DE69713155D1 - Halbleiteranordnung und herstellungsverfahren - Google Patents

Halbleiteranordnung und herstellungsverfahren

Info

Publication number
DE69713155D1
DE69713155D1 DE69713155T DE69713155T DE69713155D1 DE 69713155 D1 DE69713155 D1 DE 69713155D1 DE 69713155 T DE69713155 T DE 69713155T DE 69713155 T DE69713155 T DE 69713155T DE 69713155 D1 DE69713155 D1 DE 69713155D1
Authority
DE
Germany
Prior art keywords
production method
semiconductor arrangement
semiconductor
arrangement
production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69713155T
Other languages
English (en)
Inventor
Hiroharu Okada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Application granted granted Critical
Publication of DE69713155D1 publication Critical patent/DE69713155D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/20—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
    • B32B37/203—One or more of the layers being plastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/305—Associated digital information
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/36—Identification or security features, e.g. for preventing forgery comprising special materials
    • B42D25/373—Metallic materials
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07784—Antenna details the antenna being of the inductive type the inductive antenna consisting of a plurality of coils stacked on top of one another
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/34—Inserts
    • B32B2305/342—Chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2425/00—Cards, e.g. identity cards, credit cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2519/00—Labels, badges
    • B32B2519/02—RFID tags
DE69713155T 1996-12-17 1997-12-08 Halbleiteranordnung und herstellungsverfahren Expired - Lifetime DE69713155D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8336485A JPH10166770A (ja) 1996-12-17 1996-12-17 非接触型ｉｃカード及びその製造方法
PCT/JP1997/004503 WO1998026939A1 (fr) 1996-12-17 1997-12-08 Dispositif semi-conducteur et son procede de fabrication

Publications (1)

Publication Number Publication Date
DE69713155D1 true DE69713155D1 (de) 2002-07-11

Family

ID=18299627

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69713155T Expired - Lifetime DE69713155D1 (de) 1996-12-17 1997-12-08 Halbleiteranordnung und herstellungsverfahren

Country Status (8)

Country Link
EP (1) EP0952543B1 (de)
JP (1) JPH10166770A (de)
KR (1) KR20000057401A (de)
CN (1) CN1077050C (de)
AU (1) AU722306B2 (de)
CA (1) CA2273945A1 (de)
DE (1) DE69713155D1 (de)
WO (1) WO1998026939A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE60036496T2 (de) 1999-02-24 2008-06-19 Hitachi Maxell, Ltd., Ibaraki Verfahren zum Herstellen eines IC-Elements mit Spule
JP3729491B2 (ja) * 2000-02-22 2005-12-21 東レエンジニアリング株式会社 非接触ｉｄカード類及びその製造方法
DE10016715C1 (de) 2000-04-04 2001-09-06 Infineon Technologies Ag Herstellungsverfahren für laminierte Chipkarten
FR2809986B1 (fr) * 2000-06-13 2008-06-20 Gemplus Card Int Procede de fabrication de cartes a puce par extrusion
DE10120269C1 (de) 2001-04-25 2002-07-25 Muehlbauer Ag Verfahren zum Verbinden von Mikrochips mit auf einem Trägerband angeordneten Antennen zum Herstellen eines Transponders
US6606247B2 (en) 2001-05-31 2003-08-12 Alien Technology Corporation Multi-feature-size electronic structures
DE10136359C2 (de) * 2001-07-26 2003-06-12 Muehlbauer Ag Verfahren zum Verbinden von Mikrochipmodulen mit auf einem ersten Trägerband angeordneten Antennen zum Herstellen eines Transponders
US7253735B2 (en) 2003-03-24 2007-08-07 Alien Technology Corporation RFID tags and processes for producing RFID tags
KR101161361B1 (ko) 2004-03-26 2012-06-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치
US7688206B2 (en) 2004-11-22 2010-03-30 Alien Technology Corporation Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
JP4815891B2 (ja) * 2005-06-22 2011-11-16 株式会社日立製作所 無線ｉｃタグ及びアンテナの製造方法
FR2908207B1 (fr) * 2006-11-03 2009-03-06 Oberthur Card Syst Sa Carte a microcircuit, en particulier de dimension reduite, pourvue d'une antenne

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5294290A (en) * 1982-06-07 1994-03-15 Reeb Max E Computer and electromagnetic energy based mass production method for the continuous flow make of planar electrical circuits
JPH0635228B2 (ja) * 1985-08-16 1994-05-11 トツパン・ム−ア株式会社 Ｉｃカ−ドの作成方法
JPS6241069A (ja) * 1985-08-16 1987-02-23 Nec Corp 両方向トラクタのテンシヨン機構
JPH0554209A (ja) * 1991-12-20 1993-03-05 Arimura Giken Kk カード装置
JPH06241096A (ja) * 1993-02-17 1994-08-30 Toyota Motor Corp アイドル回転数制御装置
JPH06336096A (ja) * 1993-05-28 1994-12-06 Omron Corp カード形基板
JPH08216570A (ja) * 1995-02-09 1996-08-27 Hitachi Chem Co Ltd Ｉｃカード
JPH09286188A (ja) * 1996-04-23 1997-11-04 Matsushita Electric Works Ltd 非接触型ｉｃカード

Also Published As

Publication number Publication date
EP0952543A1 (de) 1999-10-27
CA2273945A1 (en) 1998-06-25
JPH10166770A (ja) 1998-06-23
AU722306B2 (en) 2000-07-27
WO1998026939A1 (fr) 1998-06-25
CN1077050C (zh) 2002-01-02
EP0952543A4 (de) 1999-10-27
AU5138998A (en) 1998-07-15
EP0952543B1 (de) 2002-06-05
KR20000057401A (ko) 2000-09-15
CN1240386A (zh) 2000-01-05

Similar Documents

Publication Publication Date Title
DE69739354D1 (de) Halbleiteranordnung und deren Herstellungsverfahren
DE69834561D1 (de) Halbleiteranordnung und herstellungsverfahren dafür
DE69510337D1 (de) Halbleiterspeicheranordnungen und herstellungsverfahren
DE69721411D1 (de) Halbleiteranordnung und Herstellungsverfahren dafür
DE69533511D1 (de) Lichtemittierende halbleitervorrichtung und herstellungsverfahren
DE69435045D1 (de) Halbleiter-Anordnung und Herstellungsverfahren dafür
DE69714852T2 (de) Stichfestes kleidungsstück und herstellungsverfahren dafür
DE69733450D1 (de) Thermoelektrischer Halbleiter und Herstellungsverfahren dafür
DE69735361D1 (de) Harzverkapselte halbleiteranordnung und herstellungsverfahren dafür
DE69737588D1 (de) Halbleiteranordnung und Herstellungsverfahren dafür
DE69929456D1 (de) Nahfeldabtastkopf und herstellungsverfahren
DE69527330T2 (de) Halbleiteranordnung und Herstellungsverfahren
KR950034612A (ko) 반도체 구조물 및 그 제조 방법
DE69637728D1 (de) Halbleiterbauteil und Herstellung desselben
DE69534938D1 (de) Photovoltaisches Bauelement und Herstellungsverfahren
DE69736151D1 (de) Photovoltaische Anordnung und Herstellungsverfahren
DE69637488D1 (de) Halbleiter und Halbleitermodul
DE69616057T2 (de) Umhülltes retroreflektierendes element und herstellungsverfahren
DE69904731D1 (de) Feinzerkleinerer und feinzerkleinerungsverfahren
DE69736827D1 (de) Sperrschnitt-feldeffektreferenzpotentiale und herstellungsverfahren dazu
DE69727608D1 (de) Halbleiterlaservorrichtung und zugehöriges Entwurfsverfahren
DE69420944D1 (de) Halbleitervorrichtung und herstellungsverfahren
DE69941874D1 (de) Optielektronisches bauelement und herstellungsverfahren
DE69801342T2 (de) Halbleiterlaser und dazugehöriges Herstellungsverfahren
ATE216063T1 (de) Halbleiterbrückenzünder und herstellungsverfahren dafür

Legal Events

Date Code Title Description
8332 No legal effect for de