DE69808497T2 - Cyanidfreie, monovalente kupferelektrobeschichtungslösung - Google Patents

Cyanidfreie, monovalente kupferelektrobeschichtungslösung

Info

Publication number
DE69808497T2
DE69808497T2 DE69808497T DE69808497T DE69808497T2 DE 69808497 T2 DE69808497 T2 DE 69808497T2 DE 69808497 T DE69808497 T DE 69808497T DE 69808497 T DE69808497 T DE 69808497T DE 69808497 T2 DE69808497 T2 DE 69808497T2
Authority
DE
Germany
Prior art keywords
solution
copper
free
cyanide
metallizing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69808497T
Other languages
German (de)
English (en)
Other versions
DE69808497D1 (de
Inventor
R. Brasch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
LeaRonal Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LeaRonal Inc filed Critical LeaRonal Inc
Application granted granted Critical
Publication of DE69808497D1 publication Critical patent/DE69808497D1/de
Publication of DE69808497T2 publication Critical patent/DE69808497T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
DE69808497T 1997-03-18 1998-03-17 Cyanidfreie, monovalente kupferelektrobeschichtungslösung Expired - Fee Related DE69808497T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/819,061 US5750018A (en) 1997-03-18 1997-03-18 Cyanide-free monovalent copper electroplating solutions
PCT/US1998/005211 WO1998041675A1 (en) 1997-03-18 1998-03-17 Cyanide-free monovalent copper electroplating solutions

Publications (2)

Publication Number Publication Date
DE69808497D1 DE69808497D1 (de) 2002-11-07
DE69808497T2 true DE69808497T2 (de) 2003-04-03

Family

ID=25227108

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69808497T Expired - Fee Related DE69808497T2 (de) 1997-03-18 1998-03-17 Cyanidfreie, monovalente kupferelektrobeschichtungslösung

Country Status (7)

Country Link
US (1) US5750018A (enExample)
EP (1) EP1009869B1 (enExample)
JP (1) JP2001516400A (enExample)
KR (1) KR100484965B1 (enExample)
CN (1) CN1170963C (enExample)
DE (1) DE69808497T2 (enExample)
WO (1) WO1998041675A1 (enExample)

Families Citing this family (40)

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US6565729B2 (en) 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
US6197181B1 (en) 1998-03-20 2001-03-06 Semitool, Inc. Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece
US6054037A (en) * 1998-11-11 2000-04-25 Enthone-Omi, Inc. Halogen additives for alkaline copper use for plating zinc die castings
JP2001073182A (ja) * 1999-07-15 2001-03-21 Boc Group Inc:The 改良された酸性銅電気メッキ用溶液
US6180524B1 (en) * 1999-08-09 2001-01-30 Gary W. Ferrell Metal deposit process
RU2179203C2 (ru) * 1999-11-16 2002-02-10 Калининградский государственный университет Электролит блестящего меднения
US6660154B2 (en) 2000-10-25 2003-12-09 Shipley Company, L.L.C. Seed layer
US6776893B1 (en) 2000-11-20 2004-08-17 Enthone Inc. Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect
JP4595237B2 (ja) * 2001-04-27 2010-12-08 日立金属株式会社 銅めっき液および銅めっき方法
US7025866B2 (en) * 2002-08-21 2006-04-11 Micron Technology, Inc. Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces
US20050092611A1 (en) * 2003-11-03 2005-05-05 Semitool, Inc. Bath and method for high rate copper deposition
US20050183961A1 (en) * 2004-02-24 2005-08-25 Morrissey Ronald J. Non-cyanide silver plating bath composition
TWI348499B (en) * 2006-07-07 2011-09-11 Rohm & Haas Elect Mat Electroless copper and redox couples
CN1932084B (zh) * 2006-08-25 2010-05-12 卢月红 无氰电镀液添加剂及其溶液的制备方法
DE102008033174B3 (de) * 2008-07-15 2009-09-17 Enthone Inc., West Haven Cyanidfreie Elektrolytzusammensetzung zur galvanischen Abscheidung einer Kupferschicht und Verfahren zur Abscheidung einer kupferhaltigen Schicht
US20100084278A1 (en) * 2008-10-02 2010-04-08 Rowan Anthony J Novel Cyanide-Free Electroplating Process for Zinc and Zinc Alloy Die-Cast Components
RU2385366C1 (ru) * 2008-12-15 2010-03-27 Федеральное государственное образовательное учреждение высшего профессионального образования Российский государственный университет им. Иммануила Канта Электролит меднения стальных подложек
CN101665962B (zh) * 2009-09-04 2012-06-27 厦门大学 一种钢铁基底上碱性无氰镀铜电镀液及其制备方法
CN101922027B (zh) * 2010-08-19 2011-10-26 武汉风帆电镀技术有限公司 无氰碱性镀铜液及其制备方法
JP5996244B2 (ja) * 2011-04-19 2016-09-21 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ 半導体上の銅のめっき
US8747643B2 (en) * 2011-08-22 2014-06-10 Rohm And Haas Electronic Materials Llc Plating bath and method
US20140008234A1 (en) * 2012-07-09 2014-01-09 Rohm And Haas Electronic Materials Llc Method of metal plating semiconductors
ES2685317T3 (es) * 2012-11-13 2018-10-08 Coventya Sas Solución alcalina, sin cianuro, para electrochapado de aleaciones de oro, un método para electrochapado y un sustrato que comprende un depósito brillante, sin corrosión, de una aleación de oro
US9611550B2 (en) * 2012-12-26 2017-04-04 Rohm And Haas Electronic Materials Llc Formaldehyde free electroless copper plating compositions and methods
CN103014787B (zh) * 2012-12-28 2016-04-20 广东达志环保科技股份有限公司 一种铜电镀液及其电镀工艺
CN104711648B (zh) * 2013-12-17 2019-08-16 Ykk株式会社 闪镀铜镀敷液
JP6517501B2 (ja) * 2013-12-17 2019-05-22 Ykk株式会社 ストライク銅めっき液およびストライク銅めっき方法
CN103789801B (zh) * 2014-01-13 2017-03-15 浙江洽福科技有限公司 一种无氰预镀铜电镀液及其制备方法
CN103762009A (zh) * 2014-02-15 2014-04-30 芜湖鑫力管道技术有限公司 一种铜包黄铜复合线材及其生产方法
CN104120463B (zh) * 2014-06-25 2016-06-22 济南大学 钢铁基体的一种无氰亚铜电镀铜表面改性方法
CN104131320A (zh) * 2014-06-25 2014-11-05 济南大学 一种含硫羰基络合剂的无氰亚铜电镀铜溶液及其稳定化方法
CN104120468B (zh) * 2014-06-25 2016-08-03 济南大学 一种无氰亚铜电镀铜锌合金溶液
CN104141120B (zh) * 2014-07-01 2017-04-19 济南大学 一价铜化学镀铜液
KR102603763B1 (ko) * 2016-06-03 2023-11-16 에스케이온 주식회사 리튬 이차전지용 전극 집전체 및 그 제조방법
CN106011954B (zh) * 2016-07-25 2018-07-10 贵州大学 无氰电镀铜溶液及其制备方法及使用方法
JP6988826B2 (ja) * 2016-12-16 2022-01-05 コニカミノルタ株式会社 透明導電膜の形成方法及び電解メッキ用メッキ液
CN108149285A (zh) * 2017-12-28 2018-06-12 广东达志环保科技股份有限公司 无氰镀铜电镀液和电镀方法
CN110760904A (zh) * 2019-10-31 2020-02-07 武汉奥邦表面技术有限公司 一种无氰碱性亚铜镀铜添加剂
CN113549961B (zh) * 2021-07-26 2022-11-15 广州鸿葳科技股份有限公司 一种无氰无磷无氮一价铜镀铜溶液及其制备方法与应用
US12448695B2 (en) * 2022-06-23 2025-10-21 City University Of Hong Kong Method for recovering metal from waste printed circuit board and a cell thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4126524A (en) * 1975-03-12 1978-11-21 Technic, Inc. Silver complex, method of making said complex and method and electrolyte containing said complex for electroplating silver and silver alloys
SU1294877A1 (ru) * 1983-12-05 1987-03-07 Предприятие П/Я М-5841 Электролит меднени и способ его приготовлени
JPS6299477A (ja) * 1985-10-25 1987-05-08 C Uyemura & Co Ltd 無電解金めつき液
JPS63303091A (ja) * 1987-06-03 1988-12-09 Toyobo Co Ltd Ｃｕ−Ｓメッキの方法
US5302278A (en) * 1993-02-19 1994-04-12 Learonal, Inc. Cyanide-free plating solutions for monovalent metals
DE69406701T2 (de) * 1993-03-26 1998-04-02 Uyemura & Co C Chemisches Vergoldungsbad
JPH08104993A (ja) * 1994-10-04 1996-04-23 Electroplating Eng Of Japan Co 銀めっき浴及びその銀めっき方法

Also Published As

Publication number Publication date
KR20000076336A (ko) 2000-12-26
EP1009869A1 (en) 2000-06-21
US5750018A (en) 1998-05-12
CN1256722A (zh) 2000-06-14
EP1009869B1 (en) 2002-10-02
WO1998041675A1 (en) 1998-09-24
KR100484965B1 (ko) 2005-04-25
CN1170963C (zh) 2004-10-13
DE69808497D1 (de) 2002-11-07
JP2001516400A (ja) 2001-09-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: MUELLER-BORE & PARTNER, PATENTANWAELTE, EUROPEAN PAT

8339 Ceased/non-payment of the annual fee