DE69933619D1 - Hochfrequenzmodul - Google Patents
HochfrequenzmodulInfo
- Publication number
- DE69933619D1 DE69933619D1 DE69933619T DE69933619T DE69933619D1 DE 69933619 D1 DE69933619 D1 DE 69933619D1 DE 69933619 T DE69933619 T DE 69933619T DE 69933619 T DE69933619 T DE 69933619T DE 69933619 D1 DE69933619 D1 DE 69933619D1
- Authority
- DE
- Germany
- Prior art keywords
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/04—Fixed joints
- H01P1/047—Strip line joints
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- H05K1/0243—Printed circuits associated with mounted high frequency components
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- H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
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- H05K1/00—Printed circuits
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- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
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- H05K1/00—Printed circuits
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- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
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- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10477—Inverted
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/1053—Mounted components directly electrically connected to each other, i.e. not via the PCB
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21679398A JP3762109B2 (ja) | 1998-07-31 | 1998-07-31 | 配線基板の接続構造 |
JP21679398 | 1998-07-31 | ||
JP18582899A JP3786545B2 (ja) | 1999-06-30 | 1999-06-30 | 配線基板とその接続構造 |
JP18582899 | 1999-06-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69933619D1 true DE69933619D1 (de) | 2006-11-30 |
DE69933619T2 DE69933619T2 (de) | 2007-08-23 |
Family
ID=26503355
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69933619T Expired - Fee Related DE69933619T2 (de) | 1998-07-31 | 1999-07-30 | Hochfrequenzmodul |
Country Status (3)
Country | Link |
---|---|
US (1) | US6483406B1 (de) |
EP (1) | EP0977298B1 (de) |
DE (1) | DE69933619T2 (de) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1291953A4 (de) * | 2000-03-06 | 2003-05-14 | Fujitsu Ltd | Millimeterwellenmodul mit sondenkontaktstellen-struktur und millimeterwellensystem mit millimeterwellenmodulen |
JP3791333B2 (ja) | 2000-12-28 | 2006-06-28 | 松下電器産業株式会社 | 高周波スイッチモジュールおよびこれを実装した高周波機器 |
US6911733B2 (en) * | 2002-02-28 | 2005-06-28 | Hitachi, Ltd. | Semiconductor device and electronic device |
JP3842201B2 (ja) * | 2002-10-29 | 2006-11-08 | 三菱電機株式会社 | 高周波回路基板の接続構造体、その製造方法および高周波回路装置 |
US6956285B2 (en) * | 2003-01-15 | 2005-10-18 | Sun Microsystems, Inc. | EMI grounding pins for CPU/ASIC chips |
US6943436B2 (en) * | 2003-01-15 | 2005-09-13 | Sun Microsystems, Inc. | EMI heatspreader/lid for integrated circuit packages |
ES2314409T3 (es) | 2003-07-02 | 2009-03-16 | SIEMENS HOME AND OFFICE COMMUNICATIONS DEVICES GMBH & CO. KG | Apantallamiento para componentes y/o circuitos electronicos amenazados por iem (interferencias electromagnetcas) de aparatos electronicos. |
US6909043B1 (en) | 2003-11-12 | 2005-06-21 | Sun Microsystems, Inc. | EMI seal for system chassis |
JP2005229041A (ja) * | 2004-02-16 | 2005-08-25 | Alps Electric Co Ltd | 高周波配線構造および高周波配線構造の製造方法 |
US7239507B1 (en) | 2004-03-24 | 2007-07-03 | Sun Microsystems, Inc. | Slot frame with guide tabs for reducing EMI gaps |
US7348666B2 (en) * | 2004-06-30 | 2008-03-25 | Endwave Corporation | Chip-to-chip trench circuit structure |
US7411279B2 (en) * | 2004-06-30 | 2008-08-12 | Endwave Corporation | Component interconnect with substrate shielding |
JP4243284B2 (ja) * | 2005-03-24 | 2009-03-25 | 三洋電機株式会社 | 配線基板および回路装置 |
JP4575247B2 (ja) | 2005-07-11 | 2010-11-04 | 株式会社東芝 | 高周波パッケージ装置 |
KR100800645B1 (ko) * | 2006-08-09 | 2008-02-01 | 삼성전자주식회사 | 적층형 집적 모듈과 그 제조 방법 |
CN102308435B (zh) * | 2009-02-25 | 2014-07-30 | 京瓷株式会社 | 高频模块 |
WO2011008558A1 (en) * | 2009-06-29 | 2011-01-20 | Viasat, Inc. | Hybrid single aperture inclined antenna |
US8914968B2 (en) * | 2009-09-08 | 2014-12-23 | Siklu Communication ltd. | Methods for constructing a transition between a laminated PCB and a waveguide including forming a cavity within the laminated PCB for receiving a bare die |
US8912862B2 (en) * | 2009-09-08 | 2014-12-16 | Siklu Communication ltd. | Impedance matching between a bare-die integrated circuit and a transmission line on a laminated PCB |
US8912860B2 (en) * | 2009-09-08 | 2014-12-16 | Siklu Communication ltd. | Millimeter-wave bare IC mounted within a laminated PCB and usable in a waveguide transition |
JP2012191521A (ja) | 2011-03-11 | 2012-10-04 | Fujitsu Ltd | 可変フィルタ装置および通信装置 |
WO2013028194A1 (en) * | 2011-08-25 | 2013-02-28 | Intel Corporation | Microelectronic package having a coaxial connector |
US8963313B2 (en) * | 2011-12-22 | 2015-02-24 | Raytheon Company | Heterogeneous chip integration with low loss interconnection through adaptive patterning |
KR102542594B1 (ko) * | 2016-12-16 | 2023-06-14 | 삼성전자 주식회사 | 다층 인쇄 회로 기판 및 이를 포함하는 전자 장치 |
US10381708B2 (en) * | 2017-10-30 | 2019-08-13 | International Business Machines Corporation | Superconducting resonator to limit vertical connections in planar quantum devices |
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US4276558A (en) * | 1979-06-15 | 1981-06-30 | Ford Aerospace & Communications Corp. | Hermetically sealed active microwave integrated circuit |
JPS61239649A (ja) * | 1985-04-13 | 1986-10-24 | Fujitsu Ltd | 高速集積回路パツケ−ジ |
JPH0548239A (ja) * | 1991-08-09 | 1993-02-26 | Futaba Corp | 回路基板の形成方法 |
JPH05259720A (ja) * | 1992-03-12 | 1993-10-08 | Ngk Insulators Ltd | マイクロ波用共振器内蔵配線基板 |
JPH0661365A (ja) * | 1992-08-11 | 1994-03-04 | Hitachi Ltd | 半導体装置およびその製造方法 |
JP3141692B2 (ja) * | 1994-08-11 | 2001-03-05 | 松下電器産業株式会社 | ミリ波用検波器 |
WO1996027282A1 (en) * | 1995-03-02 | 1996-09-06 | Circuit Components Incorporated | A low cost, high performance package for microwave circuits in the up to 90 ghz frequency range using bga i/o rf port format and ceramic substrate technology |
JP3217677B2 (ja) * | 1995-12-28 | 2001-10-09 | 京セラ株式会社 | 高周波用半導体装置 |
JPH09321175A (ja) * | 1996-05-30 | 1997-12-12 | Oki Electric Ind Co Ltd | マイクロ波回路及びチップ |
JP3218996B2 (ja) * | 1996-11-28 | 2001-10-15 | 松下電器産業株式会社 | ミリ波導波路 |
US6057600A (en) * | 1997-11-27 | 2000-05-02 | Kyocera Corporation | Structure for mounting a high-frequency package |
JP3859340B2 (ja) * | 1998-01-06 | 2006-12-20 | 三菱電機株式会社 | 半導体装置 |
-
1999
- 1999-07-29 US US09/363,619 patent/US6483406B1/en not_active Expired - Fee Related
- 1999-07-30 EP EP99114940A patent/EP0977298B1/de not_active Expired - Lifetime
- 1999-07-30 DE DE69933619T patent/DE69933619T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0977298A3 (de) | 2001-10-24 |
DE69933619T2 (de) | 2007-08-23 |
EP0977298A2 (de) | 2000-02-02 |
EP0977298B1 (de) | 2006-10-18 |
US6483406B1 (en) | 2002-11-19 |
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Inventor name: SAWA, YOSHINOBU, SHIGA-KEN, JP Inventor name: KORIYAMA, SHINICHI, KOKUBU-SHI, KAGOSHIMA-KEN, JP Inventor name: KITAZAWA, KENJI, KOKUBU-SHI, KAGOSHIMA-KEN, JP Inventor name: MINAMIUE, HIDEHIRO, KOKUBU-SHI, KAGOSHIMA-KEN, JP |
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