DE69838880D1 - Druckkontakt-halbleiteranordnung - Google Patents

Druckkontakt-halbleiteranordnung

Info

Publication number
DE69838880D1
DE69838880D1 DE69838880T DE69838880T DE69838880D1 DE 69838880 D1 DE69838880 D1 DE 69838880D1 DE 69838880 T DE69838880 T DE 69838880T DE 69838880 T DE69838880 T DE 69838880T DE 69838880 D1 DE69838880 D1 DE 69838880D1
Authority
DE
Germany
Prior art keywords
semiconductor device
pressure contact
contact semiconductor
pressure
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69838880T
Other languages
English (en)
Other versions
DE69838880T2 (de
Inventor
Katsumi Satoh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE69838880D1 publication Critical patent/DE69838880D1/de
Application granted granted Critical
Publication of DE69838880T2 publication Critical patent/DE69838880T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Thyristors (AREA)
  • Semiconductor Integrated Circuits (AREA)
DE69838880T 1998-09-10 1998-09-10 Druckkontakt-halbleiteranordnung Expired - Lifetime DE69838880T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP1998/004104 WO2000016394A1 (fr) 1998-09-10 1998-09-10 Dispositif semi-conducteur a contact par pression

Publications (2)

Publication Number Publication Date
DE69838880D1 true DE69838880D1 (de) 2008-01-31
DE69838880T2 DE69838880T2 (de) 2008-12-11

Family

ID=14208984

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69838880T Expired - Lifetime DE69838880T2 (de) 1998-09-10 1998-09-10 Druckkontakt-halbleiteranordnung

Country Status (5)

Country Link
US (1) US6423988B1 (de)
EP (1) EP1030355B1 (de)
JP (1) JP3351537B2 (de)
DE (1) DE69838880T2 (de)
WO (1) WO2000016394A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005054543A1 (de) * 2005-11-14 2007-05-31 Peter Köllensperger Halbleiterschalter mit integrierter Ansteuerschaltung
EP2161746A1 (de) 2008-09-08 2010-03-10 Converteam Technology Ltd Halbleiterschaltvorrichtungen
GB2529338B (en) * 2013-05-13 2019-03-20 Abb Schweiz Ag Spacer system for a semiconductor switching device

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3616185A1 (de) * 1986-05-14 1987-11-19 Semikron Elektronik Gmbh Halbleiterbauelement
JPS63236360A (ja) * 1987-03-25 1988-10-03 Hitachi Ltd ゲ−トタ−ンオフサイリスタ
JPH04352457A (ja) * 1991-05-30 1992-12-07 Mitsubishi Electric Corp 圧接型半導体装置及びその製造方法
JPH05218397A (ja) * 1992-01-31 1993-08-27 Meidensha Corp 圧接型半導体素子
DE4227063A1 (de) 1992-08-15 1994-02-17 Abb Research Ltd Abschaltbares Hochleistungs-Halbleiterbauelement
JPH07312420A (ja) * 1994-05-18 1995-11-28 Toyo Electric Mfg Co Ltd 圧接形半導体装置のゲート電極構造
JPH08186135A (ja) * 1994-12-27 1996-07-16 Toyo Electric Mfg Co Ltd 圧接形半導体装置および製造方法
DE19505387A1 (de) 1995-02-17 1996-08-22 Abb Management Ag Druckkontaktgehäuse für Halbleiterbauelemente
JP3291977B2 (ja) * 1995-05-31 2002-06-17 三菱電機株式会社 圧接型半導体素子及びその製造方法並びに圧接型半導体装置
JP3191653B2 (ja) * 1996-01-17 2001-07-23 三菱電機株式会社 パワーデバイス用半導体スイッチング装置
JPH1022433A (ja) * 1996-07-08 1998-01-23 Daido Steel Co Ltd 耐食性に優れたＦｅ─Ｃｒ合金系リードフレーム材およびその製造方法

Also Published As

Publication number Publication date
US6423988B1 (en) 2002-07-23
EP1030355B1 (de) 2007-12-19
JP3351537B2 (ja) 2002-11-25
EP1030355A1 (de) 2000-08-23
WO2000016394A1 (fr) 2000-03-23
EP1030355A4 (de) 2006-02-01
DE69838880T2 (de) 2008-12-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)