DE69830905D1 - Vorrichtung zur behandlung von einzelnen halbleiterscheiben mit mehreren schleusenkammern und verfahren zum beladen und entladen - Google Patents

Vorrichtung zur behandlung von einzelnen halbleiterscheiben mit mehreren schleusenkammern und verfahren zum beladen und entladen

Info

Publication number
DE69830905D1
DE69830905D1 DE69830905T DE69830905T DE69830905D1 DE 69830905 D1 DE69830905 D1 DE 69830905D1 DE 69830905 T DE69830905 T DE 69830905T DE 69830905 T DE69830905 T DE 69830905T DE 69830905 D1 DE69830905 D1 DE 69830905D1
Authority
DE
Germany
Prior art keywords
unloading
loading
individual semiconductor
treating individual
semiconductor discs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69830905T
Other languages
English (en)
Other versions
DE69830905T2 (de
Inventor
C Edwards
Marian Zielenski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Application granted granted Critical
Publication of DE69830905D1 publication Critical patent/DE69830905D1/de
Publication of DE69830905T2 publication Critical patent/DE69830905T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/907—Continuous processing
    • Y10S438/908—Utilizing cluster apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE69830905T 1997-05-08 1998-05-06 Vorrichtung zur behandlung von einzelnen halbleiterscheiben mit mehreren schleusenkammern und verfahren zum beladen und entladen Expired - Fee Related DE69830905T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US853172 1997-05-08
US08/853,172 US5944857A (en) 1997-05-08 1997-05-08 Multiple single-wafer loadlock wafer processing apparatus and loading and unloading method therefor
PCT/US1998/009277 WO1998050946A1 (en) 1997-05-08 1998-05-06 Multiple single-wafer loadlock wafer processing apparatus and loading and unloading method therefor

Publications (2)

Publication Number Publication Date
DE69830905D1 true DE69830905D1 (de) 2005-08-25
DE69830905T2 DE69830905T2 (de) 2006-05-24

Family

ID=25315268

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69830905T Expired - Fee Related DE69830905T2 (de) 1997-05-08 1998-05-06 Vorrichtung zur behandlung von einzelnen halbleiterscheiben mit mehreren schleusenkammern und verfahren zum beladen und entladen

Country Status (8)

Country Link
US (1) US5944857A (de)
EP (1) EP0980585B1 (de)
JP (1) JP2001524267A (de)
KR (1) KR100591025B1 (de)
CN (1) CN1255235A (de)
DE (1) DE69830905T2 (de)
TW (1) TW409272B (de)
WO (1) WO1998050946A1 (de)

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US7039495B1 (en) * 1998-12-08 2006-05-02 Advance Micro Devices, Inc. Management of multiple types of empty carriers in automated material handling systems
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US6333775B1 (en) * 1999-01-13 2001-12-25 Euv Llc Extreme-UV lithography vacuum chamber zone seal
US6440261B1 (en) 1999-05-25 2002-08-27 Applied Materials, Inc. Dual buffer chamber cluster tool for semiconductor wafer processing
US6309161B1 (en) * 1999-11-04 2001-10-30 Brooks Automation, Inc. Load lock with vertically movable support
US6558509B2 (en) * 1999-11-30 2003-05-06 Applied Materials, Inc. Dual wafer load lock
US6410455B1 (en) 1999-11-30 2002-06-25 Wafermasters, Inc. Wafer processing system
US6949143B1 (en) * 1999-12-15 2005-09-27 Applied Materials, Inc. Dual substrate loadlock process equipment
US6977014B1 (en) * 2000-06-02 2005-12-20 Novellus Systems, Inc. Architecture for high throughput semiconductor processing applications
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US6235656B1 (en) 2000-07-03 2001-05-22 Andrew Peter Clarke Dual degas/cool loadlock cluster tool
TW512421B (en) * 2000-09-15 2002-12-01 Applied Materials Inc Double dual slot load lock for process equipment
JP2002313867A (ja) * 2001-02-09 2002-10-25 Toshiba Corp 半導体装置の製造方法
KR20020072448A (ko) * 2001-03-10 2002-09-16 주식회사 아이피에스 자동연속 웨이퍼가공시스템 및 그를 이용한 웨이퍼가공방법
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US7316966B2 (en) * 2001-09-21 2008-01-08 Applied Materials, Inc. Method for transferring substrates in a load lock chamber
US6701972B2 (en) 2002-01-11 2004-03-09 The Boc Group, Inc. Vacuum load lock, system including vacuum load lock, and associated methods
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US7258520B2 (en) 2002-08-31 2007-08-21 Applied Materials, Inc. Methods and apparatus for using substrate carrier movement to actuate substrate carrier door opening/closing
US6696367B1 (en) 2002-09-27 2004-02-24 Asm America, Inc. System for the improved handling of wafers within a process tool
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SG115629A1 (en) 2003-03-11 2005-10-28 Asml Netherlands Bv Method and apparatus for maintaining a machine part
SG115631A1 (en) * 2003-03-11 2005-10-28 Asml Netherlands Bv Lithographic projection assembly, load lock and method for transferring objects
US7207766B2 (en) * 2003-10-20 2007-04-24 Applied Materials, Inc. Load lock chamber for large area substrate processing system
US8313277B2 (en) 2003-11-10 2012-11-20 Brooks Automation, Inc. Semiconductor manufacturing process modules
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
US8696298B2 (en) * 2003-11-10 2014-04-15 Brooks Automation, Inc. Semiconductor manufacturing process modules
US20070269297A1 (en) 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
US7497414B2 (en) * 2004-06-14 2009-03-03 Applied Materials, Inc. Curved slit valve door with flexible coupling
US7611319B2 (en) 2004-06-16 2009-11-03 Applied Materials, Inc. Methods and apparatus for identifying small lot size substrate carriers
US8668422B2 (en) * 2004-08-17 2014-03-11 Mattson Technology, Inc. Low cost high throughput processing platform
JP4599405B2 (ja) * 2004-08-17 2010-12-15 マットソン テクノロジイ インコーポレイテッド ウェハ処理システムのための、ウェハ移送装置及びウェハ移送方法
US7720558B2 (en) 2004-09-04 2010-05-18 Applied Materials, Inc. Methods and apparatus for mapping carrier contents
US7314808B2 (en) * 2004-12-23 2008-01-01 Applied Materials, Inc. Method for sequencing substrates
US7467916B2 (en) * 2005-03-08 2008-12-23 Asm Japan K.K. Semiconductor-manufacturing apparatus equipped with cooling stage and semiconductor-manufacturing method using same
JP4860167B2 (ja) * 2005-03-30 2012-01-25 東京エレクトロン株式会社 ロードロック装置，処理システム及び処理方法
KR100737716B1 (ko) * 2005-05-26 2007-07-10 주식회사 에이디피엔지니어링 플라즈마 처리장치
US20070006936A1 (en) * 2005-07-07 2007-01-11 Applied Materials, Inc. Load lock chamber with substrate temperature regulation
US8074597B2 (en) 2006-01-11 2011-12-13 Applied Materials, Inc. Methods and apparatus for purging a substrate carrier
US7845891B2 (en) 2006-01-13 2010-12-07 Applied Materials, Inc. Decoupled chamber body
US20080067368A1 (en) * 2006-04-19 2008-03-20 Mks Instruments Inc Ionizing system for vacuum process and metrology equipment
US7665951B2 (en) 2006-06-02 2010-02-23 Applied Materials, Inc. Multiple slot load lock chamber and method of operation
US8124907B2 (en) 2006-08-04 2012-02-28 Applied Materials, Inc. Load lock chamber with decoupled slit valve door seal compartment
US7559976B2 (en) * 2006-10-24 2009-07-14 Henry Krigmont Multi-stage collector for multi-pollutant control
US20080219807A1 (en) * 2007-03-05 2008-09-11 Van Der Meulen Peter Semiconductor manufacturing process modules
DE102007022431A1 (de) 2007-05-09 2008-11-13 Leybold Optics Gmbh Behandlungssystem für flache Substrate
KR101887110B1 (ko) * 2007-05-18 2018-08-09 브룩스 오토메이션 인코퍼레이티드 빠른 교환 로봇을 가진 컴팩트 기판 운송 시스템
KR101359401B1 (ko) * 2007-06-21 2014-02-10 주성엔지니어링(주) 고효율 박막 태양전지와 그 제조방법 및 제조장치
CN101785094A (zh) * 2007-08-31 2010-07-21 佳能安内华股份有限公司 基板处理设备
US7582145B2 (en) * 2007-12-17 2009-09-01 Krigmont Henry V Space efficient hybrid collector
US7582144B2 (en) * 2007-12-17 2009-09-01 Henry Krigmont Space efficient hybrid air purifier
JP4784599B2 (ja) * 2007-12-28 2011-10-05 東京エレクトロン株式会社 真空処理装置及び真空処理方法並びに記憶媒体
US7597750B1 (en) 2008-05-12 2009-10-06 Henry Krigmont Hybrid wet electrostatic collector
JP5139253B2 (ja) * 2008-12-18 2013-02-06 東京エレクトロン株式会社 真空処理装置及び真空搬送装置
US8246284B2 (en) 2009-03-05 2012-08-21 Applied Materials, Inc. Stacked load-lock apparatus and method for high throughput solar cell manufacturing
CN102212877B (zh) * 2010-07-09 2012-08-22 江苏中晟半导体设备有限公司 具有多个外延反应腔的mocvd系统及其操作方法
JP6181358B2 (ja) * 2012-07-25 2017-08-16 東京エレクトロン株式会社 ベーク処理システム及び有機ｅｌ素子の有機機能膜の積層体の製造方法
US20140272684A1 (en) * 2013-03-12 2014-09-18 Applied Materials, Inc. Extreme ultraviolet lithography mask blank manufacturing system and method of operation therefor
GB201421151D0 (en) * 2014-11-28 2015-01-14 Spts Technologies Ltd Method of degassing
TW201639063A (zh) 2015-01-22 2016-11-01 應用材料股份有限公司 批量加熱和冷卻腔室或負載鎖定裝置
US11802340B2 (en) * 2016-12-12 2023-10-31 Applied Materials, Inc. UHV in-situ cryo-cool chamber
JP2018174186A (ja) * 2017-03-31 2018-11-08 東京エレクトロン株式会社 基板処理装置
JP7246256B2 (ja) * 2019-05-29 2023-03-27 東京エレクトロン株式会社 搬送方法及び搬送システム
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Also Published As

Publication number Publication date
KR100591025B1 (ko) 2006-06-22
DE69830905T2 (de) 2006-05-24
CN1255235A (zh) 2000-05-31
US5944857A (en) 1999-08-31
KR20010012366A (ko) 2001-02-15
TW409272B (en) 2000-10-21
EP0980585A1 (de) 2000-02-23
WO1998050946A1 (en) 1998-11-12
EP0980585B1 (de) 2005-07-20
JP2001524267A (ja) 2001-11-27

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Legal Events

Date Code Title Description
8325 Change of the main classification

Ipc: H01L 2100 20000101

8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee