DE69813309T2 - Vorrichtung und verfahren zur steuerung eines mehrarmigen polierwerkzeuges - Google Patents
Vorrichtung und verfahren zur steuerung eines mehrarmigen polierwerkzeugesInfo
- Publication number
- DE69813309T2 DE69813309T2 DE69813309T DE69813309T DE69813309T2 DE 69813309 T2 DE69813309 T2 DE 69813309T2 DE 69813309 T DE69813309 T DE 69813309T DE 69813309 T DE69813309 T DE 69813309T DE 69813309 T2 DE69813309 T2 DE 69813309T2
- Authority
- DE
- Germany
- Prior art keywords
- arm
- polishing
- downward force
- removal rates
- arms
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005498 polishing Methods 0.000 title claims description 168
- 238000000034 method Methods 0.000 title claims description 64
- 230000008569 process Effects 0.000 claims description 41
- 238000005457 optimization Methods 0.000 claims description 38
- 239000011159 matrix material Substances 0.000 claims description 9
- 235000012431 wafers Nutrition 0.000 description 97
- 239000010410 layer Substances 0.000 description 23
- 238000004519 manufacturing process Methods 0.000 description 23
- 238000012360 testing method Methods 0.000 description 14
- 239000000126 substance Substances 0.000 description 10
- 238000005259 measurement Methods 0.000 description 9
- 238000011156 evaluation Methods 0.000 description 6
- 230000003993 interaction Effects 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000007517 polishing process Methods 0.000 description 5
- 230000003750 conditioning effect Effects 0.000 description 4
- 101150036841 minJ gene Proteins 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000004886 process control Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 238000012795 verification Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000001186 cumulative effect Effects 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000002679 ablation Methods 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000012886 linear function Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41815—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the cooperation between machine tools, manipulators and conveyor or other workpiece supply system, workcell
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1656—Programme controls characterised by programming, planning systems for manipulators
- B25J9/1669—Programme controls characterised by programming, planning systems for manipulators characterised by special application, e.g. multi-arm co-operation, assembly, grasping
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Quality & Reliability (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/105,980 US6171174B1 (en) | 1998-06-26 | 1998-06-26 | System and method for controlling a multi-arm polishing tool |
| PCT/US1998/026957 WO2000000873A1 (en) | 1998-06-26 | 1998-12-18 | System and method for controlling a multi-arm polishing tool |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69813309D1 DE69813309D1 (de) | 2003-05-15 |
| DE69813309T2 true DE69813309T2 (de) | 2003-12-11 |
Family
ID=22308818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69813309T Expired - Lifetime DE69813309T2 (de) | 1998-06-26 | 1998-12-18 | Vorrichtung und verfahren zur steuerung eines mehrarmigen polierwerkzeuges |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6171174B1 (enExample) |
| EP (1) | EP1090334B1 (enExample) |
| JP (1) | JP4675480B2 (enExample) |
| KR (1) | KR100517671B1 (enExample) |
| DE (1) | DE69813309T2 (enExample) |
| WO (1) | WO2000000873A1 (enExample) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7349090B2 (en) | 2000-09-20 | 2008-03-25 | Kla-Tencor Technologies Corp. | Methods and systems for determining a property of a specimen prior to, during, or subsequent to lithography |
| US6919957B2 (en) | 2000-09-20 | 2005-07-19 | Kla-Tencor Technologies Corp. | Methods and systems for determining a critical dimension, a presence of defects, and a thin film characteristic of a specimen |
| US7106425B1 (en) | 2000-09-20 | 2006-09-12 | Kla-Tencor Technologies Corp. | Methods and systems for determining a presence of defects and a thin film characteristic of a specimen |
| US6891627B1 (en) | 2000-09-20 | 2005-05-10 | Kla-Tencor Technologies Corp. | Methods and systems for determining a critical dimension and overlay of a specimen |
| US7196782B2 (en) | 2000-09-20 | 2007-03-27 | Kla-Tencor Technologies Corp. | Methods and systems for determining a thin film characteristic and an electrical property of a specimen |
| US7130029B2 (en) | 2000-09-20 | 2006-10-31 | Kla-Tencor Technologies Corp. | Methods and systems for determining an adhesion characteristic and a thickness of a specimen |
| US6538730B2 (en) | 2001-04-06 | 2003-03-25 | Kla-Tencor Technologies Corporation | Defect detection system |
| US7160739B2 (en) | 2001-06-19 | 2007-01-09 | Applied Materials, Inc. | Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles |
| AU2003207834A1 (en) | 2002-02-04 | 2003-09-02 | Kla-Tencor Technologies Corp. | Systems and methods for characterizing a polishing process |
| DE10234956B4 (de) * | 2002-07-31 | 2007-01-04 | Advanced Micro Devices, Inc., Sunnyvale | Verfahren zum Steuern des chemisch mechanischen Polierens von gestapelten Schichten mit einer Oberflächentopologie |
| US7116413B2 (en) | 2002-09-13 | 2006-10-03 | Kla-Tencor Corporation | Inspection system for integrated applications |
| KR100471184B1 (ko) * | 2002-12-06 | 2005-03-10 | 삼성전자주식회사 | 다층 막질의 화학 기계적 연마 공정에서 각 막질의 연마시간을 제어하기 위한 시스템 및 그 방법 |
| US7089081B2 (en) * | 2003-01-31 | 2006-08-08 | 3M Innovative Properties Company | Modeling an abrasive process to achieve controlled material removal |
| US7131891B2 (en) * | 2003-04-28 | 2006-11-07 | Micron Technology, Inc. | Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces |
| US7004814B2 (en) * | 2004-03-19 | 2006-02-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | CMP process control method |
| US7296103B1 (en) * | 2004-10-05 | 2007-11-13 | Advanced Micro Devices, Inc. | Method and system for dynamically selecting wafer lots for metrology processing |
| DE102004054920B4 (de) * | 2004-11-09 | 2008-01-31 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Bauteil und Vorrichtung zur Steuerung von physikalischen Parametern mit mindestens einem Bauteil |
| US7636611B2 (en) * | 2005-10-28 | 2009-12-22 | Samsung Austin Semiconductor, L.P. | Fuzzy logic system for process control in chemical mechanical polishing |
| US7596423B2 (en) * | 2007-03-30 | 2009-09-29 | Tokyo Electron Limited | Method and apparatus for verifying a site-dependent procedure |
| US7650200B2 (en) * | 2007-03-30 | 2010-01-19 | Tokyo Electron Limited | Method and apparatus for creating a site-dependent evaluation library |
| TWI381468B (zh) * | 2007-03-30 | 2013-01-01 | Tokyo Electron Ltd | 線上微影及蝕刻系統 |
| DE102007035833B3 (de) * | 2007-07-31 | 2009-03-12 | Advanced Micro Devices, Inc., Sunnyvale | Fortgeschrittene automatische Abscheideprofilzielsteuerung und Kontrolle durch Anwendung von fortgeschrittener Polierendpunktsystemrückkopplung |
| US9975368B2 (en) * | 2008-02-13 | 2018-05-22 | Iconex Llc | Fanfold media dust inhibitor |
| AU2020253350A1 (en) | 2019-03-29 | 2021-10-28 | Saint-Gobain Abrasives, Inc. | Performance grinding solutions |
| EP3946809A4 (en) | 2019-04-03 | 2022-12-07 | Saint-Gobain Abrasives, Inc. | ABRASIVE ARTICLE, ABRASIVE SYSTEM AND METHOD OF USING AND FORMING THE SAME |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06252113A (ja) * | 1993-02-26 | 1994-09-09 | Matsushita Electric Ind Co Ltd | 半導体基板の平坦化方法 |
| US5658183A (en) | 1993-08-25 | 1997-08-19 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing including optical monitoring |
| JP3595011B2 (ja) * | 1994-03-02 | 2004-12-02 | アプライド マテリアルズ インコーポレイテッド | 研磨制御を改善した化学的機械的研磨装置 |
| US5696601A (en) | 1994-08-03 | 1997-12-09 | Xerox Corporation | System and method for redistributing error values from an error diffusion process |
| US5665199A (en) | 1995-06-23 | 1997-09-09 | Advanced Micro Devices, Inc. | Methodology for developing product-specific interlayer dielectric polish processes |
| JPH0936070A (ja) * | 1995-07-21 | 1997-02-07 | Nippon Steel Corp | 半導体ウエハの研磨装置 |
| US5653622A (en) | 1995-07-25 | 1997-08-05 | Vlsi Technology, Inc. | Chemical mechanical polishing system and method for optimization and control of film removal uniformity |
| US5655951A (en) | 1995-09-29 | 1997-08-12 | Micron Technology, Inc. | Method for selectively reconditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers |
| US5938507A (en) | 1995-10-27 | 1999-08-17 | Applied Materials, Inc. | Linear conditioner apparatus for a chemical mechanical polishing system |
| JPH09174430A (ja) * | 1995-12-27 | 1997-07-08 | Komatsu Electron Metals Co Ltd | 半導体ウェハの研磨装置 |
| US5695601A (en) * | 1995-12-27 | 1997-12-09 | Kabushiki Kaisha Toshiba | Method for planarizing a semiconductor body by CMP method and an apparatus for manufacturing a semiconductor device using the method |
| JPH1071562A (ja) * | 1996-05-10 | 1998-03-17 | Canon Inc | 化学機械研磨装置および方法 |
| JPH09323261A (ja) * | 1996-05-31 | 1997-12-16 | Fujitsu Ltd | ウェハー研磨装置及びそれを用いた半導体装置の製造方法 |
| JP3580036B2 (ja) * | 1996-08-06 | 2004-10-20 | ソニー株式会社 | 研磨シミュレーション方法 |
| US5865666A (en) * | 1997-08-20 | 1999-02-02 | Lsi Logic Corporation | Apparatus and method for polish removing a precise amount of material from a wafer |
| US5827111A (en) * | 1997-12-15 | 1998-10-27 | Micron Technology, Inc. | Method and apparatus for grinding wafers |
-
1998
- 1998-06-26 US US09/105,980 patent/US6171174B1/en not_active Expired - Lifetime
- 1998-12-18 DE DE69813309T patent/DE69813309T2/de not_active Expired - Lifetime
- 1998-12-18 WO PCT/US1998/026957 patent/WO2000000873A1/en not_active Ceased
- 1998-12-18 JP JP2000557181A patent/JP4675480B2/ja not_active Expired - Fee Related
- 1998-12-18 KR KR10-2000-7014748A patent/KR100517671B1/ko not_active Expired - Fee Related
- 1998-12-18 EP EP98964086A patent/EP1090334B1/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2002519859A (ja) | 2002-07-02 |
| US6171174B1 (en) | 2001-01-09 |
| KR100517671B1 (ko) | 2005-09-28 |
| JP4675480B2 (ja) | 2011-04-20 |
| KR20010053172A (ko) | 2001-06-25 |
| WO2000000873A1 (en) | 2000-01-06 |
| DE69813309D1 (de) | 2003-05-15 |
| EP1090334A1 (en) | 2001-04-11 |
| EP1090334B1 (en) | 2003-04-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8327 | Change in the person/name/address of the patent owner |
Owner name: GLOBALFOUNDRIES INC. MAPLES CORPORATE SERVICES, KY |