DE69820830D1 - Wärmeableitung und EMI-Abschirmungsstruktur für einen Rechner des Typs Notebook - Google Patents

Wärmeableitung und EMI-Abschirmungsstruktur für einen Rechner des Typs Notebook

Info

Publication number
DE69820830D1
DE69820830D1 DE69820830T DE69820830T DE69820830D1 DE 69820830 D1 DE69820830 D1 DE 69820830D1 DE 69820830 T DE69820830 T DE 69820830T DE 69820830 T DE69820830 T DE 69820830T DE 69820830 D1 DE69820830 D1 DE 69820830D1
Authority
DE
Germany
Prior art keywords
heat dissipation
notebook computer
shielding structure
emi shielding
emi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69820830T
Other languages
English (en)
Other versions
DE69820830T2 (de
Inventor
Timothy J Jondrow
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Application granted granted Critical
Publication of DE69820830D1 publication Critical patent/DE69820830D1/de
Publication of DE69820830T2 publication Critical patent/DE69820830T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Power Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE69820830T 1997-10-15 1998-10-14 Wärmeableitung und EMI-Abschirmungsstruktur für einen Rechner des Typs Notebook Expired - Fee Related DE69820830T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/951,191 US5953206A (en) 1997-10-15 1997-10-15 Thermal dissipation and EMI shielding structure for notebook computers
US951191 1997-10-15

Publications (2)

Publication Number Publication Date
DE69820830D1 true DE69820830D1 (de) 2004-02-05
DE69820830T2 DE69820830T2 (de) 2004-12-02

Family

ID=25491398

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69820830T Expired - Fee Related DE69820830T2 (de) 1997-10-15 1998-10-14 Wärmeableitung und EMI-Abschirmungsstruktur für einen Rechner des Typs Notebook

Country Status (4)

Country Link
US (1) US5953206A (de)
EP (1) EP0910005B1 (de)
JP (1) JP3027147B2 (de)
DE (1) DE69820830T2 (de)

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US20060120034A1 (en) * 2004-12-03 2006-06-08 Ching-Hsien Huang LCD structure with excellent heat dissipation efficiency
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JP2007150192A (ja) * 2005-11-30 2007-06-14 Toshiba Corp ヒートパイプを有した放熱器を備える情報処理装置
US7262369B1 (en) 2006-03-09 2007-08-28 Laird Technologies, Inc. Combined board level EMI shielding and thermal management
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US7623360B2 (en) 2006-03-09 2009-11-24 Laird Technologies, Inc. EMI shielding and thermal management assemblies including frames and covers with multi-position latching
US7317618B2 (en) 2006-03-09 2008-01-08 Laird Technologies, Inc. Combined board level shielding and thermal management
US7463496B2 (en) 2006-03-09 2008-12-09 Laird Technologies, Inc. Low-profile board level EMI shielding and thermal management apparatus and spring clips for use therewith
JP2007265142A (ja) * 2006-03-29 2007-10-11 Noritsu Koki Co Ltd 画像データのプリント注文受付装置
US7764514B2 (en) * 2006-12-08 2010-07-27 Intel Corporation Electromagnetic interference shielding for device cooling
JP2008183092A (ja) * 2007-01-29 2008-08-14 Aruze Corp 基板、基板の支持構造、及び同基板の支持構造を有する遊技機
US20090086420A1 (en) * 2007-10-01 2009-04-02 General Dynamics Itronix Corporation Rugged conductive housing structure for portable computing device display
US7957140B2 (en) * 2007-12-31 2011-06-07 Intel Corporation Air mover for device surface cooling
US7808780B2 (en) * 2008-02-28 2010-10-05 International Business Machines Corporation Variable flow computer cooling system for a data center and method of operation
US8687359B2 (en) * 2008-10-13 2014-04-01 Apple Inc. Portable computer unified top case
JP2010134786A (ja) * 2008-12-05 2010-06-17 Toshiba Corp 電子機器
TW201039506A (en) * 2009-04-24 2010-11-01 Au Optronics Corp Shielding device and display device having the same
JP5491063B2 (ja) * 2009-04-27 2014-05-14 キヤノン株式会社 表示装置及び調整機構
US7965514B2 (en) 2009-06-05 2011-06-21 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
US8477499B2 (en) 2009-06-05 2013-07-02 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
US20110121726A1 (en) * 2009-11-23 2011-05-26 Luminus Devices, Inc. Solid-state lamp
JP2011186318A (ja) 2010-03-10 2011-09-22 Panasonic Corp 表示装置および電子機器
JP4843724B1 (ja) 2010-06-18 2011-12-21 株式会社東芝 電子機器
JP4920098B2 (ja) 2010-06-18 2012-04-18 株式会社東芝 モバイルパーソナルコンピュータおよび電子機器
CN102125346B (zh) * 2011-02-28 2012-07-18 广州市金圣斯皮具制品有限公司 一种防辐射支架包
US8760868B2 (en) * 2011-08-30 2014-06-24 Apple Inc. Electronic device enclosures and heatsink structures with thermal management features
JP4902015B2 (ja) * 2011-10-07 2012-03-21 株式会社東芝 テレビジョン受像機および電子機器
KR20130072608A (ko) * 2011-12-22 2013-07-02 삼성전자주식회사 디스플레이 장치
KR20140121525A (ko) * 2013-04-05 2014-10-16 삼성전자주식회사 디스플레이 장치
US10114430B2 (en) * 2014-10-20 2018-10-30 Asia Vital Components Co., Ltd. Heat dissipation structure for mobile device
US9771754B2 (en) * 2015-11-09 2017-09-26 Rite-Hite Holding Corporation Flexible seals for insulated doors
GB201703099D0 (en) * 2017-02-27 2017-04-12 Therefore Ltd Neo
US10123466B2 (en) 2017-03-31 2018-11-06 Raytheon Company Electrically and thermally conductive planar interface gasket with deformable fingers

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US5696768A (en) * 1996-12-10 1997-12-09 Intel Corporation Method and apparatus for data storage array tracking

Also Published As

Publication number Publication date
EP0910005A3 (de) 2001-07-18
JP3027147B2 (ja) 2000-03-27
DE69820830T2 (de) 2004-12-02
EP0910005A2 (de) 1999-04-21
JPH11219236A (ja) 1999-08-10
US5953206A (en) 1999-09-14
EP0910005B1 (de) 2004-01-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: HEWLETT-PACKARD DEVELOPMENT CO., L.P., HOUSTON, TE

8339 Ceased/non-payment of the annual fee