DE69813309T2 - Vorrichtung und verfahren zur steuerung eines mehrarmigen polierwerkzeuges - Google Patents

Vorrichtung und verfahren zur steuerung eines mehrarmigen polierwerkzeuges

Info

Publication number
DE69813309T2
DE69813309T2 DE69813309T DE69813309T DE69813309T2 DE 69813309 T2 DE69813309 T2 DE 69813309T2 DE 69813309 T DE69813309 T DE 69813309T DE 69813309 T DE69813309 T DE 69813309T DE 69813309 T2 DE69813309 T2 DE 69813309T2
Authority
DE
Germany
Prior art keywords
armed
controlling
polishing tool
polishing
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69813309T
Other languages
English (en)
Other versions
DE69813309D1 (de
Inventor
J Campbell
H Raeder
L Miller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GlobalFoundries Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Application granted granted Critical
Publication of DE69813309D1 publication Critical patent/DE69813309D1/de
Publication of DE69813309T2 publication Critical patent/DE69813309T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
    • G05B19/41815—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by the cooperation between machine tools, manipulators and conveyor or other workpiece supply system, workcell
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1656—Programme controls characterised by programming, planning systems for manipulators
    • B25J9/1669—Programme controls characterised by programming, planning systems for manipulators characterised by special application, e.g. multi-arm co-operation, assembly, grasping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
DE69813309T 1998-06-26 1998-12-18 Vorrichtung und verfahren zur steuerung eines mehrarmigen polierwerkzeuges Expired - Lifetime DE69813309T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/105,980 US6171174B1 (en) 1998-06-26 1998-06-26 System and method for controlling a multi-arm polishing tool
PCT/US1998/026957 WO2000000873A1 (en) 1998-06-26 1998-12-18 System and method for controlling a multi-arm polishing tool

Publications (2)

Publication Number Publication Date
DE69813309D1 DE69813309D1 (de) 2003-05-15
DE69813309T2 true DE69813309T2 (de) 2003-12-11

Family

ID=22308818

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69813309T Expired - Lifetime DE69813309T2 (de) 1998-06-26 1998-12-18 Vorrichtung und verfahren zur steuerung eines mehrarmigen polierwerkzeuges

Country Status (6)

Country Link
US (1) US6171174B1 (de)
EP (1) EP1090334B1 (de)
JP (1) JP4675480B2 (de)
KR (1) KR100517671B1 (de)
DE (1) DE69813309T2 (de)
WO (1) WO2000000873A1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6538730B2 (en) 2001-04-06 2003-03-25 Kla-Tencor Technologies Corporation Defect detection system
US7160739B2 (en) 2001-06-19 2007-01-09 Applied Materials, Inc. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
US7175503B2 (en) 2002-02-04 2007-02-13 Kla-Tencor Technologies Corp. Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device
DE10234956B4 (de) 2002-07-31 2007-01-04 Advanced Micro Devices, Inc., Sunnyvale Verfahren zum Steuern des chemisch mechanischen Polierens von gestapelten Schichten mit einer Oberflächentopologie
US7116413B2 (en) 2002-09-13 2006-10-03 Kla-Tencor Corporation Inspection system for integrated applications
KR100471184B1 (ko) * 2002-12-06 2005-03-10 삼성전자주식회사 다층 막질의 화학 기계적 연마 공정에서 각 막질의 연마시간을 제어하기 위한 시스템 및 그 방법
US7089081B2 (en) * 2003-01-31 2006-08-08 3M Innovative Properties Company Modeling an abrasive process to achieve controlled material removal
US7131891B2 (en) * 2003-04-28 2006-11-07 Micron Technology, Inc. Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces
US7004814B2 (en) * 2004-03-19 2006-02-28 Taiwan Semiconductor Manufacturing Co., Ltd. CMP process control method
US7296103B1 (en) * 2004-10-05 2007-11-13 Advanced Micro Devices, Inc. Method and system for dynamically selecting wafer lots for metrology processing
DE102004054920B4 (de) * 2004-11-09 2008-01-31 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Bauteil und Vorrichtung zur Steuerung von physikalischen Parametern mit mindestens einem Bauteil
US7636611B2 (en) * 2005-10-28 2009-12-22 Samsung Austin Semiconductor, L.P. Fuzzy logic system for process control in chemical mechanical polishing
US7596423B2 (en) * 2007-03-30 2009-09-29 Tokyo Electron Limited Method and apparatus for verifying a site-dependent procedure
JP5200276B2 (ja) * 2007-03-30 2013-06-05 東京エレクトロン株式会社 インラインリソグラフィ及びエッチングシステム
US7650200B2 (en) * 2007-03-30 2010-01-19 Tokyo Electron Limited Method and apparatus for creating a site-dependent evaluation library
DE102007035833B3 (de) * 2007-07-31 2009-03-12 Advanced Micro Devices, Inc., Sunnyvale Fortgeschrittene automatische Abscheideprofilzielsteuerung und Kontrolle durch Anwendung von fortgeschrittener Polierendpunktsystemrückkopplung
US9975368B2 (en) * 2008-02-13 2018-05-22 Iconex Llc Fanfold media dust inhibitor

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06252113A (ja) * 1993-02-26 1994-09-09 Matsushita Electric Ind Co Ltd 半導体基板の平坦化方法
US5658183A (en) 1993-08-25 1997-08-19 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing including optical monitoring
JP3595011B2 (ja) * 1994-03-02 2004-12-02 アプライド マテリアルズ インコーポレイテッド 研磨制御を改善した化学的機械的研磨装置
US5696601A (en) 1994-08-03 1997-12-09 Xerox Corporation System and method for redistributing error values from an error diffusion process
US5665199A (en) 1995-06-23 1997-09-09 Advanced Micro Devices, Inc. Methodology for developing product-specific interlayer dielectric polish processes
JPH0936070A (ja) * 1995-07-21 1997-02-07 Nippon Steel Corp 半導体ウエハの研磨装置
US5653622A (en) 1995-07-25 1997-08-05 Vlsi Technology, Inc. Chemical mechanical polishing system and method for optimization and control of film removal uniformity
US5655951A (en) 1995-09-29 1997-08-12 Micron Technology, Inc. Method for selectively reconditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers
US5938507A (en) 1995-10-27 1999-08-17 Applied Materials, Inc. Linear conditioner apparatus for a chemical mechanical polishing system
JPH09174430A (ja) * 1995-12-27 1997-07-08 Komatsu Electron Metals Co Ltd 半導体ウェハの研磨装置
US5695601A (en) * 1995-12-27 1997-12-09 Kabushiki Kaisha Toshiba Method for planarizing a semiconductor body by CMP method and an apparatus for manufacturing a semiconductor device using the method
JPH1071562A (ja) * 1996-05-10 1998-03-17 Canon Inc 化学機械研磨装置および方法
JPH09323261A (ja) * 1996-05-31 1997-12-16 Fujitsu Ltd ウェハー研磨装置及びそれを用いた半導体装置の製造方法
JP3580036B2 (ja) * 1996-08-06 2004-10-20 ソニー株式会社 研磨シミュレーション方法
US5865666A (en) * 1997-08-20 1999-02-02 Lsi Logic Corporation Apparatus and method for polish removing a precise amount of material from a wafer
US5827111A (en) * 1997-12-15 1998-10-27 Micron Technology, Inc. Method and apparatus for grinding wafers

Also Published As

Publication number Publication date
JP2002519859A (ja) 2002-07-02
JP4675480B2 (ja) 2011-04-20
WO2000000873A1 (en) 2000-01-06
US6171174B1 (en) 2001-01-09
KR100517671B1 (ko) 2005-09-28
EP1090334B1 (de) 2003-04-09
DE69813309D1 (de) 2003-05-15
EP1090334A1 (de) 2001-04-11
KR20010053172A (ko) 2001-06-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: GLOBALFOUNDRIES INC. MAPLES CORPORATE SERVICES, KY