DE69929337D1 - Gedruckte leiterplatteneinheit, hierarchisches montagehilfssubstrat und elektronischer apparat - Google Patents
Gedruckte leiterplatteneinheit, hierarchisches montagehilfssubstrat und elektronischer apparatInfo
- Publication number
- DE69929337D1 DE69929337D1 DE69929337T DE69929337T DE69929337D1 DE 69929337 D1 DE69929337 D1 DE 69929337D1 DE 69929337 T DE69929337 T DE 69929337T DE 69929337 T DE69929337 T DE 69929337T DE 69929337 D1 DE69929337 D1 DE 69929337D1
- Authority
- DE
- Germany
- Prior art keywords
- assembly
- electronic apparatus
- plate unit
- pcb plate
- hierarchical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10515—Stacked components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP1999/003731 WO2001005201A1 (fr) | 1999-07-09 | 1999-07-09 | Carte a circuit imprime, substrat auxiliaire de montage hierarchique et dispositif electronique |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69929337D1 true DE69929337D1 (de) | 2006-03-30 |
DE69929337T2 DE69929337T2 (de) | 2006-07-06 |
Family
ID=14236205
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69929337T Expired - Fee Related DE69929337T2 (de) | 1999-07-09 | 1999-07-09 | Gedruckte leiterplatteneinheit, hierarchisches montagehilfssubstrat und elektronischer apparat |
Country Status (4)
Country | Link |
---|---|
US (1) | US6717824B2 (de) |
EP (1) | EP1196014B1 (de) |
DE (1) | DE69929337T2 (de) |
WO (1) | WO2001005201A1 (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10134986B4 (de) | 2001-07-18 | 2004-04-29 | Infineon Technologies Ag | Verbindung gehäusegefaßter integrierter Speicherbausteine mit einer Leiterplatte |
US7660128B2 (en) * | 2004-09-30 | 2010-02-09 | Emcore Corporation | Apparatus for electrical and optical interconnection |
US7373031B2 (en) * | 2004-09-30 | 2008-05-13 | Intel Corporation | Apparatus for an electro-optical device connection |
US7874982B2 (en) * | 2005-11-02 | 2011-01-25 | Depuy Spine, Inc. | Illuminated surgical access system including a surgical access device and coupled light emitter |
US8399968B2 (en) * | 2005-11-18 | 2013-03-19 | Stats Chippac Ltd. | Non-leaded integrated circuit package system |
US8003443B2 (en) * | 2006-03-10 | 2011-08-23 | Stats Chippac Ltd. | Non-leaded integrated circuit package system with multiple ground sites |
US8062934B2 (en) * | 2006-06-22 | 2011-11-22 | Stats Chippac Ltd. | Integrated circuit package system with ground bonds |
US7848838B2 (en) * | 2006-06-23 | 2010-12-07 | Massachusetts Institute Of Technology | Digital assembler for digital materials |
JP2008166357A (ja) * | 2006-12-27 | 2008-07-17 | Toshiba Corp | プリント配線基板 |
US8310835B2 (en) * | 2009-07-14 | 2012-11-13 | Apple Inc. | Systems and methods for providing vias through a modular component |
US8238095B2 (en) * | 2009-08-31 | 2012-08-07 | Ncr Corporation | Secure circuit board assembly |
CN102907188B (zh) * | 2010-05-26 | 2015-10-21 | 株式会社村田制作所 | 模块基板及其制造方法 |
JP5014470B2 (ja) * | 2010-06-28 | 2012-08-29 | 三菱電機株式会社 | 樹脂封止形電子制御装置、及びその製造方法 |
EP3053191A4 (de) * | 2014-12-16 | 2017-06-28 | Intel Corporation | Elektronische baugruppe mit gestapelten elektronischen vorrichtungen |
CN107770956A (zh) * | 2016-08-16 | 2018-03-06 | 光宝电子(广州)有限公司 | 电路板结构 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3134385A1 (de) * | 1981-08-31 | 1983-03-10 | Siemens AG, 1000 Berlin und 8000 München | Elektrische baugruppe mit mehreren parallelen leiterplatten |
JPS62261166A (ja) | 1986-05-08 | 1987-11-13 | Matsushita Electronics Corp | 半導体装置 |
JPS6444640U (de) * | 1987-09-11 | 1989-03-16 | ||
JPH01125571A (ja) | 1987-11-10 | 1989-05-18 | Matsushita Electric Ind Co Ltd | 無段変速機付圧縮機 |
JPH0631732Y2 (ja) * | 1988-02-19 | 1994-08-22 | 五洋電子工業株式会社 | 面実装用混成集積回路 |
JPH02146792A (ja) * | 1988-11-28 | 1990-06-05 | Nec Corp | 半導体装置の実装構造 |
JP2760829B2 (ja) * | 1989-01-13 | 1998-06-04 | 株式会社日立製作所 | 電子基板 |
JPH03101188A (ja) | 1989-09-13 | 1991-04-25 | Hitachi Ltd | 電子回路部品の実装方法 |
JP3137977B2 (ja) * | 1990-09-19 | 2001-02-26 | 富士通株式会社 | 多数のリードビンを有する半導体装置 |
JPH04278596A (ja) | 1991-03-06 | 1992-10-05 | Mitsubishi Electric Corp | チップ形電子部品の実装用補助装置 |
US5309324A (en) * | 1991-11-26 | 1994-05-03 | Herandez Jorge M | Device for interconnecting integrated circuit packages to circuit boards |
JPH0629421A (ja) * | 1992-07-09 | 1994-02-04 | Ibiden Co Ltd | 電子部品搭載用基板 |
JPH0685154A (ja) * | 1992-09-07 | 1994-03-25 | Hitachi Ltd | 半導体集積回路装置 |
JPH06152096A (ja) | 1992-11-13 | 1994-05-31 | Fujitsu Ltd | 部品の実装構造 |
US5331591A (en) * | 1993-02-01 | 1994-07-19 | At&T Bell Laboratories | Electronic module including a programmable memory |
JPH0715107A (ja) | 1993-06-29 | 1995-01-17 | Toshiba Corp | プリント基板の多段実装方法 |
JP2541487B2 (ja) * | 1993-11-29 | 1996-10-09 | 日本電気株式会社 | 半導体装置パッケ―ジ |
US5454160A (en) * | 1993-12-03 | 1995-10-03 | Ncr Corporation | Apparatus and method for stacking integrated circuit devices |
US5701233A (en) * | 1995-01-23 | 1997-12-23 | Irvine Sensors Corporation | Stackable modules and multimodular assemblies |
JPH09214097A (ja) * | 1996-02-06 | 1997-08-15 | Toshiba Corp | プリント回路基板 |
JPH10256423A (ja) * | 1997-03-12 | 1998-09-25 | Seiko Epson Corp | 半導体装置およびその実装方法 |
JPH10290054A (ja) * | 1997-04-16 | 1998-10-27 | Sony Corp | プリント配線基板 |
US6160705A (en) * | 1997-05-09 | 2000-12-12 | Texas Instruments Incorporated | Ball grid array package and method using enhanced power and ground distribution circuitry |
JPH117348A (ja) * | 1997-06-19 | 1999-01-12 | Nec Corp | マルチプロセッサ接続方式 |
US6313998B1 (en) * | 1999-04-02 | 2001-11-06 | Legacy Electronics, Inc. | Circuit board assembly having a three dimensional array of integrated circuit packages |
US6404043B1 (en) * | 2000-06-21 | 2002-06-11 | Dense-Pac Microsystems, Inc. | Panel stacking of BGA devices to form three-dimensional modules |
-
1999
- 1999-07-09 EP EP99929780A patent/EP1196014B1/de not_active Expired - Lifetime
- 1999-07-09 DE DE69929337T patent/DE69929337T2/de not_active Expired - Fee Related
- 1999-07-09 WO PCT/JP1999/003731 patent/WO2001005201A1/ja active IP Right Grant
-
2001
- 2001-11-30 US US09/996,736 patent/US6717824B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1196014A4 (de) | 2004-07-14 |
EP1196014A1 (de) | 2002-04-10 |
WO2001005201A1 (fr) | 2001-01-18 |
EP1196014B1 (de) | 2006-01-04 |
US6717824B2 (en) | 2004-04-06 |
DE69929337T2 (de) | 2006-07-06 |
US20020054486A1 (en) | 2002-05-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8328 | Change in the person/name/address of the agent |
Representative=s name: SEEGER SEEGER LINDNER PARTNERSCHAFT PATENTANWAELTE |
|
8339 | Ceased/non-payment of the annual fee |