DE69303527D1 - Verfahren zur Behandlung von kleinen Löchern in Substratmaterial - Google Patents

Verfahren zur Behandlung von kleinen Löchern in Substratmaterial

Info

Publication number
DE69303527D1
DE69303527D1 DE69303527T DE69303527T DE69303527D1 DE 69303527 D1 DE69303527 D1 DE 69303527D1 DE 69303527 T DE69303527 T DE 69303527T DE 69303527 T DE69303527 T DE 69303527T DE 69303527 D1 DE69303527 D1 DE 69303527D1
Authority
DE
Germany
Prior art keywords
substrate material
small holes
treating small
treating
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69303527T
Other languages
English (en)
Other versions
DE69303527T2 (de
Inventor
Kazuo Ohba
Kaori Shima
Akira Ohba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sakae Electronics Industrial Co Ltd
Sakae Electronics Ind Co Ltd
Original Assignee
Sakae Electronics Industrial Co Ltd
Sakae Electronics Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sakae Electronics Industrial Co Ltd, Sakae Electronics Ind Co Ltd filed Critical Sakae Electronics Industrial Co Ltd
Application granted granted Critical
Publication of DE69303527D1 publication Critical patent/DE69303527D1/de
Publication of DE69303527T2 publication Critical patent/DE69303527T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/26—Plasma torches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K10/00—Welding or cutting by means of a plasma
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • ing And Chemical Polishing (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Drilling And Boring (AREA)
  • Arc Welding In General (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Drying Of Semiconductors (AREA)
  • Photovoltaic Devices (AREA)
DE69303527T 1992-04-07 1993-04-06 Verfahren zur Behandlung von kleinen Löchern in Substratmaterial Expired - Fee Related DE69303527T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4085654A JPH0783999B2 (ja) 1992-04-07 1992-04-07 基板材料の小径穴加工方法

Publications (2)

Publication Number Publication Date
DE69303527D1 true DE69303527D1 (de) 1996-08-14
DE69303527T2 DE69303527T2 (de) 1996-12-19

Family

ID=13864818

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69303527T Expired - Fee Related DE69303527T2 (de) 1992-04-07 1993-04-06 Verfahren zur Behandlung von kleinen Löchern in Substratmaterial
DE93302690T Pending DE565341T1 (de) 1992-04-07 1993-04-06 Verfahren zum Bohren von kleinen Löchern in Substratmaterial.

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE93302690T Pending DE565341T1 (de) 1992-04-07 1993-04-06 Verfahren zum Bohren von kleinen Löchern in Substratmaterial.

Country Status (5)

Country Link
US (1) US5322985A (de)
EP (1) EP0565341B1 (de)
JP (1) JPH0783999B2 (de)
KR (1) KR960013710B1 (de)
DE (2) DE69303527T2 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2634536B2 (ja) * 1992-06-11 1997-07-30 栄電子工業株式会社 ドライプロセスコーティング加工方法および加工装置
JP2607346B2 (ja) * 1994-03-04 1997-05-07 栄電子工業株式会社 基板材料の小径穴加工方法
JP2680986B2 (ja) * 1994-03-17 1997-11-19 栄電子工業株式会社 プリント基板の小径穴加工方法及び装置
JP2625078B2 (ja) * 1994-03-29 1997-06-25 栄電子工業株式会社 基板材料の小径穴加工方法及び装置
JP2614697B2 (ja) * 1994-03-29 1997-05-28 栄電子工業株式会社 小径穴加工装置及びそれを使用する小径穴加工方法
JPH08132392A (ja) * 1994-11-02 1996-05-28 Sakae Denshi Kogyo Kk 基板材料の小径穴加工方法及び装置
JP2618211B2 (ja) * 1994-11-25 1997-06-11 栄電子工業株式会社 放電処理方法
US5581083A (en) * 1995-05-11 1996-12-03 The Regents Of The University Of California Method for fabricating a sensor on a probe tip used for atomic force microscopy and the like
US5838005A (en) * 1995-05-11 1998-11-17 The Regents Of The University Of California Use of focused ion and electron beams for fabricating a sensor on a probe tip used for scanning multiprobe microscopy and the like
JP4004596B2 (ja) * 1997-08-05 2007-11-07 一成 高木 プラスチックフィルムの製造方法
DE102008028167A1 (de) 2008-06-12 2009-12-31 Maschinenfabrik Reinhausen Gmbh Vorrichtung zur Erzeugung eines Plasma-Jets
DE202008018264U1 (de) 2008-06-12 2012-07-04 Maschinenfabrik Reinhausen Gmbh Vorrichtung zur Erzeugung eines Plasma-Jets
AT514283B1 (de) * 2013-04-19 2015-09-15 Tannpapier Gmbh Plasmaperforation
AT515408B1 (de) * 2014-04-03 2015-09-15 Tannpapier Gmbh Diffusionsoptimiertes Mundstückbelagpapier
US9757776B2 (en) * 2014-10-16 2017-09-12 The Boeing Company Clearing of apertures by plasma jets

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3862396A (en) * 1972-07-17 1975-01-21 Sanyo Kokusaku Pulp Co Apparatus for making perforations in sheet material by electric discharge
US4012307A (en) * 1975-12-05 1977-03-15 General Dynamics Corporation Method for conditioning drilled holes in multilayer wiring boards
FR2457148A1 (fr) * 1979-05-25 1980-12-19 Electricite De France Procede et dispositif d'elimination locale de revetement metallique
US4495399A (en) * 1981-03-26 1985-01-22 Cann Gordon L Micro-arc milling of metallic and non-metallic substrates
JPS57186389A (en) * 1981-05-11 1982-11-16 Hitachi Ltd Method of opening hole of printed board
JPS584398A (ja) * 1981-06-25 1983-01-11 三菱電機株式会社 穴明け装置
DE3316118C2 (de) * 1983-05-03 1986-10-16 Gerhard Dr.-Ing. 8501 Eckenthal Feld Verfahren zum Herstellen einer wasserdampfdurchlässigen Materialbahn
US4635358A (en) * 1985-01-03 1987-01-13 E. I. Du Pont De Nemours And Company Method for forming electrically conductive paths through a dielectric layer
US4721550A (en) * 1986-05-05 1988-01-26 New West Technology Corporation Process for producing printed circuit board having improved adhesion
US4787957A (en) * 1987-09-25 1988-11-29 Air Products And Chemicals, Inc. Desmear and etchback using NF3 /O2 gas mixtures

Also Published As

Publication number Publication date
DE69303527T2 (de) 1996-12-19
DE565341T1 (de) 1994-02-03
JPH05285895A (ja) 1993-11-02
EP0565341A3 (en) 1994-05-25
US5322985A (en) 1994-06-21
EP0565341A2 (de) 1993-10-13
EP0565341B1 (de) 1996-07-10
KR930021309A (ko) 1993-11-22
JPH0783999B2 (ja) 1995-09-13
KR960013710B1 (ko) 1996-10-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee