JP4675480B2 - 多数アーム研磨ツールを制御するためのシステムおよび方法 - Google Patents

多数アーム研磨ツールを制御するためのシステムおよび方法 Download PDF

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Publication number
JP4675480B2
JP4675480B2 JP2000557181A JP2000557181A JP4675480B2 JP 4675480 B2 JP4675480 B2 JP 4675480B2 JP 2000557181 A JP2000557181 A JP 2000557181A JP 2000557181 A JP2000557181 A JP 2000557181A JP 4675480 B2 JP4675480 B2 JP 4675480B2
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Japan
Prior art keywords
arm
removal rate
polishing
downward force
force adjustment
Prior art date
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Expired - Fee Related
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JP2000557181A
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English (en)
Japanese (ja)
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JP2002519859A (ja
JP2002519859A5 (enExample
Inventor
キャンベル，ウィリアム・ジェイ
レダー，クリストファー・エイチ
ミラー，マイケル・エル
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Advanced Micro Devices Inc
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Advanced Micro Devices Inc
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Publication of JP2002519859A5 publication Critical patent/JP2002519859A5/ja
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41815—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the cooperation between machine tools, manipulators and conveyor or other workpiece supply system, workcell
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1656—Programme controls characterised by programming, planning systems for manipulators
    • B25J9/1669—Programme controls characterised by programming, planning systems for manipulators characterised by special application, e.g. multi-arm co-operation, assembly, grasping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP2000557181A 1998-06-26 1998-12-18 多数アーム研磨ツールを制御するためのシステムおよび方法 Expired - Fee Related JP4675480B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/105,980 US6171174B1 (en) 1998-06-26 1998-06-26 System and method for controlling a multi-arm polishing tool
US09/105,980 1998-06-26
PCT/US1998/026957 WO2000000873A1 (en) 1998-06-26 1998-12-18 System and method for controlling a multi-arm polishing tool

Publications (3)

Publication Number Publication Date
JP2002519859A JP2002519859A (ja) 2002-07-02
JP2002519859A5 JP2002519859A5 (enExample) 2006-02-09
JP4675480B2 true JP4675480B2 (ja) 2011-04-20

Family

ID=22308818

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000557181A Expired - Fee Related JP4675480B2 (ja) 1998-06-26 1998-12-18 多数アーム研磨ツールを制御するためのシステムおよび方法

Country Status (6)

Country Link
US (1) US6171174B1 (enExample)
EP (1) EP1090334B1 (enExample)
JP (1) JP4675480B2 (enExample)
KR (1) KR100517671B1 (enExample)
DE (1) DE69813309T2 (enExample)
WO (1) WO2000000873A1 (enExample)

Families Citing this family (25)

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Publication number Priority date Publication date Assignee Title
US7349090B2 (en) 2000-09-20 2008-03-25 Kla-Tencor Technologies Corp. Methods and systems for determining a property of a specimen prior to, during, or subsequent to lithography
US6919957B2 (en) 2000-09-20 2005-07-19 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension, a presence of defects, and a thin film characteristic of a specimen
US7106425B1 (en) 2000-09-20 2006-09-12 Kla-Tencor Technologies Corp. Methods and systems for determining a presence of defects and a thin film characteristic of a specimen
US6891627B1 (en) 2000-09-20 2005-05-10 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension and overlay of a specimen
US7196782B2 (en) 2000-09-20 2007-03-27 Kla-Tencor Technologies Corp. Methods and systems for determining a thin film characteristic and an electrical property of a specimen
US7130029B2 (en) 2000-09-20 2006-10-31 Kla-Tencor Technologies Corp. Methods and systems for determining an adhesion characteristic and a thickness of a specimen
US6538730B2 (en) 2001-04-06 2003-03-25 Kla-Tencor Technologies Corporation Defect detection system
US7160739B2 (en) 2001-06-19 2007-01-09 Applied Materials, Inc. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
AU2003207834A1 (en) 2002-02-04 2003-09-02 Kla-Tencor Technologies Corp. Systems and methods for characterizing a polishing process
DE10234956B4 (de) * 2002-07-31 2007-01-04 Advanced Micro Devices, Inc., Sunnyvale Verfahren zum Steuern des chemisch mechanischen Polierens von gestapelten Schichten mit einer Oberflächentopologie
US7116413B2 (en) 2002-09-13 2006-10-03 Kla-Tencor Corporation Inspection system for integrated applications
KR100471184B1 (ko) * 2002-12-06 2005-03-10 삼성전자주식회사 다층 막질의 화학 기계적 연마 공정에서 각 막질의 연마시간을 제어하기 위한 시스템 및 그 방법
US7089081B2 (en) * 2003-01-31 2006-08-08 3M Innovative Properties Company Modeling an abrasive process to achieve controlled material removal
US7131891B2 (en) * 2003-04-28 2006-11-07 Micron Technology, Inc. Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces
US7004814B2 (en) * 2004-03-19 2006-02-28 Taiwan Semiconductor Manufacturing Co., Ltd. CMP process control method
US7296103B1 (en) * 2004-10-05 2007-11-13 Advanced Micro Devices, Inc. Method and system for dynamically selecting wafer lots for metrology processing
DE102004054920B4 (de) * 2004-11-09 2008-01-31 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Bauteil und Vorrichtung zur Steuerung von physikalischen Parametern mit mindestens einem Bauteil
US7636611B2 (en) * 2005-10-28 2009-12-22 Samsung Austin Semiconductor, L.P. Fuzzy logic system for process control in chemical mechanical polishing
US7596423B2 (en) * 2007-03-30 2009-09-29 Tokyo Electron Limited Method and apparatus for verifying a site-dependent procedure
US7650200B2 (en) * 2007-03-30 2010-01-19 Tokyo Electron Limited Method and apparatus for creating a site-dependent evaluation library
TWI381468B (zh) * 2007-03-30 2013-01-01 Tokyo Electron Ltd 線上微影及蝕刻系統
DE102007035833B3 (de) * 2007-07-31 2009-03-12 Advanced Micro Devices, Inc., Sunnyvale Fortgeschrittene automatische Abscheideprofilzielsteuerung und Kontrolle durch Anwendung von fortgeschrittener Polierendpunktsystemrückkopplung
US9975368B2 (en) * 2008-02-13 2018-05-22 Iconex Llc Fanfold media dust inhibitor
AU2020253350A1 (en) 2019-03-29 2021-10-28 Saint-Gobain Abrasives, Inc. Performance grinding solutions
EP3946809A4 (en) 2019-04-03 2022-12-07 Saint-Gobain Abrasives, Inc. ABRASIVE ARTICLE, ABRASIVE SYSTEM AND METHOD OF USING AND FORMING THE SAME

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Publication number Priority date Publication date Assignee Title
JPH06252113A (ja) * 1993-02-26 1994-09-09 Matsushita Electric Ind Co Ltd 半導体基板の平坦化方法
US5658183A (en) 1993-08-25 1997-08-19 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing including optical monitoring
JP3595011B2 (ja) * 1994-03-02 2004-12-02 アプライド マテリアルズ インコーポレイテッド 研磨制御を改善した化学的機械的研磨装置
US5696601A (en) 1994-08-03 1997-12-09 Xerox Corporation System and method for redistributing error values from an error diffusion process
US5665199A (en) 1995-06-23 1997-09-09 Advanced Micro Devices, Inc. Methodology for developing product-specific interlayer dielectric polish processes
JPH0936070A (ja) * 1995-07-21 1997-02-07 Nippon Steel Corp 半導体ウエハの研磨装置
US5653622A (en) 1995-07-25 1997-08-05 Vlsi Technology, Inc. Chemical mechanical polishing system and method for optimization and control of film removal uniformity
US5655951A (en) 1995-09-29 1997-08-12 Micron Technology, Inc. Method for selectively reconditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers
US5938507A (en) 1995-10-27 1999-08-17 Applied Materials, Inc. Linear conditioner apparatus for a chemical mechanical polishing system
JPH09174430A (ja) * 1995-12-27 1997-07-08 Komatsu Electron Metals Co Ltd 半導体ウェハの研磨装置
US5695601A (en) * 1995-12-27 1997-12-09 Kabushiki Kaisha Toshiba Method for planarizing a semiconductor body by CMP method and an apparatus for manufacturing a semiconductor device using the method
JPH1071562A (ja) * 1996-05-10 1998-03-17 Canon Inc 化学機械研磨装置および方法
JPH09323261A (ja) * 1996-05-31 1997-12-16 Fujitsu Ltd ウェハー研磨装置及びそれを用いた半導体装置の製造方法
JP3580036B2 (ja) * 1996-08-06 2004-10-20 ソニー株式会社 研磨シミュレーション方法
US5865666A (en) * 1997-08-20 1999-02-02 Lsi Logic Corporation Apparatus and method for polish removing a precise amount of material from a wafer
US5827111A (en) * 1997-12-15 1998-10-27 Micron Technology, Inc. Method and apparatus for grinding wafers

Also Published As

Publication number Publication date
DE69813309T2 (de) 2003-12-11
JP2002519859A (ja) 2002-07-02
US6171174B1 (en) 2001-01-09
KR100517671B1 (ko) 2005-09-28
KR20010053172A (ko) 2001-06-25
WO2000000873A1 (en) 2000-01-06
DE69813309D1 (de) 2003-05-15
EP1090334A1 (en) 2001-04-11
EP1090334B1 (en) 2003-04-09

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