DE69737705D1 - Aktive Bildelementsensormatrix - Google Patents

Aktive Bildelementsensormatrix

Info

Publication number
DE69737705D1
DE69737705D1 DE69737705T DE69737705T DE69737705D1 DE 69737705 D1 DE69737705 D1 DE 69737705D1 DE 69737705 T DE69737705 T DE 69737705T DE 69737705 T DE69737705 T DE 69737705T DE 69737705 D1 DE69737705 D1 DE 69737705D1
Authority
DE
Germany
Prior art keywords
picture element
sensor matrix
element sensor
active picture
active
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69737705T
Other languages
English (en)
Other versions
DE69737705T2 (de
Inventor
Eric R Fossum
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
California Institute of Technology CalTech
Original Assignee
California Institute of Technology CalTech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by California Institute of Technology CalTech filed Critical California Institute of Technology CalTech
Publication of DE69737705D1 publication Critical patent/DE69737705D1/de
Application granted granted Critical
Publication of DE69737705T2 publication Critical patent/DE69737705T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C19/00—Digital stores in which the information is moved stepwise, e.g. shift registers
    • G11C19/28—Digital stores in which the information is moved stepwise, e.g. shift registers using semiconductor elements
    • G11C19/282—Digital stores in which the information is moved stepwise, e.g. shift registers using semiconductor elements with charge storage in a depletion layer, i.e. charge coupled devices [CCD]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14643—Photodiode arrays; MOS imagers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/50—Control of the SSIS exposure
    • H04N25/53—Control of the integration time
    • H04N25/533—Control of the integration time by using differing integration times for different sensor regions
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/616—Noise processing, e.g. detecting, correcting, reducing or removing noise involving a correlated sampling function, e.g. correlated double sampling [CDS] or triple sampling
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/67—Noise processing, e.g. detecting, correcting, reducing or removing noise applied to fixed-pattern noise, e.g. non-uniformity of response
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/10—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
DE69737705T 1996-01-22 1997-01-22 Aktive Bildelementsensormatrix Expired - Lifetime DE69737705T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US1030596P 1996-01-22 1996-01-22
US10305P 1996-01-22
US1370096P 1996-03-20 1996-03-20
US13700P 1996-03-20

Publications (2)

Publication Number Publication Date
DE69737705D1 true DE69737705D1 (de) 2007-06-14
DE69737705T2 DE69737705T2 (de) 2008-01-10

Family

ID=26681015

Family Applications (3)

Application Number Title Priority Date Filing Date
DE69733248T Expired - Lifetime DE69733248T2 (de) 1996-01-22 1997-01-22 Aktive bildelementsensormatrix mit elektronischer überblendung
DE69729648T Expired - Lifetime DE69729648T2 (de) 1996-01-22 1997-01-22 Aktivpixelsensormatrix mit mehrfachauflösungsausgabe
DE69737705T Expired - Lifetime DE69737705T2 (de) 1996-01-22 1997-01-22 Aktive Bildelementsensormatrix

Family Applications Before (2)

Application Number Title Priority Date Filing Date
DE69733248T Expired - Lifetime DE69733248T2 (de) 1996-01-22 1997-01-22 Aktive bildelementsensormatrix mit elektronischer überblendung
DE69729648T Expired - Lifetime DE69729648T2 (de) 1996-01-22 1997-01-22 Aktivpixelsensormatrix mit mehrfachauflösungsausgabe

Country Status (5)

Country Link
EP (2) EP0940029B1 (de)
JP (2) JP3887420B2 (de)
AU (2) AU1835397A (de)
DE (3) DE69733248T2 (de)
WO (2) WO1997028641A1 (de)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1013076B1 (de) * 1997-09-12 2001-02-28 Fraunhofer-Gesellschaft Zur Förderung Der Angewandten Forschung E.V. Bildsensorelemente
FR2773253A1 (fr) * 1997-12-30 1999-07-02 Thomson Csf Procede de commande d'un detecteur optique multi-elements
US6452633B1 (en) 1998-02-26 2002-09-17 Foveon, Inc. Exposure control in electronic cameras by detecting overflow from active pixels
KR100280488B1 (ko) * 1998-06-09 2001-02-01 김영환 전자셔터 기능을 가지는 액티브 픽셀 센서 방식의 픽셀 구조
US6665012B1 (en) 1998-09-22 2003-12-16 Pixim, Inc. Process-scalable high spatial resolution and low bit resolution CMOS area image sensor
EP1515541A3 (de) 1998-09-28 2008-07-23 3DV Systems Ltd. Entfernungsmessung mittels einer Kamera
US6326230B1 (en) 1999-01-06 2001-12-04 California Institute Of Technology High speed CMOS imager with motion artifact supression and anti-blooming
US6563540B2 (en) 1999-02-26 2003-05-13 Intel Corporation Light sensor with increased dynamic range
US6597398B1 (en) 1999-06-02 2003-07-22 Intel Corporation Image sensor response enhancement using fluorescent phosphors
US6437338B1 (en) * 1999-09-29 2002-08-20 General Electric Company Method and apparatus for scanning a detector array in an x-ray imaging system
DE19947536A1 (de) * 1999-10-02 2001-04-05 Philips Corp Intellectual Pty Verfahren zum Auslesen der Sensorelemente eines Sensors sowie Sensor
JP2003524345A (ja) * 2000-02-23 2003-08-12 フォトビット コーポレーション 分離記憶ノードを備えたフレームシャッターピクセル
KR100359770B1 (ko) * 2000-03-02 2002-11-04 주식회사 하이닉스반도체 씨모스 이미지 센서의 액티브 픽셀 회로
JP2004507910A (ja) 2000-07-05 2004-03-11 ビジョン−サイエンシズ・インコーポレーテッド ダイナミック・レンジ圧縮方法
JP2002330349A (ja) * 2001-04-26 2002-11-15 Fujitsu Ltd Ｘｙアドレス型固体撮像装置
JP2002359786A (ja) 2001-05-31 2002-12-13 Canon Inc 撮像装置および撮像制御方法
JP4551588B2 (ja) * 2001-07-03 2010-09-29 キヤノン株式会社 撮像装置および撮像システム
DE10208290C1 (de) * 2002-02-26 2003-07-24 Koenig & Bauer Ag Verfahren zur Signalauswertung eines elektronischen Bildsensors
JP4288346B2 (ja) 2003-08-19 2009-07-01 国立大学法人静岡大学 撮像装置及び画素回路
US7115923B2 (en) 2003-08-22 2006-10-03 Micron Technology, Inc. Imaging with gate controlled charge storage
US7154075B2 (en) * 2003-11-13 2006-12-26 Micron Technology, Inc. Method and apparatus for pixel signal binning and interpolation in column circuits of a sensor circuit
DE102004024165A1 (de) * 2004-05-14 2005-12-01 Kaltenbach & Voigt Gmbh & Co. Kg Zahnärztliche Vorrichtung zum Untersuchen der optischen Eigenschaften von Zahngewebe
US7568628B2 (en) 2005-03-11 2009-08-04 Hand Held Products, Inc. Bar code reading device with global electronic shutter control
EP4216103A1 (de) * 2005-03-11 2023-07-26 Hand Held Products, Inc. Strichcodelesegerät mit globaler elektronischer verschlusssteuerung
US7770799B2 (en) 2005-06-03 2010-08-10 Hand Held Products, Inc. Optical reader having reduced specular reflection read failures
JP2007175294A (ja) * 2005-12-28 2007-07-12 Ge Medical Systems Global Technology Co Llc イメージセンサ及びその制御方法並びにｘ線検出器及びｘ線ｃｔ装置
JP5311834B2 (ja) 2008-01-24 2013-10-09 キヤノン株式会社 撮像装置、撮像システム、信号処理方法及びプログラム
JP5585903B2 (ja) 2008-07-30 2014-09-10 国立大学法人静岡大学 距離画像センサ、及び撮像信号を飛行時間法により生成する方法
US10023745B2 (en) 2009-09-28 2018-07-17 San-Ei Gen F.F.I., Inc. Turmeric pigment composition and method for preparing same
DE102010030108B4 (de) 2010-06-15 2014-12-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Farbbildsensor
CN107911633B (zh) 2011-12-27 2021-05-14 株式会社尼康 固体成像元件及摄像装置
JP6579741B2 (ja) * 2014-10-09 2019-09-25 キヤノン株式会社 撮像装置及び放射線撮像システム
US10245028B2 (en) 2015-02-27 2019-04-02 Ethicon Llc Power adapter for a surgical instrument
US10091441B1 (en) 2015-09-28 2018-10-02 Apple Inc. Image capture at multiple resolutions
DE102016113010A1 (de) 2015-12-15 2017-06-22 Basler Ag Bestimmung von Helligkeitswerten virtueller Pixel
DE102016112968B4 (de) * 2016-07-14 2018-06-14 Basler Ag Bestimmung von Farbwerten für Pixel an Zwischenpositionen
JP7083608B2 (ja) * 2016-09-29 2022-06-13 ブリルニクス シンガポール プライベート リミテッド 固体撮像装置、固体撮像装置の駆動方法、および電子機器
JP6859553B2 (ja) * 2017-01-12 2021-04-14 ブリルニクス インク 固体撮像装置、固体撮像装置の駆動方法、および電子機器
CN111247801B (zh) * 2017-09-28 2022-06-14 苹果公司 用于事件相机数据处理的系统和方法
CN111712921A (zh) * 2017-12-12 2020-09-25 拉芳德利责任有限公司 用于可见光和紫外光检测的半导体光学传感器及其对应的制造过程
CN115356545B (zh) * 2022-08-10 2023-04-11 中国科学院近代物理研究所 一种用于带电粒子探测的新型像素单元结构及其使用方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2501934C2 (de) * 1974-01-25 1982-11-11 Hughes Aircraft Co., Culver City, Calif. Verfahren zum Betrieb eines ladungsgekoppelten Halbleiter-Bauelementes und ladungsgekoppeltes Halbleiter-Bauelement zur Durchführung dieses Verfahrens
JPS5345119A (en) * 1976-10-06 1978-04-22 Hitachi Ltd Solid state pickup element
US4287441A (en) * 1979-03-30 1981-09-01 The United States Of America As Represented By The Secretary Of The Army Correlated double sampling CCD video preprocessor-amplifier
JPH0669049B2 (ja) * 1984-08-20 1994-08-31 株式会社東芝 Ｃｃｄ出力信号処理回路
FR2604320B1 (fr) * 1986-09-19 1988-11-04 Thomson Csf Systeme de prise de vues en videographie rapide utilisant un capteur optique matriciel a transfert de charges
US4873561A (en) * 1988-04-19 1989-10-10 Wen David D High dynamic range charge-coupled device
JPH0766961B2 (ja) * 1988-10-07 1995-07-19 三菱電機株式会社 固体撮像素子
US5051797A (en) * 1989-09-05 1991-09-24 Eastman Kodak Company Charge-coupled device (CCD) imager and method of operation
US5262871A (en) * 1989-11-13 1993-11-16 Rutgers, The State University Multiple resolution image sensor
US5182623A (en) * 1989-11-13 1993-01-26 Texas Instruments Incorporated Charge coupled device/charge super sweep image system and method for making
US5196939A (en) * 1989-12-28 1993-03-23 Loral Fairchild Corporation Method and apparatus for transferring images from an imaging array
JPH05235317A (ja) * 1991-03-11 1993-09-10 Nikon Corp 固体撮像素子
JPH05134111A (ja) * 1991-11-15 1993-05-28 Sharp Corp 固体撮像装置
GB2269505B (en) * 1992-08-07 1996-07-24 Gec Ferranti Defence Syst Integrated-circuit image processing device
US5625411A (en) * 1992-12-22 1997-04-29 Fuji Photo Film, Ltd. Video camera printer apparatus and method of controlling same and apparatus and method for detecting print inhibit signal
JP2883254B2 (ja) * 1992-12-29 1999-04-19 富士写真フイルム株式会社 ビデオ・カメラおよびその制御方法
US5493335A (en) * 1993-06-30 1996-02-20 Eastman Kodak Company Single sensor color camera with user selectable image record size
US5386128A (en) * 1994-01-21 1995-01-31 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Monolithic in-based III-V compound semiconductor focal plane array cell with single stage CCD output
US5471515A (en) * 1994-01-28 1995-11-28 California Institute Of Technology Active pixel sensor with intra-pixel charge transfer
US5440343A (en) * 1994-02-28 1995-08-08 Eastman Kodak Company Motion/still electronic image sensing apparatus
DE69520242T2 (de) * 1994-05-16 2001-09-06 Agfa Corp Verfahren und Vorrichtung für eine rauscharme ladungsgekoppelte Anordnung
US5563429A (en) * 1994-06-14 1996-10-08 Nikon Corp. Solid state imaging device
US5631704A (en) * 1994-10-14 1997-05-20 Lucent Technologies, Inc. Active pixel sensor and imaging system having differential mode
US5541402A (en) * 1994-10-17 1996-07-30 At&T Corp. Imaging active pixel device having a non-destructive read-out gate
US5625210A (en) * 1995-04-13 1997-04-29 Eastman Kodak Company Active pixel sensor integrated with a pinned photodiode

Also Published As

Publication number Publication date
JP2000504516A (ja) 2000-04-11
JP2000504489A (ja) 2000-04-11
WO1997028558A3 (en) 1997-10-02
WO1997028558A2 (en) 1997-08-07
DE69729648T2 (de) 2005-06-09
DE69733248D1 (de) 2005-06-16
EP0940029A1 (de) 1999-09-08
EP0940029B1 (de) 2004-06-23
JP3887420B2 (ja) 2007-02-28
WO1997028641A1 (en) 1997-08-07
AU1833597A (en) 1997-08-22
EP0940029A4 (de) 2001-01-17
DE69729648D1 (de) 2004-07-29
EP0878007B1 (de) 2005-05-11
AU1835397A (en) 1997-08-22
EP0878007A4 (de) 2001-05-16
DE69737705T2 (de) 2008-01-10
DE69733248T2 (de) 2006-01-19
EP0878007A2 (de) 1998-11-18

Similar Documents

Publication Publication Date Title
DE69737705D1 (de) Aktive Bildelementsensormatrix
DE69508372D1 (de) Bildsensor
DE69723501D1 (de) Anzeigevorrichtung mit aktiver Matrix
DE69835989D1 (de) Bildsensor mit aktivem Pixel mit geteiltem Ablesungsverstärker
DE69723542D1 (de) Bildsensor
DE69816588D1 (de) Bildsensor mit anzeigemöglichkeiten
DE69636146D1 (de) Kontaktbildsensor
DE59808815D1 (de) Sensoreinrichtung
DE69611584D1 (de) Wärmebildgerät
DE59408736D1 (de) Sensorarray
DE59810102D1 (de) Sensorvorrichtung
DE59813733D1 (de) Sensorsystem
DE69633703D1 (de) Wärmebildgerät
DE59510649D1 (de) Aktiver bewegungssensor
DE59712865D1 (de) Sensoranordnung
DE69739700D1 (de) Sensormatrix
DE69804380T2 (de) MOS Bildsensor
DE19815150B4 (de) Sensoranordnung
DE69817007D1 (de) Feuchtigkeitssensor
DE59810137D1 (de) Sensoreinrichtung
DE19881346D2 (de) Sensorelement
DE69738475D1 (de) Anzeigevorrichtung mit aktiver Matrix
DE29705615U1 (de) Sensoranordnung
DE69620655T2 (de) Sensorelement
DE29718245U1 (de) Meßwertgeber

Legal Events

Date Code Title Description
8364 No opposition during term of opposition