JP2001516400A - シアンを含まない１価銅電気めっき液 - Google Patents

シアンを含まない１価銅電気めっき液

Info

Publication number
JP2001516400A
JP2001516400A JP54072098A JP54072098A JP2001516400A JP 2001516400 A JP2001516400 A JP 2001516400A JP 54072098 A JP54072098 A JP 54072098A JP 54072098 A JP54072098 A JP 54072098A JP 2001516400 A JP2001516400 A JP 2001516400A
Authority
JP
Japan
Prior art keywords
copper
plating solution
complexing agent
copper ions
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP54072098A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001516400A5 (enExample
Inventor
ウィリアム アール ブラッシュ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
LeaRonal Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LeaRonal Inc filed Critical LeaRonal Inc
Publication of JP2001516400A publication Critical patent/JP2001516400A/ja
Publication of JP2001516400A5 publication Critical patent/JP2001516400A5/ja
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP54072098A 1997-03-18 1998-03-17 シアンを含まない１価銅電気めっき液 Ceased JP2001516400A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/819,061 1997-03-18
US08/819,061 US5750018A (en) 1997-03-18 1997-03-18 Cyanide-free monovalent copper electroplating solutions
PCT/US1998/005211 WO1998041675A1 (en) 1997-03-18 1998-03-17 Cyanide-free monovalent copper electroplating solutions

Publications (2)

Publication Number Publication Date
JP2001516400A true JP2001516400A (ja) 2001-09-25
JP2001516400A5 JP2001516400A5 (enExample) 2005-08-11

Family

ID=25227108

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54072098A Ceased JP2001516400A (ja) 1997-03-18 1998-03-17 シアンを含まない１価銅電気めっき液

Country Status (7)

Country Link
US (1) US5750018A (enExample)
EP (1) EP1009869B1 (enExample)
JP (1) JP2001516400A (enExample)
KR (1) KR100484965B1 (enExample)
CN (1) CN1170963C (enExample)
DE (1) DE69808497T2 (enExample)
WO (1) WO1998041675A1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011528406A (ja) * 2008-07-15 2011-11-17 エントン インコーポレイテッド 銅層のガルバニック堆積のための無シアン化物電解質組成物
JP2012237060A (ja) * 2011-04-19 2012-12-06 Rohm & Haas Electronic Materials Llc 半導体上の銅のめっき
JP2015134960A (ja) * 2013-12-17 2015-07-27 Ykk株式会社 ストライク銅めっき液
WO2018110198A1 (ja) * 2016-12-16 2018-06-21 コニカミノルタ株式会社 透明導電膜の形成方法及び電解メッキ用メッキ液

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6197181B1 (en) 1998-03-20 2001-03-06 Semitool, Inc. Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece
US6565729B2 (en) 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
US6054037A (en) * 1998-11-11 2000-04-25 Enthone-Omi, Inc. Halogen additives for alkaline copper use for plating zinc die castings
JP2001073182A (ja) * 1999-07-15 2001-03-21 Boc Group Inc:The 改良された酸性銅電気メッキ用溶液
US6180524B1 (en) * 1999-08-09 2001-01-30 Gary W. Ferrell Metal deposit process
RU2179203C2 (ru) * 1999-11-16 2002-02-10 Калининградский государственный университет Электролит блестящего меднения
US6660154B2 (en) 2000-10-25 2003-12-09 Shipley Company, L.L.C. Seed layer
US6776893B1 (en) 2000-11-20 2004-08-17 Enthone Inc. Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect
JP4595237B2 (ja) * 2001-04-27 2010-12-08 日立金属株式会社 銅めっき液および銅めっき方法
US7025866B2 (en) * 2002-08-21 2006-04-11 Micron Technology, Inc. Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces
US20050092611A1 (en) * 2003-11-03 2005-05-05 Semitool, Inc. Bath and method for high rate copper deposition
US20050183961A1 (en) * 2004-02-24 2005-08-25 Morrissey Ronald J. Non-cyanide silver plating bath composition
TWI348499B (en) * 2006-07-07 2011-09-11 Rohm & Haas Elect Mat Electroless copper and redox couples
CN1932084B (zh) * 2006-08-25 2010-05-12 卢月红 无氰电镀液添加剂及其溶液的制备方法
US20100084278A1 (en) * 2008-10-02 2010-04-08 Rowan Anthony J Novel Cyanide-Free Electroplating Process for Zinc and Zinc Alloy Die-Cast Components
RU2385366C1 (ru) * 2008-12-15 2010-03-27 Федеральное государственное образовательное учреждение высшего профессионального образования Российский государственный университет им. Иммануила Канта Электролит меднения стальных подложек
CN101665962B (zh) * 2009-09-04 2012-06-27 厦门大学 一种钢铁基底上碱性无氰镀铜电镀液及其制备方法
CN101922027B (zh) * 2010-08-19 2011-10-26 武汉风帆电镀技术有限公司 无氰碱性镀铜液及其制备方法
US8747643B2 (en) * 2011-08-22 2014-06-10 Rohm And Haas Electronic Materials Llc Plating bath and method
US20140008234A1 (en) * 2012-07-09 2014-01-09 Rohm And Haas Electronic Materials Llc Method of metal plating semiconductors
PL2730682T3 (pl) * 2012-11-13 2018-12-31 Coventya Sas Alkaliczny, bezcyjankowy roztwór do galwanizacji stopami złota, sposób galwanizacji i podłoże zawierające błyszczący, wolny od korozji osad stopu złota
US9611550B2 (en) * 2012-12-26 2017-04-04 Rohm And Haas Electronic Materials Llc Formaldehyde free electroless copper plating compositions and methods
CN103014787B (zh) * 2012-12-28 2016-04-20 广东达志环保科技股份有限公司 一种铜电镀液及其电镀工艺
CN104711648B (zh) * 2013-12-17 2019-08-16 Ykk株式会社 闪镀铜镀敷液
CN103789801B (zh) * 2014-01-13 2017-03-15 浙江洽福科技有限公司 一种无氰预镀铜电镀液及其制备方法
CN103762009A (zh) * 2014-02-15 2014-04-30 芜湖鑫力管道技术有限公司 一种铜包黄铜复合线材及其生产方法
CN104131320A (zh) * 2014-06-25 2014-11-05 济南大学 一种含硫羰基络合剂的无氰亚铜电镀铜溶液及其稳定化方法
CN104120463B (zh) * 2014-06-25 2016-06-22 济南大学 钢铁基体的一种无氰亚铜电镀铜表面改性方法
CN104120468B (zh) * 2014-06-25 2016-08-03 济南大学 一种无氰亚铜电镀铜锌合金溶液
CN104141120B (zh) * 2014-07-01 2017-04-19 济南大学 一价铜化学镀铜液
KR102603763B1 (ko) * 2016-06-03 2023-11-16 에스케이온 주식회사 리튬 이차전지용 전극 집전체 및 그 제조방법
CN106011954B (zh) * 2016-07-25 2018-07-10 贵州大学 无氰电镀铜溶液及其制备方法及使用方法
CN108149285A (zh) * 2017-12-28 2018-06-12 广东达志环保科技股份有限公司 无氰镀铜电镀液和电镀方法
CN110760904A (zh) * 2019-10-31 2020-02-07 武汉奥邦表面技术有限公司 一种无氰碱性亚铜镀铜添加剂
CN113549961B (zh) * 2021-07-26 2022-11-15 广州鸿葳科技股份有限公司 一种无氰无磷无氮一价铜镀铜溶液及其制备方法与应用
US12448695B2 (en) * 2022-06-23 2025-10-21 City University Of Hong Kong Method for recovering metal from waste printed circuit board and a cell thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4126524A (en) * 1975-03-12 1978-11-21 Technic, Inc. Silver complex, method of making said complex and method and electrolyte containing said complex for electroplating silver and silver alloys
SU1294877A1 (ru) * 1983-12-05 1987-03-07 Предприятие П/Я М-5841 Электролит меднени и способ его приготовлени
JPS6299477A (ja) * 1985-10-25 1987-05-08 C Uyemura & Co Ltd 無電解金めつき液
JPS63303091A (ja) * 1987-06-03 1988-12-09 Toyobo Co Ltd Ｃｕ−Ｓメッキの方法
US5302278A (en) * 1993-02-19 1994-04-12 Learonal, Inc. Cyanide-free plating solutions for monovalent metals
EP0618307B1 (en) * 1993-03-26 1997-11-12 C. Uyemura & Co, Ltd Electroless gold plating bath
JPH08104993A (ja) * 1994-10-04 1996-04-23 Electroplating Eng Of Japan Co 銀めっき浴及びその銀めっき方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011528406A (ja) * 2008-07-15 2011-11-17 エントン インコーポレイテッド 銅層のガルバニック堆積のための無シアン化物電解質組成物
JP2012237060A (ja) * 2011-04-19 2012-12-06 Rohm & Haas Electronic Materials Llc 半導体上の銅のめっき
JP2015134960A (ja) * 2013-12-17 2015-07-27 Ykk株式会社 ストライク銅めっき液
WO2018110198A1 (ja) * 2016-12-16 2018-06-21 コニカミノルタ株式会社 透明導電膜の形成方法及び電解メッキ用メッキ液
JPWO2018110198A1 (ja) * 2016-12-16 2019-10-24 コニカミノルタ株式会社 透明導電膜の形成方法及び電解メッキ用メッキ液

Also Published As

Publication number Publication date
WO1998041675A1 (en) 1998-09-24
KR20000076336A (ko) 2000-12-26
US5750018A (en) 1998-05-12
CN1170963C (zh) 2004-10-13
EP1009869B1 (en) 2002-10-02
EP1009869A1 (en) 2000-06-21
DE69808497T2 (de) 2003-04-03
CN1256722A (zh) 2000-06-14
DE69808497D1 (de) 2002-11-07
KR100484965B1 (ko) 2005-04-25

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