DE69938271D1 - Hochfrequenzmodul - Google Patents

Hochfrequenzmodul

Info

Publication number
DE69938271D1
DE69938271D1 DE69938271T DE69938271T DE69938271D1 DE 69938271 D1 DE69938271 D1 DE 69938271D1 DE 69938271 T DE69938271 T DE 69938271T DE 69938271 T DE69938271 T DE 69938271T DE 69938271 D1 DE69938271 D1 DE 69938271D1
Authority
DE
Germany
Prior art keywords
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69938271T
Other languages
English (en)
Other versions
DE69938271T2 (de
Inventor
Koichi Nagata
Kenji Kitazawa
Shinichi Koriyama
Takanori Kubo
Hidehiro Minamiue
Masanobu Ishida
Akira Nakayama
Naoyuki Shino
Shigeki Morioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP14937798A external-priority patent/JP3554193B2/ja
Priority claimed from JP14937898A external-priority patent/JP3556470B2/ja
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of DE69938271D1 publication Critical patent/DE69938271D1/de
Application granted granted Critical
Publication of DE69938271T2 publication Critical patent/DE69938271T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0239—Signal transmission by AC coupling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15192—Resurf arrangement of the internal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/16153—Cap enclosing a plurality of side-by-side cavities [e.g. E-shaped cap]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/16251—Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1903—Structure including wave guides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Waveguide Connection Structure (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
DE69938271T 1998-05-29 1999-05-28 Hochfrequenzmodul Expired - Fee Related DE69938271T2 (de)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP14937898 1998-05-29
JP14937798A JP3554193B2 (ja) 1998-05-29 1998-05-29 高周波用配線基板およびその製造方法
JP14937898A JP3556470B2 (ja) 1998-05-29 1998-05-29 高周波用モジュール
JP14937798 1998-05-29
JP27620098 1998-09-29
JP27620098 1998-09-29
JP27619998 1998-09-29
JP27619998 1998-09-29

Publications (2)

Publication Number Publication Date
DE69938271D1 true DE69938271D1 (de) 2008-04-17
DE69938271T2 DE69938271T2 (de) 2009-03-19

Family

ID=27472927

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69938271T Expired - Fee Related DE69938271T2 (de) 1998-05-29 1999-05-28 Hochfrequenzmodul

Country Status (3)

Country Link
US (1) US6356173B1 (de)
EP (1) EP0961321B1 (de)
DE (1) DE69938271T2 (de)

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WO2002001639A2 (de) * 2000-06-29 2002-01-03 Siemens Aktiengesellschaft Substrat und modul
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DE10158185B4 (de) * 2000-12-20 2005-08-11 Semikron Elektronik Gmbh Leistungshalbleitermodul mit hoher Isolationsfestigkeit
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FR2826780A1 (fr) * 2001-06-28 2003-01-03 St Microelectronics Sa Dispositif semi-conducteur a structure hyperfrequence
DE60229821D1 (de) * 2001-09-25 2008-12-24 Tdk Corp Gehäuse für integrierte Schaltung
JP3662219B2 (ja) * 2001-12-27 2005-06-22 三菱電機株式会社 積層高周波モジュール
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FR2847723B1 (fr) * 2002-11-22 2006-02-03 United Monolithic Semiconduct Composant electronique en boitier pour applications a des frequences millimetriques
US6864718B2 (en) * 2003-02-20 2005-03-08 Taiwan Semiconductor Manufacturing Company Charge pump level converter (CPLC) for dual voltage system in very low power application
JP4237517B2 (ja) * 2003-03-05 2009-03-11 シャープ株式会社 高周波半導体装置の実装構造及びこれを用いた高周波送信装置並びに高周波受信装置
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US7411279B2 (en) * 2004-06-30 2008-08-12 Endwave Corporation Component interconnect with substrate shielding
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US7166877B2 (en) * 2004-07-30 2007-01-23 Bae Systems Information And Electronic Systems Integration Inc. High frequency via
DE102004038574A1 (de) * 2004-08-06 2006-03-16 Endress + Hauser Gmbh + Co. Kg Vorrichtung zur Übertragung von breitbandigen Hochfrequenzsignale
JP4101814B2 (ja) * 2005-03-15 2008-06-18 富士通株式会社 高周波モジュール
TW200723977A (en) * 2005-12-13 2007-06-16 Inventec Corp Method and its structure used to inhibit the stub effect at the via on a substrate
US7573359B2 (en) * 2007-03-29 2009-08-11 Intel Corporation Reducing crosstalk in electronic devices having microstrip lines covered by a flexible insulating material and a metallic backing plate
US7829462B2 (en) * 2007-05-03 2010-11-09 Teledyne Licensing, Llc Through-wafer vias
KR101084528B1 (ko) 2008-04-15 2011-11-18 인비트로겐 싱가포르 피티이. 엘티디. 전기천공 장치용 파이펫 팁
JP5260127B2 (ja) * 2008-04-18 2013-08-14 国立大学法人東北大学 炭化珪素の製造方法
US20100020518A1 (en) * 2008-07-28 2010-01-28 Anadigics, Inc. RF shielding arrangement for semiconductor packages
JP5047362B2 (ja) * 2009-02-25 2012-10-10 京セラ株式会社 高周波モジュール
US8912860B2 (en) * 2009-09-08 2014-12-16 Siklu Communication ltd. Millimeter-wave bare IC mounted within a laminated PCB and usable in a waveguide transition
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US8461855B2 (en) 2009-10-02 2013-06-11 Teradyne, Inc. Device interface board with cavity back for very high frequency applications
CN102544666B (zh) * 2010-10-21 2016-06-15 朗美通运营有限责任公司 宽带非共面馈通
JP6105496B2 (ja) * 2014-01-21 2017-03-29 株式会社デンソー 一括積層基板
EP3118927B9 (de) * 2014-03-11 2021-08-04 Mitsubishi Electric Corporation Hochfrequenzverpackung
US9583811B2 (en) * 2014-08-07 2017-02-28 Infineon Technologies Ag Transition between a plastic waveguide and a semiconductor chip, where the semiconductor chip is embedded and encapsulated within a mold compound
US9537199B2 (en) 2015-03-19 2017-01-03 International Business Machines Corporation Package structure having an integrated waveguide configured to communicate between first and second integrated circuit chips
KR102384505B1 (ko) * 2016-01-12 2022-04-08 삼성전자주식회사 칩 간 무선 통신을 제공하기 위한 방법 및 장치
KR102410197B1 (ko) * 2017-06-13 2022-06-17 삼성전자주식회사 전송 손실을 줄이기 위한 회로 기판 및 이를 구비한 전자 장치
CN213522492U (zh) * 2017-11-16 2021-06-22 株式会社村田制作所 树脂多层基板、电子部件及其安装构造
KR102551803B1 (ko) * 2018-10-19 2023-07-06 삼성전자주식회사 배선을 따라 유전체가 채워질 수 있는 이격 공간을 갖도록 배치된 도전성 부재를 포함하는 전자 장치
CN109728418A (zh) * 2018-12-29 2019-05-07 联想(北京)有限公司 电子设备及其天线
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Also Published As

Publication number Publication date
US6356173B1 (en) 2002-03-12
EP0961321A2 (de) 1999-12-01
DE69938271T2 (de) 2009-03-19
EP0961321A3 (de) 2000-05-17
EP0961321B1 (de) 2008-03-05

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