DE69722673D1 - Laserherstellungsverfahren für Glassubstrate und so hergestellte Mikrolinsenmatrizen - Google Patents
Laserherstellungsverfahren für Glassubstrate und so hergestellte MikrolinsenmatrizenInfo
- Publication number
- DE69722673D1 DE69722673D1 DE69722673T DE69722673T DE69722673D1 DE 69722673 D1 DE69722673 D1 DE 69722673D1 DE 69722673 T DE69722673 T DE 69722673T DE 69722673 T DE69722673 T DE 69722673T DE 69722673 D1 DE69722673 D1 DE 69722673D1
- Authority
- DE
- Germany
- Prior art keywords
- produced
- manufacturing process
- glass substrates
- microlens arrays
- laser manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B23/00—Re-forming shaped glass
- C03B23/006—Re-forming shaped glass by fusing, e.g. for flame sealing
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B23/00—Re-forming shaped glass
- C03B23/02—Re-forming glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B29/00—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B29/00—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins
- C03B29/02—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins in a discontinuous way
- C03B29/025—Glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
- C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0012—Arrays characterised by the manufacturing method
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
- G02B3/0056—Arrays characterized by the distribution or form of lenses arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/32—Optical coupling means having lens focusing means positioned between opposed fibre ends
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B2201/00—Type of glass produced
- C03B2201/06—Doped silica-based glasses
- C03B2201/30—Doped silica-based glasses doped with metals, e.g. Ga, Sn, Sb, Pb or Bi
- C03B2201/58—Doped silica-based glasses doped with metals, e.g. Ga, Sn, Sb, Pb or Bi doped with metals in non-oxide form, e.g. CdSe
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
- G02B6/3644—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the coupling means being through-holes or wall apertures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3664—2D cross sectional arrangements of the fibres
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Laser Beam Processing (AREA)
- Surface Treatment Of Glass (AREA)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP06844096A JP3797702B2 (ja) | 1996-03-25 | 1996-03-25 | ガラス基材のレーザ加工方法、この方法によって得られる回折格子及びマイクロレンズアレイ |
JP6845596 | 1996-03-25 | ||
JP06845596A JP3797703B2 (ja) | 1996-03-25 | 1996-03-25 | ガラス基材のレーザ加工方法 |
JP6844096 | 1996-03-25 | ||
JP17612496 | 1996-07-05 | ||
JP17612496A JP3838700B2 (ja) | 1996-07-05 | 1996-07-05 | ガラス基材のレーザ加工方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69722673D1 true DE69722673D1 (de) | 2003-07-10 |
DE69722673T2 DE69722673T2 (de) | 2004-02-05 |
Family
ID=27299743
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69722673T Expired - Fee Related DE69722673T2 (de) | 1996-03-25 | 1997-03-14 | Laserherstellungsverfahren für Glassubstrate und so hergestellte Mikrolinsenmatrizen |
DE69705827T Expired - Fee Related DE69705827T2 (de) | 1996-03-25 | 1997-03-14 | Laserherstellungsverfahren für glassubstrate, und damit hergestellte beugunggitter |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69705827T Expired - Fee Related DE69705827T2 (de) | 1996-03-25 | 1997-03-14 | Laserherstellungsverfahren für glassubstrate, und damit hergestellte beugunggitter |
Country Status (6)
Country | Link |
---|---|
US (3) | US6220058B1 (de) |
EP (2) | EP1016634B1 (de) |
AU (1) | AU1941397A (de) |
DE (2) | DE69722673T2 (de) |
TW (1) | TW440551B (de) |
WO (1) | WO1997035811A1 (de) |
Families Citing this family (51)
Publication number | Priority date | Publication date | Assignee | Title |
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US6473220B1 (en) * | 1998-01-22 | 2002-10-29 | Trivium Technologies, Inc. | Film having transmissive and reflective properties |
JP2001105164A (ja) * | 1999-10-07 | 2001-04-17 | Sumitomo Heavy Ind Ltd | レーザ穴あけ加工方法及び加工装置 |
US6825995B2 (en) | 2000-04-27 | 2004-11-30 | Sony Corporation | Optical device, optical system, method of production of same, and mold for production of same |
JP4659300B2 (ja) | 2000-09-13 | 2011-03-30 | 浜松ホトニクス株式会社 | レーザ加工方法及び半導体チップの製造方法 |
US20020033558A1 (en) * | 2000-09-20 | 2002-03-21 | Fahey Kevin P. | UV laser cutting or shape modification of brittle, high melting temperature target materials such as ceramics or glasses |
US7157038B2 (en) | 2000-09-20 | 2007-01-02 | Electro Scientific Industries, Inc. | Ultraviolet laser ablative patterning of microstructures in semiconductors |
US6676878B2 (en) | 2001-01-31 | 2004-01-13 | Electro Scientific Industries, Inc. | Laser segmented cutting |
JP4512786B2 (ja) * | 2000-11-17 | 2010-07-28 | 独立行政法人産業技術総合研究所 | ガラス基板の加工方法 |
JP2002350673A (ja) * | 2001-05-23 | 2002-12-04 | Nippon Sheet Glass Co Ltd | 光モジュールおよびその組立て方法 |
JP2002350674A (ja) | 2001-05-23 | 2002-12-04 | Nippon Sheet Glass Co Ltd | 光モジュールおよびその製造方法 |
JP5067684B2 (ja) * | 2001-06-14 | 2012-11-07 | Nltテクノロジー株式会社 | 液晶表示装置及びその製造方法 |
KR100415625B1 (ko) * | 2001-08-06 | 2004-01-24 | 한국전자통신연구원 | 이온 교환법을 이용한 평면형 광도파로 제조 방법 |
JP4041298B2 (ja) * | 2001-10-05 | 2008-01-30 | 日本板硝子株式会社 | レーザ光照射によるガラスの加工方法 |
JP3925169B2 (ja) * | 2001-11-26 | 2007-06-06 | 株式会社デンソー | レーザー光による材料の同時一括溶融方法及び装置 |
JP2003215388A (ja) * | 2002-01-25 | 2003-07-30 | Hitachi Metals Ltd | レンズ付き光ファイバー組立体とその製造方法 |
US6756563B2 (en) * | 2002-03-07 | 2004-06-29 | Orbotech Ltd. | System and method for forming holes in substrates containing glass |
US8268704B2 (en) | 2002-03-12 | 2012-09-18 | Hamamatsu Photonics K.K. | Method for dicing substrate |
ATE493226T1 (de) | 2002-03-12 | 2011-01-15 | Hamamatsu Photonics Kk | Verfahren zum schneiden eines bearbeiteten objekts |
TWI326626B (en) | 2002-03-12 | 2010-07-01 | Hamamatsu Photonics Kk | Laser processing method |
US7345824B2 (en) * | 2002-03-26 | 2008-03-18 | Trivium Technologies, Inc. | Light collimating device |
JP2003307602A (ja) * | 2002-04-18 | 2003-10-31 | Nippon Sheet Glass Co Ltd | 平板レンズおよび平板レンズアレイの製造方法 |
JP2003340580A (ja) * | 2002-05-24 | 2003-12-02 | Konica Minolta Holdings Inc | レーザ加工方法 |
SG108299A1 (en) * | 2002-06-11 | 2005-01-28 | Inst Data Storage | Method and apparatus for forming periodic structures |
WO2004035255A1 (ja) * | 2002-09-27 | 2004-04-29 | Nec Machinery Corporation | 周期構造作成方法および表面処理方法 |
WO2004036294A2 (en) * | 2002-10-17 | 2004-04-29 | Trivium Technologies, Inc. | Light control device and methods of making same |
TWI520269B (zh) | 2002-12-03 | 2016-02-01 | Hamamatsu Photonics Kk | Cutting method of semiconductor substrate |
FR2852250B1 (fr) | 2003-03-11 | 2009-07-24 | Jean Luc Jouvin | Fourreau de protection pour canule, un ensemble d'injection comportant un tel fourreau et aiguille equipee d'un tel fourreau |
DE60315515T2 (de) | 2003-03-12 | 2007-12-13 | Hamamatsu Photonics K.K., Hamamatsu | Laserstrahlbearbeitungsverfahren |
US7655152B2 (en) * | 2004-04-26 | 2010-02-02 | Hewlett-Packard Development Company, L.P. | Etching |
DE102004039023A1 (de) * | 2004-08-11 | 2006-02-23 | Siemens Ag | Verfahren zur Bearbeitung eines Werkstücks mittels Laserstrahlung, Laserbearbeitungssystem |
GB0509727D0 (en) * | 2005-05-13 | 2005-06-22 | Renishaw Plc | Method and apparatus for scale manufacture |
GB2454342B (en) * | 2005-06-30 | 2010-02-03 | Hoya Corp | Optical image stabilizer |
JP2007298697A (ja) * | 2006-04-28 | 2007-11-15 | Univ Of Southampton | 回折素子とその製造方法 |
GB2451595B (en) * | 2006-04-28 | 2009-06-17 | Univ Southampton | Diffraction element and method of manufacturing the same |
US20100027114A1 (en) | 2006-12-19 | 2010-02-04 | Koninklijke Philips Electronics N.V. | Lens structure and manufacturing method, and the manufacture of shaped polymer articles |
DE102007035147A1 (de) * | 2007-03-27 | 2008-10-02 | Schleifring Und Apparatebau Gmbh | Linsenanordnung für optische Drehübertrager in beliebigen Umgebungsmedien |
US8226253B2 (en) * | 2008-02-27 | 2012-07-24 | Lubart Neil D | Concentrators for solar power generating systems |
TWI395630B (zh) * | 2009-06-30 | 2013-05-11 | Mitsuboshi Diamond Ind Co Ltd | 使用雷射光之玻璃基板加工裝置 |
US20130051530A1 (en) * | 2011-08-30 | 2013-02-28 | Fujifilm Corporation | High Aspect Ratio Grid for Phase Contrast X-ray Imaging and Method of Making the Same |
CN102581109B (zh) * | 2012-03-26 | 2014-05-28 | 江苏大学 | 一种生物非光滑表面的制备方法和装置 |
US9938186B2 (en) * | 2012-04-13 | 2018-04-10 | Corning Incorporated | Strengthened glass articles having etched features and methods of forming the same |
DE102012010635B4 (de) | 2012-05-18 | 2022-04-07 | Leibniz-Institut für Oberflächenmodifizierung e.V. | Verfahren zur 3D-Strukturierung und Formgebung von Oberflächen aus harten, spröden und optischen Materialien |
CN103253851A (zh) * | 2013-04-27 | 2013-08-21 | 北京工业大学 | 一种掩膜贴片选区co2激光辐照制作玻璃微透镜的方法 |
CN103273196B (zh) * | 2013-06-20 | 2015-07-08 | 北京工业大学 | 有机玻璃的co2激光选区辐照扫描加工微透镜阵列的方法 |
CN106574988B (zh) * | 2014-07-29 | 2018-11-20 | 杜比实验室特许公司 | 激光加工的光学部件以及用于拾取和接合组件的相关方法 |
EP3047932B1 (de) * | 2015-01-21 | 2018-12-26 | Agie Charmilles New Technologies SA | Laserablationsverfahren zum Gravieren einer Oberfläche mit Patch-Optimierung, mit entsprechenden Software und Bearbeitungsmaschine |
CN108569851A (zh) * | 2017-03-14 | 2018-09-25 | 鸿富锦精密工业(深圳)有限公司 | 玻璃切割方法 |
US11719891B2 (en) * | 2020-08-05 | 2023-08-08 | Corning Research & Development Corporation | Method of making a lensed connector with photosensitive glass |
US11269136B1 (en) | 2020-08-27 | 2022-03-08 | Northrop Grumman Systems Corporation | Hollow core optical fiber array launcher with sealed lens block |
US11446776B2 (en) | 2020-08-27 | 2022-09-20 | Northrop Grumman Systems Corporation | Method for assembling a hollow core optical fiber array launcher |
CN113296178B (zh) * | 2021-06-09 | 2022-07-19 | 中国工程物理研究院激光聚变研究中心 | 一种co2激光在熔石英表面直接制备正弦相位光栅的方法 |
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US5768022A (en) * | 1995-03-08 | 1998-06-16 | Brown University Research Foundation | Laser diode having in-situ fabricated lens element |
JP3270814B2 (ja) * | 1996-08-27 | 2002-04-02 | 日本板硝子株式会社 | 回折型光学素子の製造方法 |
JP3155717B2 (ja) * | 1996-10-24 | 2001-04-16 | 日本板硝子株式会社 | マイクロレンズに対するレーザ加工方法 |
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-
1997
- 1997-03-14 DE DE69722673T patent/DE69722673T2/de not_active Expired - Fee Related
- 1997-03-14 WO PCT/JP1997/000822 patent/WO1997035811A1/en active IP Right Grant
- 1997-03-14 EP EP00102470A patent/EP1016634B1/de not_active Expired - Lifetime
- 1997-03-14 AU AU19413/97A patent/AU1941397A/en not_active Abandoned
- 1997-03-14 EP EP97907322A patent/EP0889855B1/de not_active Expired - Lifetime
- 1997-03-14 US US09/155,125 patent/US6220058B1/en not_active Expired - Fee Related
- 1997-03-14 DE DE69705827T patent/DE69705827T2/de not_active Expired - Fee Related
- 1997-03-21 TW TW086103582A patent/TW440551B/zh active
-
2001
- 2001-02-20 US US09/789,090 patent/US6470712B2/en not_active Expired - Fee Related
- 2001-02-20 US US09/789,776 patent/US20010028502A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
AU1941397A (en) | 1997-10-17 |
EP1016634A3 (de) | 2000-09-27 |
US6220058B1 (en) | 2001-04-24 |
DE69705827D1 (de) | 2001-08-30 |
US20020017116A1 (en) | 2002-02-14 |
DE69722673T2 (de) | 2004-02-05 |
EP0889855B1 (de) | 2001-07-25 |
WO1997035811A1 (en) | 1997-10-02 |
US6470712B2 (en) | 2002-10-29 |
EP0889855A1 (de) | 1999-01-13 |
TW440551B (en) | 2001-06-16 |
EP1016634B1 (de) | 2003-06-04 |
US20010028502A1 (en) | 2001-10-11 |
DE69705827T2 (de) | 2001-11-08 |
EP1016634A2 (de) | 2000-07-05 |
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