KR100517671B1 - 다수 암 연마 툴을 제어하는 시스템 및 방법 - Google Patents

다수 암 연마 툴을 제어하는 시스템 및 방법 Download PDF

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Publication number
KR100517671B1
KR100517671B1 KR10-2000-7014748A KR20007014748A KR100517671B1 KR 100517671 B1 KR100517671 B1 KR 100517671B1 KR 20007014748 A KR20007014748 A KR 20007014748A KR 100517671 B1 KR100517671 B1 KR 100517671B1
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KR
South Korea
Prior art keywords
arm
run
downward force
removal rate
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR10-2000-7014748A
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English (en)
Korean (ko)
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KR20010053172A (ko
Inventor
캠프벨윌리엄제이.
리더크리스토퍼에이치
밀러미가엘엘.
Original Assignee
어드밴스드 마이크로 디바이시즈, 인코포레이티드
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Application filed by 어드밴스드 마이크로 디바이시즈, 인코포레이티드 filed Critical 어드밴스드 마이크로 디바이시즈, 인코포레이티드
Publication of KR20010053172A publication Critical patent/KR20010053172A/ko
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Publication of KR100517671B1 publication Critical patent/KR100517671B1/ko
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Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41815—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the cooperation between machine tools, manipulators and conveyor or other workpiece supply system, workcell
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1656—Programme controls characterised by programming, planning systems for manipulators
    • B25J9/1669—Programme controls characterised by programming, planning systems for manipulators characterised by special application, e.g. multi-arm co-operation, assembly, grasping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
KR10-2000-7014748A 1998-06-26 1998-12-18 다수 암 연마 툴을 제어하는 시스템 및 방법 Expired - Fee Related KR100517671B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/105,980 US6171174B1 (en) 1998-06-26 1998-06-26 System and method for controlling a multi-arm polishing tool
US09/105,980 1998-06-26

Publications (2)

Publication Number Publication Date
KR20010053172A KR20010053172A (ko) 2001-06-25
KR100517671B1 true KR100517671B1 (ko) 2005-09-28

Family

ID=22308818

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2000-7014748A Expired - Fee Related KR100517671B1 (ko) 1998-06-26 1998-12-18 다수 암 연마 툴을 제어하는 시스템 및 방법

Country Status (6)

Country Link
US (1) US6171174B1 (enExample)
EP (1) EP1090334B1 (enExample)
JP (1) JP4675480B2 (enExample)
KR (1) KR100517671B1 (enExample)
DE (1) DE69813309T2 (enExample)
WO (1) WO2000000873A1 (enExample)

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US7349090B2 (en) 2000-09-20 2008-03-25 Kla-Tencor Technologies Corp. Methods and systems for determining a property of a specimen prior to, during, or subsequent to lithography
US6919957B2 (en) 2000-09-20 2005-07-19 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension, a presence of defects, and a thin film characteristic of a specimen
US7106425B1 (en) 2000-09-20 2006-09-12 Kla-Tencor Technologies Corp. Methods and systems for determining a presence of defects and a thin film characteristic of a specimen
US6891627B1 (en) 2000-09-20 2005-05-10 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension and overlay of a specimen
US7196782B2 (en) 2000-09-20 2007-03-27 Kla-Tencor Technologies Corp. Methods and systems for determining a thin film characteristic and an electrical property of a specimen
US7130029B2 (en) 2000-09-20 2006-10-31 Kla-Tencor Technologies Corp. Methods and systems for determining an adhesion characteristic and a thickness of a specimen
US6538730B2 (en) 2001-04-06 2003-03-25 Kla-Tencor Technologies Corporation Defect detection system
US7160739B2 (en) 2001-06-19 2007-01-09 Applied Materials, Inc. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
AU2003207834A1 (en) 2002-02-04 2003-09-02 Kla-Tencor Technologies Corp. Systems and methods for characterizing a polishing process
DE10234956B4 (de) * 2002-07-31 2007-01-04 Advanced Micro Devices, Inc., Sunnyvale Verfahren zum Steuern des chemisch mechanischen Polierens von gestapelten Schichten mit einer Oberflächentopologie
US7116413B2 (en) 2002-09-13 2006-10-03 Kla-Tencor Corporation Inspection system for integrated applications
KR100471184B1 (ko) * 2002-12-06 2005-03-10 삼성전자주식회사 다층 막질의 화학 기계적 연마 공정에서 각 막질의 연마시간을 제어하기 위한 시스템 및 그 방법
US7089081B2 (en) * 2003-01-31 2006-08-08 3M Innovative Properties Company Modeling an abrasive process to achieve controlled material removal
US7131891B2 (en) * 2003-04-28 2006-11-07 Micron Technology, Inc. Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces
US7004814B2 (en) * 2004-03-19 2006-02-28 Taiwan Semiconductor Manufacturing Co., Ltd. CMP process control method
US7296103B1 (en) * 2004-10-05 2007-11-13 Advanced Micro Devices, Inc. Method and system for dynamically selecting wafer lots for metrology processing
DE102004054920B4 (de) * 2004-11-09 2008-01-31 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Bauteil und Vorrichtung zur Steuerung von physikalischen Parametern mit mindestens einem Bauteil
US7636611B2 (en) * 2005-10-28 2009-12-22 Samsung Austin Semiconductor, L.P. Fuzzy logic system for process control in chemical mechanical polishing
US7596423B2 (en) * 2007-03-30 2009-09-29 Tokyo Electron Limited Method and apparatus for verifying a site-dependent procedure
US7650200B2 (en) * 2007-03-30 2010-01-19 Tokyo Electron Limited Method and apparatus for creating a site-dependent evaluation library
TWI381468B (zh) * 2007-03-30 2013-01-01 Tokyo Electron Ltd 線上微影及蝕刻系統
DE102007035833B3 (de) * 2007-07-31 2009-03-12 Advanced Micro Devices, Inc., Sunnyvale Fortgeschrittene automatische Abscheideprofilzielsteuerung und Kontrolle durch Anwendung von fortgeschrittener Polierendpunktsystemrückkopplung
US9975368B2 (en) * 2008-02-13 2018-05-22 Iconex Llc Fanfold media dust inhibitor
AU2020253350A1 (en) 2019-03-29 2021-10-28 Saint-Gobain Abrasives, Inc. Performance grinding solutions
EP3946809A4 (en) 2019-04-03 2022-12-07 Saint-Gobain Abrasives, Inc. ABRASIVE ARTICLE, ABRASIVE SYSTEM AND METHOD OF USING AND FORMING THE SAME

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JPH06252113A (ja) * 1993-02-26 1994-09-09 Matsushita Electric Ind Co Ltd 半導体基板の平坦化方法
US5658183A (en) 1993-08-25 1997-08-19 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing including optical monitoring
JP3595011B2 (ja) * 1994-03-02 2004-12-02 アプライド マテリアルズ インコーポレイテッド 研磨制御を改善した化学的機械的研磨装置
US5696601A (en) 1994-08-03 1997-12-09 Xerox Corporation System and method for redistributing error values from an error diffusion process
US5665199A (en) 1995-06-23 1997-09-09 Advanced Micro Devices, Inc. Methodology for developing product-specific interlayer dielectric polish processes
JPH0936070A (ja) * 1995-07-21 1997-02-07 Nippon Steel Corp 半導体ウエハの研磨装置
US5653622A (en) 1995-07-25 1997-08-05 Vlsi Technology, Inc. Chemical mechanical polishing system and method for optimization and control of film removal uniformity
US5655951A (en) 1995-09-29 1997-08-12 Micron Technology, Inc. Method for selectively reconditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers
US5938507A (en) 1995-10-27 1999-08-17 Applied Materials, Inc. Linear conditioner apparatus for a chemical mechanical polishing system
JPH09174430A (ja) * 1995-12-27 1997-07-08 Komatsu Electron Metals Co Ltd 半導体ウェハの研磨装置
US5695601A (en) * 1995-12-27 1997-12-09 Kabushiki Kaisha Toshiba Method for planarizing a semiconductor body by CMP method and an apparatus for manufacturing a semiconductor device using the method
JPH1071562A (ja) * 1996-05-10 1998-03-17 Canon Inc 化学機械研磨装置および方法
JPH09323261A (ja) * 1996-05-31 1997-12-16 Fujitsu Ltd ウェハー研磨装置及びそれを用いた半導体装置の製造方法
JP3580036B2 (ja) * 1996-08-06 2004-10-20 ソニー株式会社 研磨シミュレーション方法
US5865666A (en) * 1997-08-20 1999-02-02 Lsi Logic Corporation Apparatus and method for polish removing a precise amount of material from a wafer
US5827111A (en) * 1997-12-15 1998-10-27 Micron Technology, Inc. Method and apparatus for grinding wafers

Also Published As

Publication number Publication date
DE69813309T2 (de) 2003-12-11
JP2002519859A (ja) 2002-07-02
US6171174B1 (en) 2001-01-09
JP4675480B2 (ja) 2011-04-20
KR20010053172A (ko) 2001-06-25
WO2000000873A1 (en) 2000-01-06
DE69813309D1 (de) 2003-05-15
EP1090334A1 (en) 2001-04-11
EP1090334B1 (en) 2003-04-09

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