DE69925198D1 - Flache thermische Sicherung und Herstellungsverfahren - Google Patents

Flache thermische Sicherung und Herstellungsverfahren

Info

Publication number
DE69925198D1
DE69925198D1 DE69925198T DE69925198T DE69925198D1 DE 69925198 D1 DE69925198 D1 DE 69925198D1 DE 69925198 T DE69925198 T DE 69925198T DE 69925198 T DE69925198 T DE 69925198T DE 69925198 D1 DE69925198 D1 DE 69925198D1
Authority
DE
Germany
Prior art keywords
manufacturing process
thermal fuse
flat thermal
flat
fuse
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69925198T
Other languages
English (en)
Other versions
DE69925198T2 (de
Inventor
Toshiro Kawanishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Uchihashi Estec Co Ltd
Original Assignee
Uchihashi Estec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uchihashi Estec Co Ltd filed Critical Uchihashi Estec Co Ltd
Publication of DE69925198D1 publication Critical patent/DE69925198D1/de
Application granted granted Critical
Publication of DE69925198T2 publication Critical patent/DE69925198T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00Thermally-actuated switches
    • H01H37/74Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
    • H01H37/76Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
    • H01H37/761Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00Thermally-actuated switches
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49107Fuse making

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Fuses (AREA)
DE69925198T 1998-06-11 1999-02-26 Flache thermische Sicherung und Herstellungsverfahren Expired - Lifetime DE69925198T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP17967598 1998-06-11
JP17967598A JP4396787B2 (ja) 1998-06-11 1998-06-11 薄型温度ヒュ−ズ及び薄型温度ヒュ−ズの製造方法

Publications (2)

Publication Number Publication Date
DE69925198D1 true DE69925198D1 (de) 2005-06-16
DE69925198T2 DE69925198T2 (de) 2005-11-17

Family

ID=16069918

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69925198T Expired - Lifetime DE69925198T2 (de) 1998-06-11 1999-02-26 Flache thermische Sicherung und Herstellungsverfahren

Country Status (5)

Country Link
US (1) US6040754A (de)
EP (1) EP0964419B1 (de)
JP (1) JP4396787B2 (de)
KR (1) KR100347232B1 (de)
DE (1) DE69925198T2 (de)

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JP3478785B2 (ja) * 2000-07-21 2003-12-15 松下電器産業株式会社 温度ヒューズ及びパック電池
DE10058973A1 (de) * 2000-11-28 2002-05-29 Rolls Royce Deutschland Permanentmagnet-Maschine sowie Sicherungseinrichtung hierfür
CN1251269C (zh) 2001-02-20 2006-04-12 松下电器产业株式会社 温度保险丝
FR2821983B1 (fr) * 2001-03-07 2003-08-15 Schneider Electric Ind Sa Dispositif de raccordement pour accumulateur electrique
US7473487B2 (en) 2001-06-05 2009-01-06 Panasonic Corporation Temperature fuse, and battery using the same
EP1396003A1 (de) * 2001-06-11 2004-03-10 Wickmann-Werke GmbH Sicherungsbauelement
WO2004031426A1 (ja) * 2002-10-07 2004-04-15 Matsushita Electric Industrial Co., Ltd. 温度ヒューズ用素子、温度ヒューズおよびそれを用いた電池
US20040119578A1 (en) * 2002-12-20 2004-06-24 Ching-Lung Tseng Packaging structure for an electronic element
JP2004214033A (ja) * 2002-12-27 2004-07-29 Sony Chem Corp 保護素子
JP2004265618A (ja) 2003-02-05 2004-09-24 Sony Chem Corp 保護素子
JP4223316B2 (ja) * 2003-04-03 2009-02-12 内橋エステック株式会社 二次電池用ヒューズ
WO2004106568A1 (ja) * 2003-05-29 2004-12-09 Matsushita Electric Industrial Co., Ltd. 温度ヒューズ用素子、温度ヒューズ及びそれを用いた電池
JP4207686B2 (ja) 2003-07-01 2009-01-14 パナソニック株式会社 ヒューズ、それを用いたパック電池およびヒューズ製造方法
WO2005006374A2 (en) * 2003-07-11 2005-01-20 Matsushita Electric Industrial Co., Ltd. Fusible alloy and thermal fuse
DE10355282A1 (de) * 2003-11-18 2005-06-16 E.G.O. Elektro-Gerätebau GmbH Verfahren zur Herstellung einer Übertemperatursicherung und Übertemperatursicherung
DE102004033251B3 (de) 2004-07-08 2006-03-09 Vishay Bccomponents Beyschlag Gmbh Schmelzsicherung für einem Chip
US7477130B2 (en) * 2005-01-28 2009-01-13 Littelfuse, Inc. Dual fuse link thin film fuse
US8289123B2 (en) * 2005-07-22 2012-10-16 Littelfuse, Inc. Electrical device with integrally fused conductor
DE112006002655T5 (de) * 2005-10-03 2008-08-14 Littelfuse, Inc., Des Plaines Sicherung mit Hohlraum bildendem Gehäuse
TWI323906B (en) * 2007-02-14 2010-04-21 Besdon Technology Corp Chip-type fuse and method of manufacturing the same
DE102007014338A1 (de) * 2007-03-26 2008-10-02 Robert Bosch Gmbh Thermosicherung
CN101393823B (zh) * 2007-09-21 2010-12-22 比亚迪股份有限公司 一种合金型温度保险丝及其制造方法
JP5287154B2 (ja) * 2007-11-08 2013-09-11 パナソニック株式会社 回路保護素子およびその製造方法
US8525633B2 (en) * 2008-04-21 2013-09-03 Littelfuse, Inc. Fusible substrate
JP5072796B2 (ja) * 2008-05-23 2012-11-14 ソニーケミカル&インフォメーションデバイス株式会社 保護素子及び二次電池装置
US20110163840A1 (en) * 2008-10-28 2011-07-07 Nanjing Sart Science & Technology Development Co., Ltd. High reliability blade fuse and the manufacturing method thereof
JP5130233B2 (ja) * 2009-01-21 2013-01-30 デクセリアルズ株式会社 保護素子
JP5130232B2 (ja) 2009-01-21 2013-01-30 デクセリアルズ株式会社 保護素子
JP5301298B2 (ja) * 2009-01-21 2013-09-25 デクセリアルズ株式会社 保護素子
KR101279994B1 (ko) * 2010-10-15 2013-07-05 주식회사 엘지화학 전극리드에 안전부재가 위치한 구조의 캡 어셈블리 및 이를 포함하고 있는 원통형 전지
KR101711977B1 (ko) 2011-10-25 2017-03-06 삼성에스디아이 주식회사 이차 전지
WO2013081375A1 (ko) * 2011-11-28 2013-06-06 주식회사 엘지화학 배터리 모듈 및 배터리 모듈에 적용되는 버스 바
JP5844669B2 (ja) * 2012-03-26 2016-01-20 デクセリアルズ株式会社 保護素子
JP6382028B2 (ja) * 2014-08-26 2018-08-29 デクセリアルズ株式会社 回路基板及び電子部品の実装方法
CN111180649B (zh) * 2019-12-30 2021-06-11 合肥国轩高科动力能源有限公司 一体式高温分解接插件及含有该接插件的锂离子电池

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US4272753A (en) * 1978-08-16 1981-06-09 Harris Corporation Integrated circuit fuse
JPS56160648A (en) * 1980-05-14 1981-12-10 Fuji Electric Co Ltd Oxygen sensor
JPS57117255A (en) * 1981-01-12 1982-07-21 Toshiba Corp Semiconductor ic device
JPS57122565A (en) * 1981-01-22 1982-07-30 Toshiba Corp Semiconductor device
US4626818A (en) * 1983-11-28 1986-12-02 Centralab, Inc. Device for programmable thick film networks
US4924203A (en) * 1987-03-24 1990-05-08 Cooper Industries, Inc. Wire bonded microfuse and method of making
US4873506A (en) * 1988-03-09 1989-10-10 Cooper Industries, Inc. Metallo-organic film fractional ampere fuses and method of making
JPH01272133A (ja) * 1988-04-22 1989-10-31 Mitsubishi Electric Corp 半導体装置
JPH01295440A (ja) * 1988-05-24 1989-11-29 Nissan Motor Co Ltd 半導体装置
JPH02100221A (ja) * 1988-10-07 1990-04-12 Fujikura Ltd 温度ヒューズおよびその形成方法
JPH0795419B2 (ja) * 1989-02-27 1995-10-11 内橋エステック株式会社 薄形ヒューズ
JP2524859B2 (ja) * 1990-02-01 1996-08-14 内橋エステック株式会社 抵抗・温度ヒュ―ズ並びにその製造方法
CH682959A5 (fr) * 1990-05-04 1993-12-15 Battelle Memorial Institute Fusible.
JPH0465046A (ja) * 1990-07-02 1992-03-02 Tateyama Kagaku Kogyo Kk チップ形ヒューズ抵抗器
US5099219A (en) * 1991-02-28 1992-03-24 Rock, Ltd. Partnership Fusible flexible printed circuit and method of making same
US5097247A (en) * 1991-06-03 1992-03-17 North American Philips Corporation Heat actuated fuse apparatus with solder link
JPH04365351A (ja) * 1991-06-13 1992-12-17 Nec Corp 半導体集積回路装置
DE4222278C1 (de) * 1992-07-07 1994-03-31 Roederstein Kondensatoren Verfahren zur Herstellung elektrischer Dickschichtsicherungen
JP2624439B2 (ja) * 1993-04-30 1997-06-25 コーア株式会社 回路保護用素子
US5432378A (en) * 1993-12-15 1995-07-11 Cooper Industries, Inc. Subminiature surface mounted circuit protector
US5453726A (en) * 1993-12-29 1995-09-26 Aem (Holdings), Inc. High reliability thick film surface mount fuse assembly
US5552757A (en) * 1994-05-27 1996-09-03 Littelfuse, Inc. Surface-mounted fuse device
US5712610C1 (en) * 1994-08-19 2002-06-25 Sony Chemicals Corp Protective device
JP2670756B2 (ja) * 1995-02-02 1997-10-29 釜屋電機株式会社 チップ形ヒューズ抵抗器、及びその製造方法
JP3774871B2 (ja) * 1995-10-16 2006-05-17 松尾電機株式会社 遅延型薄膜ヒューズ
JPH1012111A (ja) * 1996-06-18 1998-01-16 Uchihashi Estec Co Ltd 合金型温度ヒュ−ズ及びその製造方法
JP3754770B2 (ja) * 1996-10-01 2006-03-15 内橋エステック株式会社 薄型ヒュ−ズ

Also Published As

Publication number Publication date
KR100347232B1 (ko) 2002-08-01
KR20000005584A (ko) 2000-01-25
JPH11353996A (ja) 1999-12-24
EP0964419A1 (de) 1999-12-15
EP0964419B1 (de) 2005-05-11
US6040754A (en) 2000-03-21
JP4396787B2 (ja) 2010-01-13
DE69925198T2 (de) 2005-11-17

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Legal Events

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8364 No opposition during term of opposition