ||
JP27619998 | 1998-09-29 | ||
JP27619998 | 1998-09-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69938271D1 true DE69938271D1 (de) | 2008-04-17 |
DE69938271T2 DE69938271T2 (de) | 2009-03-19 |
Family
ID=27472927
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69938271T Expired - Fee Related DE69938271T2 (de) | 1998-05-29 | 1999-05-28 | Hochfrequenzmodul |
Country Status (3)
Country | Link |
---|---|
US (1) | US6356173B1 (de) |
EP (1) | EP0961321B1 (de) |
DE (1) | DE69938271T2 (de) |
Families Citing this family (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3129288B2 (ja) * | 1998-05-28 | 2001-01-29 | 日本電気株式会社 | マイクロ波集積回路マルチチップモジュール、マイクロ波集積回路マルチチップモジュールの実装構造 |
US6452267B1 (en) * | 2000-04-04 | 2002-09-17 | Applied Micro Circuits Corporation | Selective flip chip underfill processing for high speed signal isolation |
TW452953B (en) * | 2000-05-22 | 2001-09-01 | Via Tech Inc | BGA chip package capable of decreasing its impedance when operating at high frequency |
WO2002001639A2 (de) * | 2000-06-29 | 2002-01-03 | Siemens Aktiengesellschaft | Substrat und modul |
CN1274056C (zh) * | 2000-10-18 | 2006-09-06 | 诺基亚公司 | 波导到带状线转接 |
JP2002164465A (ja) * | 2000-11-28 | 2002-06-07 | Kyocera Corp | 配線基板、配線ボード、それらの実装構造、ならびにマルチチップモジュール |
DE10158185B4 (de) * | 2000-12-20 | 2005-08-11 | Semikron Elektronik Gmbh | Leistungshalbleitermodul mit hoher Isolationsfestigkeit |
EP1368858B1 (de) * | 2001-03-02 | 2011-02-23 | Nxp B.V. | Modul und elektronische vorrichtung |
US6882239B2 (en) * | 2001-05-08 | 2005-04-19 | Formfactor, Inc. | Electromagnetically coupled interconnect system |
FR2826780A1 (fr) * | 2001-06-28 | 2003-01-03 | St Microelectronics Sa | Dispositif semi-conducteur a structure hyperfrequence |
DE60229821D1 (de) * | 2001-09-25 | 2008-12-24 | Tdk Corp | Gehäuse für integrierte Schaltung |
JP3662219B2 (ja) * | 2001-12-27 | 2005-06-22 | 三菱電機株式会社 | 積層高周波モジュール |
JP2004096206A (ja) * | 2002-08-29 | 2004-03-25 | Fujitsu Ten Ltd | 導波管・平面線路変換器、及び高周波回路装置 |
FR2847723B1 (fr) * | 2002-11-22 | 2006-02-03 | United Monolithic Semiconduct | Composant electronique en boitier pour applications a des frequences millimetriques |
US6864718B2 (en) * | 2003-02-20 | 2005-03-08 | Taiwan Semiconductor Manufacturing Company | Charge pump level converter (CPLC) for dual voltage system in very low power application |
JP4237517B2 (ja) * | 2003-03-05 | 2009-03-11 | シャープ株式会社 | 高周波半導体装置の実装構造及びこれを用いた高周波送信装置並びに高周波受信装置 |
US7466157B2 (en) * | 2004-02-05 | 2008-12-16 | Formfactor, Inc. | Contactless interfacing of test signals with a device under test |
US7030712B2 (en) * | 2004-03-01 | 2006-04-18 | Belair Networks Inc. | Radio frequency (RF) circuit board topology |
JP2005268428A (ja) * | 2004-03-17 | 2005-09-29 | Mitsubishi Electric Corp | 基板の電磁シールド構造 |
MXPA06014461A (es) | 2004-06-12 | 2007-05-23 | Digital Biotechnology Co Ltd | Electroporador que tiene un miembro hueco alargado. |
US7411279B2 (en) * | 2004-06-30 | 2008-08-12 | Endwave Corporation | Component interconnect with substrate shielding |
US7348666B2 (en) * | 2004-06-30 | 2008-03-25 | Endwave Corporation | Chip-to-chip trench circuit structure |
US7166877B2 (en) * | 2004-07-30 | 2007-01-23 | Bae Systems Information And Electronic Systems Integration Inc. | High frequency via |
DE102004038574A1 (de) * | 2004-08-06 | 2006-03-16 | Endress + Hauser Gmbh + Co. Kg | Vorrichtung zur Übertragung von breitbandigen Hochfrequenzsignale |
JP4101814B2 (ja) * | 2005-03-15 | 2008-06-18 | 富士通株式会社 | 高周波モジュール |
TW200723977A (en) * | 2005-12-13 | 2007-06-16 | Inventec Corp | Method and its structure used to inhibit the stub effect at the via on a substrate |
US7573359B2 (en) * | 2007-03-29 | 2009-08-11 | Intel Corporation | Reducing crosstalk in electronic devices having microstrip lines covered by a flexible insulating material and a metallic backing plate |
US7829462B2 (en) * | 2007-05-03 | 2010-11-09 | Teledyne Licensing, Llc | Through-wafer vias |
KR101084528B1 (ko) | 2008-04-15 | 2011-11-18 | 인비트로겐 싱가포르 피티이. 엘티디. | 전기천공 장치용 파이펫 팁 |
JP5260127B2 (ja) * | 2008-04-18 | 2013-08-14 | 国立大学法人東北大学 | 炭化珪素の製造方法 |
US20100020518A1 (en) * | 2008-07-28 | 2010-01-28 | Anadigics, Inc. | RF shielding arrangement for semiconductor packages |
JP5047362B2 (ja) * | 2009-02-25 | 2012-10-10 | 京セラ株式会社 | 高周波モジュール |
US8912860B2 (en) * | 2009-09-08 | 2014-12-16 | Siklu Communication ltd. | Millimeter-wave bare IC mounted within a laminated PCB and usable in a waveguide transition |
US8912858B2 (en) * | 2009-09-08 | 2014-12-16 | Siklu Communication ltd. | Interfacing between an integrated circuit and a waveguide through a cavity located in a soft laminate |
US8461855B2 (en) | 2009-10-02 | 2013-06-11 | Teradyne, Inc. | Device interface board with cavity back for very high frequency applications |
CN102544666B (zh) * | 2010-10-21 | 2016-06-15 | 朗美通运营有限责任公司 | 宽带非共面馈通 |
JP6105496B2 (ja) * | 2014-01-21 | 2017-03-29 | 株式会社デンソー | 一括積層基板 |
EP3118927B9 (de) * | 2014-03-11 | 2021-08-04 | Mitsubishi Electric Corporation | Hochfrequenzverpackung |
US9583811B2 (en) * | 2014-08-07 | 2017-02-28 | Infineon Technologies Ag | Transition between a plastic waveguide and a semiconductor chip, where the semiconductor chip is embedded and encapsulated within a mold compound |
US9537199B2 (en) | 2015-03-19 | 2017-01-03 | International Business Machines Corporation | Package structure having an integrated waveguide configured to communicate between first and second integrated circuit chips |
KR102384505B1 (ko) * | 2016-01-12 | 2022-04-08 | 삼성전자주식회사 | 칩 간 무선 통신을 제공하기 위한 방법 및 장치 |
KR102410197B1 (ko) * | 2017-06-13 | 2022-06-17 | 삼성전자주식회사 | 전송 손실을 줄이기 위한 회로 기판 및 이를 구비한 전자 장치 |
CN213522492U (zh) * | 2017-11-16 | 2021-06-22 | 株式会社村田制作所 | 树脂多层基板、电子部件及其安装构造 |
KR102551803B1 (ko) * | 2018-10-19 | 2023-07-06 | 삼성전자주식회사 | 배선을 따라 유전체가 채워질 수 있는 이격 공간을 갖도록 배치된 도전성 부재를 포함하는 전자 장치 |
CN109728418A (zh) * | 2018-12-29 | 2019-05-07 | 联想(北京)有限公司 | 电子设备及其天线 |
US11557544B2 (en) * | 2020-08-27 | 2023-01-17 | Nxp Usa, Inc. | Semiconductor device having a translation feature and method therefor |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3771075A (en) * | 1971-05-25 | 1973-11-06 | Harris Intertype Corp | Microstrip to microstrip transition |
JPS54131A (en) | 1977-06-01 | 1979-01-05 | Hitachi Ltd | Hydraulic turbine spiral casing |
JPS54131851A (en) * | 1978-04-04 | 1979-10-13 | Mitsubishi Electric Corp | Multi-layer transmission line assembly |
JPH0684049B2 (ja) | 1984-06-06 | 1994-10-26 | 大日本印刷株式会社 | 成型された紙コツプの排出集積方法及び装置 |
JPS61123302A (ja) * | 1984-11-20 | 1986-06-11 | Matsushita Electric Ind Co Ltd | フイルタ装置 |
US4768004A (en) * | 1986-10-09 | 1988-08-30 | Sanders Associates, Inc. | Electrical circuit interconnect system |
JPS63310203A (ja) * | 1987-06-12 | 1988-12-19 | Nec Corp | マイクロ波用電子部品間接続構造 |
US5206712A (en) * | 1990-04-05 | 1993-04-27 | General Electric Company | Building block approach to microwave modules |
CA2109441C (en) * | 1992-10-29 | 1997-05-13 | Yuhei Kosugi | Composite microwave circuit module assembly and its connection structure |
JP3053507B2 (ja) | 1993-06-11 | 2000-06-19 | 裕子 鈴木 | ドーム型羽毛ふとん |
US5471181A (en) * | 1994-03-08 | 1995-11-28 | Hughes Missile Systems Company | Interconnection between layers of striplines or microstrip through cavity backed slot |
JPH07263887A (ja) * | 1994-03-18 | 1995-10-13 | Fujitsu Ltd | マイクロ波回路装置 |
US5952709A (en) * | 1995-12-28 | 1999-09-14 | Kyocera Corporation | High-frequency semiconductor device and mounted structure thereof |
JPH1027987A (ja) * | 1996-07-10 | 1998-01-27 | Hitachi Ltd | 低emi回路基板及び低emiケーブルコネクタ |
JPH1065038A (ja) * | 1996-08-22 | 1998-03-06 | Mitsubishi Electric Corp | ミリ波デバイス用パッケージ |
US6002375A (en) * | 1997-09-02 | 1999-12-14 | Motorola, Inc. | Multi-substrate radio-frequency circuit |
US6023210A (en) * | 1998-03-03 | 2000-02-08 | California Institute Of Technology | Interlayer stripline transition |
-
1999
- 1999-05-28 US US09/322,739 patent/US6356173B1/en not_active Expired - Fee Related
- 1999-05-28 EP EP99110425A patent/EP0961321B1/de not_active Expired - Lifetime
- 1999-05-28 DE DE69938271T patent/DE69938271T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US6356173B1 (en) | 2002-03-12 |
EP0961321A2 (de) | 1999-12-01 |
DE69938271T2 (de) | 2009-03-19 |
EP0961321A3 (de) | 2000-05-17 |
EP0961321B1 (de) | 2008-03-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |