DE69807658T2 - Mikroporöser kupferfilm und lösung für stromlose kupferplattierung zur herstellung derselben - Google Patents

Mikroporöser kupferfilm und lösung für stromlose kupferplattierung zur herstellung derselben

Info

Publication number
DE69807658T2
DE69807658T2 DE69807658T DE69807658T DE69807658T2 DE 69807658 T2 DE69807658 T2 DE 69807658T2 DE 69807658 T DE69807658 T DE 69807658T DE 69807658 T DE69807658 T DE 69807658T DE 69807658 T2 DE69807658 T2 DE 69807658T2
Authority
DE
Germany
Prior art keywords
production
solution
microporous
copper plating
electric less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69807658T
Other languages
English (en)
Other versions
DE69807658D1 (de
Inventor
Hideo Honma
Tomoyuki Fujinami
Nobuo Ebina
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Udylite Co Ltd
Original Assignee
Ebara Udylite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Udylite Co Ltd filed Critical Ebara Udylite Co Ltd
Publication of DE69807658D1 publication Critical patent/DE69807658D1/de
Application granted granted Critical
Publication of DE69807658T2 publication Critical patent/DE69807658T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/1648—Porous product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/125—Deflectable by temperature change [e.g., thermostat element]
    • Y10T428/12514—One component Cu-based
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
DE69807658T 1997-02-21 1998-02-19 Mikroporöser kupferfilm und lösung für stromlose kupferplattierung zur herstellung derselben Expired - Lifetime DE69807658T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP05250797A JP3198066B2 (ja) 1997-02-21 1997-02-21 微多孔性銅皮膜およびこれを得るための無電解銅めっき液
PCT/JP1998/000689 WO1998037260A1 (fr) 1997-02-21 1998-02-19 Feuil de cuivre microporeux et solution de depot autocatalytique permettant d'obtenir ce feuil

Publications (2)

Publication Number Publication Date
DE69807658D1 DE69807658D1 (de) 2002-10-10
DE69807658T2 true DE69807658T2 (de) 2003-05-08

Family

ID=12916654

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69807658T Expired - Lifetime DE69807658T2 (de) 1997-02-21 1998-02-19 Mikroporöser kupferfilm und lösung für stromlose kupferplattierung zur herstellung derselben

Country Status (11)

Country Link
US (2) US6329072B1 (de)
EP (1) EP0964076B1 (de)
JP (1) JP3198066B2 (de)
KR (1) KR100495531B1 (de)
CN (1) CN1204291C (de)
AU (1) AU6229798A (de)
DE (1) DE69807658T2 (de)
HK (1) HK1025365A1 (de)
MY (1) MY128899A (de)
TW (1) TW402644B (de)
WO (1) WO1998037260A1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3986743B2 (ja) * 2000-10-03 2007-10-03 株式会社日立製作所 配線基板とその製造方法及びそれに用いる無電解銅めっき液
JP2003013247A (ja) * 2001-04-24 2003-01-15 Murata Mfg Co Ltd 無電解銅めっき浴及び高周波用電子部品
DE10221503A1 (de) 2002-05-14 2003-11-27 Infineon Technologies Ag Zur wenigstens teilweisen Beschichtung mit einer Substanz bestimmter Metallgegenstand
US20050112432A1 (en) * 2002-08-27 2005-05-26 Jonah Erlebacher Method of plating metal leafs and metal membranes
CN100497732C (zh) * 2005-08-19 2009-06-10 广东光华化学厂有限公司 混合型非甲醛还原剂的化学镀铜液
US8040070B2 (en) * 2008-01-23 2011-10-18 Cree, Inc. Frequency converted dimming signal generation
JP5176618B2 (ja) * 2008-03-17 2013-04-03 株式会社村田製作所 インプリント用金型、およびそれを用いたインプリント方法
JP4516991B2 (ja) * 2008-06-26 2010-08-04 シャープ株式会社 電子写真用キャリア及びその用途
WO2012029405A1 (ja) * 2010-08-31 2012-03-08 株式会社村田製作所 多孔質金属膜、電極、集電体、それを用いた電気化学センサ、蓄電デバイス及び摺動部材並びに多孔質金属膜の製造方法
JP6171189B2 (ja) * 2012-02-02 2017-08-02 ナノ−ヌーヴェル プロプライエタリー リミテッドＮａｎｏ−Ｎｏｕｖｅｌｌｅ Ｐｔｙ Ｌｔｄ． 材料上の薄いコーティング
CN103422079B (zh) 2012-05-22 2016-04-13 比亚迪股份有限公司 一种化学镀铜液及其制备方法
JP2015001016A (ja) * 2013-06-17 2015-01-05 古河電気工業株式会社 銅箔、銅張積層板及びプリント配線板
CN103481583B (zh) * 2013-10-09 2017-01-04 北京科技大学 一种表面具有多孔结构的处理铜箔的制备方法
CN103531815B (zh) * 2013-10-25 2015-12-09 深圳清华大学研究院 集流体用穿孔箔及其制作方法
US10648096B2 (en) * 2014-12-12 2020-05-12 Infineon Technologies Ag Electrolyte, method of forming a copper layer and method of forming a chip
KR101809985B1 (ko) * 2017-03-30 2017-12-18 와이엠티 주식회사 다공성 구리박의 제조방법 및 이를 이용한 다공성 구리박

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5911678B2 (ja) 1979-12-06 1984-03-16 松下電器産業株式会社 多孔質銅薄膜の製造法
EP0132594B1 (de) * 1983-07-25 1988-09-07 Hitachi, Ltd. Lösung zum stromlosen Plattieren mit Kupfer
US4684550A (en) * 1986-04-25 1987-08-04 Mine Safety Appliances Company Electroless copper plating and bath therefor
JPS6416176A (en) 1987-07-10 1989-01-19 Nec Corp High speed vtr
JPH01309997A (ja) 1988-06-09 1989-12-14 Kanto Kasei Kogyo Kk 耐食性に優れた銅−ニッケル−クロム光沢電気めっき方法およびそれにより得られためっき皮膜
JPH02118097A (ja) 1988-10-27 1990-05-02 Eagle Ind Co Ltd 軸受摺動面の表面処理方法
JP2892428B2 (ja) * 1989-09-05 1999-05-17 新光電気工業株式会社 無電解金めっき液
DE69017197T2 (de) * 1990-05-18 1995-09-14 Japan Gore Tex Inc Hydrophile poröse Membrane aus Fluoropolymer.
JP2648729B2 (ja) * 1990-09-04 1997-09-03 英夫 本間 無電解銅めっき液および無電解銅めっき方法
JPH05222576A (ja) * 1992-02-10 1993-08-31 Tsubakimoto Chain Co 金属表面処理方法
JPH06306768A (ja) 1993-04-19 1994-11-01 Denki Kagaku Kogyo Kk 複合多孔質中空繊維及びその製造方法
JPH08243365A (ja) 1995-03-13 1996-09-24 Hitoshi Kobayashi 金属製濾過膜

Also Published As

Publication number Publication date
US20020046679A1 (en) 2002-04-25
AU6229798A (en) 1998-09-09
US6329072B1 (en) 2001-12-11
TW402644B (en) 2000-08-21
JP3198066B2 (ja) 2001-08-13
DE69807658D1 (de) 2002-10-10
CN1248300A (zh) 2000-03-22
EP0964076A4 (de) 2000-01-26
WO1998037260A1 (fr) 1998-08-27
EP0964076A1 (de) 1999-12-15
KR20000070941A (ko) 2000-11-25
JPH10237664A (ja) 1998-09-08
EP0964076B1 (de) 2002-09-04
CN1204291C (zh) 2005-06-01
KR100495531B1 (ko) 2005-06-14
MY128899A (en) 2007-02-28
HK1025365A1 (en) 2000-11-10

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