DE69737599D1 - Integrierte nachgiebige sonde für waferprüfung und einbrennen - Google Patents
Integrierte nachgiebige sonde für waferprüfung und einbrennenInfo
- Publication number
- DE69737599D1 DE69737599D1 DE69737599T DE69737599T DE69737599D1 DE 69737599 D1 DE69737599 D1 DE 69737599D1 DE 69737599 T DE69737599 T DE 69737599T DE 69737599 T DE69737599 T DE 69737599T DE 69737599 D1 DE69737599 D1 DE 69737599D1
- Authority
- DE
- Germany
- Prior art keywords
- burning
- checking
- subsequent probe
- integrated
- integrated subsequent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/0675—Needle-like
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
- G01R1/06761—Material aspects related to layers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
- H01L2224/1134—Stud bumping, i.e. using a wire-bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00013—Fully indexed content
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US2611296P | 1996-09-13 | 1996-09-13 | |
US26112P | 1996-09-13 | ||
PCT/US1997/016265 WO1998011446A1 (en) | 1996-09-13 | 1997-09-12 | Integrated compliant probe for wafer level test and burn-in |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69737599D1 true DE69737599D1 (de) | 2007-05-24 |
DE69737599T2 DE69737599T2 (de) | 2007-12-20 |
Family
ID=21829990
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69737599T Expired - Lifetime DE69737599T2 (de) | 1996-09-13 | 1997-09-12 | Integrierte nachgiebige sonde für waferprüfung und einbrennen |
Country Status (5)
Country | Link |
---|---|
US (1) | US6528984B2 (de) |
EP (1) | EP0925510B1 (de) |
JP (1) | JP2000502812A (de) |
DE (1) | DE69737599T2 (de) |
WO (1) | WO1998011446A1 (de) |
Families Citing this family (74)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5729150A (en) * | 1995-12-01 | 1998-03-17 | Cascade Microtech, Inc. | Low-current probe card with reduced triboelectric current generating cables |
US5914613A (en) * | 1996-08-08 | 1999-06-22 | Cascade Microtech, Inc. | Membrane probing system with local contact scrub |
US6034533A (en) * | 1997-06-10 | 2000-03-07 | Tervo; Paul A. | Low-current pogo probe card |
JP3302635B2 (ja) * | 1998-01-30 | 2002-07-15 | 信越ポリマー株式会社 | 電気コネクタ及びその製造方法 |
US6256882B1 (en) * | 1998-07-14 | 2001-07-10 | Cascade Microtech, Inc. | Membrane probing system |
JP2000294311A (ja) * | 1999-04-12 | 2000-10-20 | Shin Etsu Polymer Co Ltd | 電気コネクタとその製造方法 |
US6710609B2 (en) * | 2002-07-15 | 2004-03-23 | Nanonexus, Inc. | Mosaic decal probe |
US7382142B2 (en) | 2000-05-23 | 2008-06-03 | Nanonexus, Inc. | High density interconnect system having rapid fabrication cycle |
US20070245553A1 (en) * | 1999-05-27 | 2007-10-25 | Chong Fu C | Fine pitch microfabricated spring contact structure & method |
US6799976B1 (en) * | 1999-07-28 | 2004-10-05 | Nanonexus, Inc. | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
US6812718B1 (en) | 1999-05-27 | 2004-11-02 | Nanonexus, Inc. | Massively parallel interface for electronic circuits |
US7247035B2 (en) * | 2000-06-20 | 2007-07-24 | Nanonexus, Inc. | Enhanced stress metal spring contactor |
US6578264B1 (en) * | 1999-06-04 | 2003-06-17 | Cascade Microtech, Inc. | Method for constructing a membrane probe using a depression |
JP4306911B2 (ja) * | 2000-02-21 | 2009-08-05 | 株式会社日本マイクロニクス | 電気的接続装置 |
US6838890B2 (en) * | 2000-02-25 | 2005-01-04 | Cascade Microtech, Inc. | Membrane probing system |
US7579848B2 (en) * | 2000-05-23 | 2009-08-25 | Nanonexus, Inc. | High density interconnect system for IC packages and interconnect assemblies |
US20050068054A1 (en) * | 2000-05-23 | 2005-03-31 | Sammy Mok | Standardized layout patterns and routing structures for integrated circuit wafer probe card assemblies |
US7952373B2 (en) | 2000-05-23 | 2011-05-31 | Verigy (Singapore) Pte. Ltd. | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
JP2002107416A (ja) * | 2000-09-27 | 2002-04-10 | Kamotekku Kk | 半導体検査治具 |
DE10143173A1 (de) | 2000-12-04 | 2002-06-06 | Cascade Microtech Inc | Wafersonde |
WO2003052435A1 (en) * | 2001-08-21 | 2003-06-26 | Cascade Microtech, Inc. | Membrane probing system |
JP3794586B2 (ja) * | 2001-08-24 | 2006-07-05 | ナノネクサス インク | スパッタされた膜において、均一な等方性の応力を生じさせるための方法および装置 |
US7157922B2 (en) | 2002-04-16 | 2007-01-02 | Nhk Spring Co., Ltd. | Planar electroconductive contact probe holder |
KR100864916B1 (ko) * | 2002-05-23 | 2008-10-22 | 캐스케이드 마이크로테크 인코포레이티드 | 피시험 디바이스를 테스트하기 위한 프로브 |
US6724205B1 (en) * | 2002-11-13 | 2004-04-20 | Cascade Microtech, Inc. | Probe for combined signals |
US7121838B2 (en) * | 2003-04-09 | 2006-10-17 | Intel Corporation | Electronic assembly having angled spring portions |
US7057404B2 (en) | 2003-05-23 | 2006-06-06 | Sharp Laboratories Of America, Inc. | Shielded probe for testing a device under test |
US20040249825A1 (en) * | 2003-06-05 | 2004-12-09 | International Business Machines Corporation | Administering devices with dynamic action lists |
WO2005065258A2 (en) | 2003-12-24 | 2005-07-21 | Cascade Microtech, Inc. | Active wafer probe |
US6832917B1 (en) | 2004-01-16 | 2004-12-21 | Intercon Systems, Inc. | Interposer assembly |
US6981879B2 (en) * | 2004-03-18 | 2006-01-03 | International Business Machines Corporation | Land grid array (LGA) interposer with adhesive-retained contacts and method of manufacture |
DE202005021386U1 (de) * | 2004-07-07 | 2007-11-29 | Cascade Microtech, Inc., Beaverton | Prüfkopf mit einem Messfühler mit Membranaufhängung |
US7172431B2 (en) * | 2004-08-27 | 2007-02-06 | International Business Machines Corporation | Electrical connector design and contact geometry and method of use thereof and methods of fabrication thereof |
US20060074836A1 (en) * | 2004-09-03 | 2006-04-06 | Biowisdom Limited | System and method for graphically displaying ontology data |
US7420381B2 (en) | 2004-09-13 | 2008-09-02 | Cascade Microtech, Inc. | Double sided probing structures |
TWI255466B (en) * | 2004-10-08 | 2006-05-21 | Ind Tech Res Inst | Polymer-matrix conductive film and method for fabricating the same |
KR100968184B1 (ko) * | 2004-12-16 | 2010-07-05 | 인터내셔널 비지네스 머신즈 코포레이션 | 금속화 엘라스토머 전기 접점 |
US7771208B2 (en) | 2004-12-16 | 2010-08-10 | International Business Machines Corporation | Metalized elastomeric electrical contacts |
US7296871B2 (en) * | 2004-12-29 | 2007-11-20 | Lexmark International, Inc. | Device and structure arrangements for integrated circuits and methods for analyzing the same |
US7656172B2 (en) | 2005-01-31 | 2010-02-02 | Cascade Microtech, Inc. | System for testing semiconductors |
US7535247B2 (en) | 2005-01-31 | 2009-05-19 | Cascade Microtech, Inc. | Interface for testing semiconductors |
US7371676B2 (en) * | 2005-04-08 | 2008-05-13 | Micron Technology, Inc. | Method for fabricating semiconductor components with through wire interconnects |
US7393770B2 (en) * | 2005-05-19 | 2008-07-01 | Micron Technology, Inc. | Backside method for fabricating semiconductor components with conductive interconnects |
US7307348B2 (en) | 2005-12-07 | 2007-12-11 | Micron Technology, Inc. | Semiconductor components having through wire interconnects (TWI) |
US7982290B2 (en) * | 2006-01-12 | 2011-07-19 | Palo Alto Research Center, Inc. | Contact spring application to semiconductor devices |
US7659612B2 (en) | 2006-04-24 | 2010-02-09 | Micron Technology, Inc. | Semiconductor components having encapsulated through wire interconnects (TWI) |
US7723999B2 (en) | 2006-06-12 | 2010-05-25 | Cascade Microtech, Inc. | Calibration structures for differential signal probing |
US7403028B2 (en) | 2006-06-12 | 2008-07-22 | Cascade Microtech, Inc. | Test structure and probe for differential signals |
US7764072B2 (en) | 2006-06-12 | 2010-07-27 | Cascade Microtech, Inc. | Differential signal probing system |
US8832936B2 (en) * | 2007-04-30 | 2014-09-16 | International Business Machines Corporation | Method of forming metallized elastomeric electrical contacts |
US7876114B2 (en) | 2007-08-08 | 2011-01-25 | Cascade Microtech, Inc. | Differential waveguide probe |
US7688089B2 (en) * | 2008-01-25 | 2010-03-30 | International Business Machines Corporation | Compliant membrane thin film interposer probe for intergrated circuit device testing |
JP2009192309A (ja) * | 2008-02-13 | 2009-08-27 | Shinko Electric Ind Co Ltd | 半導体検査装置 |
US7888957B2 (en) | 2008-10-06 | 2011-02-15 | Cascade Microtech, Inc. | Probing apparatus with impedance optimized interface |
US8119576B2 (en) * | 2008-10-10 | 2012-02-21 | Halliburton Energy Services, Inc. | Ceramic coated particulates |
WO2010059247A2 (en) | 2008-11-21 | 2010-05-27 | Cascade Microtech, Inc. | Replaceable coupon for a probing apparatus |
US8760186B2 (en) * | 2010-02-19 | 2014-06-24 | International Business Machines Corporation | Probe apparatus assembly and method |
TWI439698B (zh) * | 2011-09-30 | 2014-06-01 | Hermes Testing Solutions Inc | 電路測試探針卡及其探針基板結構 |
TW201344093A (zh) * | 2012-04-18 | 2013-11-01 | Gem Weltronics Twn Corp | 一體化多層式照明裝置及可倍數組合之一體化多層式照明裝置 |
US8899993B2 (en) * | 2012-08-07 | 2014-12-02 | Amphenol InterCon Systems, Inc. | Interposer plate |
US20140176174A1 (en) * | 2012-12-26 | 2014-06-26 | Advanced Inquiry Systems, Inc. | Designed asperity contactors, including nanospikes for semiconductor test, and associated systems and methods |
DE102013211405B4 (de) | 2013-06-18 | 2020-06-04 | Infineon Technologies Ag | Verfahren zur herstellung eines halbleitermoduls |
US9408304B2 (en) | 2014-01-22 | 2016-08-02 | Globalfoundries Inc. | Through printed circuit board (PCB) vias |
KR101737047B1 (ko) * | 2015-10-16 | 2017-05-18 | 주식회사 오킨스전자 | 메탈 코어 솔더 볼을 이용하는 도전 와이어 본딩 구조체 및 그 제조방법, 그리고 이를 포함하는 테스트 소켓 |
WO2017007200A2 (ko) * | 2015-07-03 | 2017-01-12 | 주식회사 오킨스전자 | 테스트 소켓, 테스트 소켓 제조 방법, 및 테스트 소켓용 지그 어셈블리 |
KR101717679B1 (ko) * | 2015-10-16 | 2017-03-20 | 주식회사 오킨스전자 | 와이어별 독립적인 개별 실리콘 지지 구조를 가지는 테스트 소켓 |
KR101694507B1 (ko) * | 2015-10-16 | 2017-01-11 | 주식회사 오킨스전자 | 와이어마다 개별 도전 실리콘 고무에 의하여 가압 전도되는 테스트 소켓 |
KR101705693B1 (ko) * | 2015-10-16 | 2017-02-10 | 주식회사 오킨스전자 | 테스트 소켓의 제조 방법 및 그 제조에 사용되는 지그 어셈블리 |
KR101763369B1 (ko) * | 2015-12-17 | 2017-08-01 | 주식회사 오킨스전자 | 개별 pcb 랜드를 포함하는 테스트 소켓 |
KR101734383B1 (ko) | 2016-01-07 | 2017-05-12 | 주식회사 에스에프에이반도체 | 반도체 테스트 소켓 제조 방법 |
KR101785428B1 (ko) * | 2016-04-21 | 2017-10-16 | (주) 마이크로프랜드 | 반도체소자 테스트소켓 |
US10753959B1 (en) * | 2018-05-04 | 2020-08-25 | Facebook Technologies, Llc | Microspring probe card with insulation block |
EP3856575A1 (de) * | 2018-09-25 | 2021-08-04 | Saint-Gobain Glass France | Bauteil mit elektrischen funktionselementen für die fertigung einer verbundscheibe |
US11579182B1 (en) * | 2020-02-11 | 2023-02-14 | Meta Platforms Technologies, Llc | Probe card for efficient screening of highly-scaled monolithic semiconductor devices |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58165056A (ja) | 1982-03-25 | 1983-09-30 | Nippon Denshi Zairyo Kk | プロ−ブカ−ド |
CH661129A5 (de) * | 1982-10-21 | 1987-06-30 | Feinmetall Gmbh | Kontaktiervorrichtung. |
US5917707A (en) | 1993-11-16 | 1999-06-29 | Formfactor, Inc. | Flexible contact structure with an electrically conductive shell |
JP2903652B2 (ja) | 1990-06-19 | 1999-06-07 | 富士ゼロックス株式会社 | ファクシミリ制御方式 |
JP2873414B2 (ja) * | 1990-11-30 | 1999-03-24 | 東京エレクトロン株式会社 | 半導体ウエハ検査装置 |
JPH04240570A (ja) | 1991-01-24 | 1992-08-27 | Shimadzu Corp | マイクロ・プローブ・ボード |
JPH0555319A (ja) | 1991-08-26 | 1993-03-05 | Nec Ibaraki Ltd | Ic用ソケツト |
US5225777A (en) | 1992-02-04 | 1993-07-06 | International Business Machines Corporation | High density probe |
US5371654A (en) * | 1992-10-19 | 1994-12-06 | International Business Machines Corporation | Three dimensional high performance interconnection package |
JP3100097B2 (ja) | 1993-04-16 | 2000-10-16 | 東京エレクトロン株式会社 | プローバ用コンタクタ |
US5810607A (en) * | 1995-09-13 | 1998-09-22 | International Business Machines Corporation | Interconnector with contact pads having enhanced durability |
US5483741A (en) | 1993-09-03 | 1996-01-16 | Micron Technology, Inc. | Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice |
US6064213A (en) * | 1993-11-16 | 2000-05-16 | Formfactor, Inc. | Wafer-level burn-in and test |
US5534784A (en) | 1994-05-02 | 1996-07-09 | Motorola, Inc. | Method for probing a semiconductor wafer |
JPH07321490A (ja) | 1994-05-26 | 1995-12-08 | Shinano Polymer Kk | 電気コネクタ |
US5495667A (en) | 1994-11-07 | 1996-03-05 | Micron Technology, Inc. | Method for forming contact pins for semiconductor dice and interconnects |
DE69535629T2 (de) | 1994-11-15 | 2008-07-31 | Formfactor, Inc., Livermore | Montage von elektronischen komponenten auf einer leiterplatte |
DE19507127A1 (de) * | 1995-03-01 | 1996-09-12 | Test Plus Electronic Gmbh | Adaptersystem für Baugruppen-Platinen, zu verwenden in einer Prüfeinrichtung |
JP3001182B2 (ja) | 1995-08-29 | 2000-01-24 | 信越ポリマー株式会社 | 液晶パネル検査装置およびその製造方法 |
US5785538A (en) * | 1995-11-27 | 1998-07-28 | International Business Machines Corporation | High density test probe with rigid surface structure |
JP3307823B2 (ja) | 1996-02-23 | 2002-07-24 | 松下電器産業株式会社 | 電子部品検査用接触体の製造方法 |
JPH09281145A (ja) | 1996-04-15 | 1997-10-31 | Toppan Printing Co Ltd | 異方性導電材を有する検査治具及びその製造方法 |
JPH09304472A (ja) | 1996-05-10 | 1997-11-28 | Hitachi Ltd | 接続装置 |
JP3128199B2 (ja) | 1996-06-28 | 2001-01-29 | 信越ポリマー株式会社 | 検査用プローブ |
WO1998001906A1 (en) * | 1996-07-05 | 1998-01-15 | Formfactor, Inc. | Floating lateral support for ends of elongate interconnection elements |
US5793330A (en) * | 1996-11-20 | 1998-08-11 | Gec-Marconi Electronic Systems Corp. | Interleaved planar array antenna system providing opposite circular polarizations |
-
1997
- 1997-09-12 EP EP97941594A patent/EP0925510B1/de not_active Expired - Lifetime
- 1997-09-12 JP JP10513934A patent/JP2000502812A/ja active Pending
- 1997-09-12 WO PCT/US1997/016265 patent/WO1998011446A1/en active IP Right Grant
- 1997-09-12 US US09/254,768 patent/US6528984B2/en not_active Expired - Lifetime
- 1997-09-12 DE DE69737599T patent/DE69737599T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US6528984B2 (en) | 2003-03-04 |
JP2000502812A (ja) | 2000-03-07 |
EP0925510A1 (de) | 1999-06-30 |
WO1998011446A1 (en) | 1998-03-19 |
EP0925510B1 (de) | 2007-04-11 |
US20020130676A1 (en) | 2002-09-19 |
DE69737599T2 (de) | 2007-12-20 |
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