DE69825928D1 - Verfahren und Herstellung einer dünnen Schicht - Google Patents

Verfahren und Herstellung einer dünnen Schicht

Info

Publication number
DE69825928D1
DE69825928D1 DE69825928T DE69825928T DE69825928D1 DE 69825928 D1 DE69825928 D1 DE 69825928D1 DE 69825928 T DE69825928 T DE 69825928T DE 69825928 T DE69825928 T DE 69825928T DE 69825928 D1 DE69825928 D1 DE 69825928D1
Authority
DE
Germany
Prior art keywords
layer
porous
substrate
separated
production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69825928T
Other languages
English (en)
Other versions
DE69825928T2 (de
Inventor
Masaaki Iwane
Takao Yonehara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of DE69825928D1 publication Critical patent/DE69825928D1/de
Publication of DE69825928T2 publication Critical patent/DE69825928T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H01L21/2003—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy characterised by the substrate
    • H01L21/2007—Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer
DE69825928T 1997-03-26 1998-03-24 Verfahren und Herstellung einer dünnen Schicht Expired - Lifetime DE69825928T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7369197 1997-03-26
JP7369197 1997-03-26

Publications (2)

Publication Number Publication Date
DE69825928D1 true DE69825928D1 (de) 2004-10-07
DE69825928T2 DE69825928T2 (de) 2005-09-08

Family

ID=13525505

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69825928T Expired - Lifetime DE69825928T2 (de) 1997-03-26 1998-03-24 Verfahren und Herstellung einer dünnen Schicht

Country Status (10)

Country Link
US (2) US6133112A (de)
EP (1) EP0867920B1 (de)
KR (1) KR100345354B1 (de)
CN (1) CN1112721C (de)
AT (1) ATE275288T1 (de)
AU (1) AU731697B2 (de)
CA (1) CA2233028C (de)
DE (1) DE69825928T2 (de)
SG (1) SG71094A1 (de)
TW (1) TW398038B (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7148119B1 (en) * 1994-03-10 2006-12-12 Canon Kabushiki Kaisha Process for production of semiconductor substrate
SG70141A1 (en) 1997-12-26 2000-01-25 Canon Kk Sample separating apparatus and method and substrate manufacturing method
JP3500063B2 (ja) * 1998-04-23 2004-02-23 信越半導体株式会社 剥離ウエーハを再利用する方法および再利用に供されるシリコンウエーハ
TW484184B (en) * 1998-11-06 2002-04-21 Canon Kk Sample separating apparatus and method, and substrate manufacturing method
JP4313874B2 (ja) * 1999-02-02 2009-08-12 キヤノン株式会社 基板の製造方法
US6602767B2 (en) 2000-01-27 2003-08-05 Canon Kabushiki Kaisha Method for transferring porous layer, method for making semiconductor devices, and method for making solar battery
JP3982218B2 (ja) * 2001-02-07 2007-09-26 ソニー株式会社 半導体装置およびその製造方法
DE102004060363B4 (de) * 2004-12-15 2010-12-16 Austriamicrosystems Ag Halbleitersubstrat mit pn-Übergang und Verfahren zur Herstellung
US7429521B2 (en) * 2006-03-30 2008-09-30 Intel Corporation Capillary underfill of stacked wafers
DE102007021991B4 (de) * 2007-05-10 2015-03-26 Infineon Technologies Austria Ag Verfahren zum Herstellen eines Halbleiterbauelements durch Ausbilden einer porösen Zwischenschicht
US9409383B2 (en) * 2008-12-22 2016-08-09 Apple Inc. Layer-specific energy distribution delamination
US8242591B2 (en) 2009-08-13 2012-08-14 International Business Machines Corporation Electrostatic chucking of an insulator handle substrate
DE102009053262A1 (de) * 2009-11-13 2011-05-19 Institut Für Solarenergieforschung Gmbh Verfahren zum Bilden von dünnen Halbleiterschichtsubstraten sowie Verfahren zum Herstellen eines Halbleiterbauelements, insbesondere einer Solarzelle, mit einem solchen Halbleiterschichtsubstrat
US8945344B2 (en) * 2012-07-20 2015-02-03 Taiwan Semiconductor Manufacturing Company, Ltd. Systems and methods of separating bonded wafers
US9721896B2 (en) * 2015-09-11 2017-08-01 Taiwan Semiconductor Manufacturing Company, Ltd. Interconnection structure, fabricating method thereof, and semiconductor device using the same
WO2017223296A1 (en) * 2016-06-24 2017-12-28 Crystal Solar Inc. Semiconductor layer separation from single crystal silicon substrate by infrared irradiation of porous silicon separation layer
DE102019114328B4 (de) * 2018-05-31 2022-03-03 Rohm Co. Ltd Halbleitersubstratstruktur und leistungshalbleitervorrichtung

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE143981C (de) *
US4237150A (en) * 1979-04-18 1980-12-02 The United States Of America As Represented By The United States Department Of Energy Method of producing hydrogenated amorphous silicon film
US4392011A (en) * 1980-04-30 1983-07-05 Rca Corporation Solar cell structure incorporating a novel single crystal silicon material
DE69006353T2 (de) * 1990-05-25 1994-06-23 Ibm Verfahren und Vorrichtung zum Spalten von Halbleiterplatten und Bekleiden der gespalteten Facetten.
KR950014609B1 (ko) * 1990-08-03 1995-12-11 캐논 가부시끼가이샤 반도체부재 및 반도체부재의 제조방법
FR2681472B1 (fr) * 1991-09-18 1993-10-29 Commissariat Energie Atomique Procede de fabrication de films minces de materiau semiconducteur.
US5371564A (en) * 1992-03-09 1994-12-06 Nikon Corporation Shutter device in a camera
TW330313B (en) * 1993-12-28 1998-04-21 Canon Kk A semiconductor substrate and process for producing same
FR2715501B1 (fr) * 1994-01-26 1996-04-05 Commissariat Energie Atomique Procédé de dépôt de lames semiconductrices sur un support.
JP3352340B2 (ja) 1995-10-06 2002-12-03 キヤノン株式会社 半導体基体とその製造方法
JP3257580B2 (ja) * 1994-03-10 2002-02-18 キヤノン株式会社 半導体基板の作製方法
FR2725074B1 (fr) 1994-09-22 1996-12-20 Commissariat Energie Atomique Procede de fabrication d'une structure comportant une couche mince semi-conductrice sur un substrat
JP2689935B2 (ja) * 1995-02-01 1997-12-10 日本電気株式会社 半導体薄膜形成方法
JP3381443B2 (ja) * 1995-02-02 2003-02-24 ソニー株式会社 基体から半導体層を分離する方法、半導体素子の製造方法およびｓｏｉ基板の製造方法
US6103598A (en) * 1995-07-13 2000-08-15 Canon Kabushiki Kaisha Process for producing semiconductor substrate
JPH0929472A (ja) * 1995-07-14 1997-02-04 Hitachi Ltd 割断方法、割断装置及びチップ材料
US5893747A (en) * 1995-10-07 1999-04-13 Hyundai Electronics Industries Co., Ltd. Method of manufacturing a polysilicon film of a semiconductor device
JPH11503880A (ja) * 1996-02-09 1999-03-30 フィリップス エレクトロニクス ネムローゼ フェンノートシャップ 半導体材料のウエファに形成された半導体素子のレーザ分割方法
FR2748851B1 (fr) * 1996-05-15 1998-08-07 Commissariat Energie Atomique Procede de realisation d'une couche mince de materiau semiconducteur
SG55413A1 (en) 1996-11-15 1998-12-21 Method Of Manufacturing Semico Method of manufacturing semiconductor article
US6054363A (en) 1996-11-15 2000-04-25 Canon Kabushiki Kaisha Method of manufacturing semiconductor article
SG65697A1 (en) 1996-11-15 1999-06-22 Canon Kk Process for producing semiconductor article
CA2220600C (en) * 1996-11-15 2002-02-12 Canon Kabushiki Kaisha Method of manufacturing semiconductor article
ATE261612T1 (de) 1996-12-18 2004-03-15 Canon Kk Vefahren zum herstellen eines halbleiterartikels unter verwendung eines substrates mit einer porösen halbleiterschicht
US6033974A (en) 1997-05-12 2000-03-07 Silicon Genesis Corporation Method for controlled cleaving process
US6013563A (en) 1997-05-12 2000-01-11 Silicon Genesis Corporation Controlled cleaning process

Also Published As

Publication number Publication date
ATE275288T1 (de) 2004-09-15
EP0867920A3 (de) 1999-06-16
US6534383B1 (en) 2003-03-18
AU5951998A (en) 1998-10-01
CN1195880A (zh) 1998-10-14
CN1112721C (zh) 2003-06-25
TW398038B (en) 2000-07-11
US6133112A (en) 2000-10-17
SG71094A1 (en) 2000-03-21
KR19980080550A (ko) 1998-11-25
CA2233028C (en) 2002-08-20
EP0867920B1 (de) 2004-09-01
KR100345354B1 (ko) 2002-09-18
EP0867920A2 (de) 1998-09-30
DE69825928T2 (de) 2005-09-08
AU731697B2 (en) 2001-04-05
CA2233028A1 (en) 1998-09-26

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Legal Events

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