DE69700266T2 - Oberflächenbehandlungsmittel für Kupfer und Kupferlegierungen - Google Patents

Oberflächenbehandlungsmittel für Kupfer und Kupferlegierungen

Info

Publication number
DE69700266T2
DE69700266T2 DE69700266T DE69700266T DE69700266T2 DE 69700266 T2 DE69700266 T2 DE 69700266T2 DE 69700266 T DE69700266 T DE 69700266T DE 69700266 T DE69700266 T DE 69700266T DE 69700266 T2 DE69700266 T2 DE 69700266T2
Authority
DE
Germany
Prior art keywords
copper
surface treatment
treatment agents
alloys
copper alloys
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69700266T
Other languages
English (en)
Other versions
DE69700266D1 (de
Inventor
Hirohiko Hirao
Yoshimasa Kikukawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shikoku Chemicals Corp
Original Assignee
Shikoku Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26406635&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69700266(T2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Shikoku Chemicals Corp filed Critical Shikoku Chemicals Corp
Application granted granted Critical
Publication of DE69700266D1 publication Critical patent/DE69700266D1/de
Publication of DE69700266T2 publication Critical patent/DE69700266T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • C23C22/52—Treatment of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/14—Nitrogen-containing compounds
    • C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
DE69700266T 1996-02-26 1997-02-24 Oberflächenbehandlungsmittel für Kupfer und Kupferlegierungen Expired - Lifetime DE69700266T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6549096 1996-02-26
JP27172296A JP3547028B2 (ja) 1996-02-26 1996-09-19 銅及び銅合金の表面処理剤

Publications (2)

Publication Number Publication Date
DE69700266D1 DE69700266D1 (de) 1999-07-22
DE69700266T2 true DE69700266T2 (de) 1999-11-04

Family

ID=26406635

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69700266T Expired - Lifetime DE69700266T2 (de) 1996-02-26 1997-02-24 Oberflächenbehandlungsmittel für Kupfer und Kupferlegierungen

Country Status (9)

Country Link
US (1) US5795409A (de)
EP (1) EP0791671B1 (de)
JP (1) JP3547028B2 (de)
KR (1) KR100473905B1 (de)
CA (1) CA2197965C (de)
DE (1) DE69700266T2 (de)
ES (1) ES2134034T3 (de)
SG (1) SG54469A1 (de)
TW (1) TW393524B (de)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9425030D0 (en) 1994-12-09 1995-02-08 Alpha Metals Ltd Silver plating
GB9425031D0 (en) * 1994-12-09 1995-02-08 Alpha Metals Ltd Printed circuit board manufacture
US6036758A (en) * 1998-08-10 2000-03-14 Pmd (U.K.) Limited Surface treatment of copper
US6524644B1 (en) * 1999-08-26 2003-02-25 Enthone Inc. Process for selective deposition of OSP coating on copper, excluding deposition on gold
JP3952410B2 (ja) * 2004-02-10 2007-08-01 タムラ化研株式会社 金属の表面処理剤、プリント回路基板およびプリント回路基板の金属の表面処理方法
JP4546163B2 (ja) * 2004-06-10 2010-09-15 四国化成工業株式会社 銅または銅合金の表面処理剤及び半田付け方法
DE102005031181A1 (de) * 2005-07-01 2007-01-04 Endress + Hauser Gmbh + Co. Kg Leiterplatte mit einer Oberfläche mit mehreren Kontaktflächen, Verfahren zur Beschichtung von Kontaktflächen einer Leiterplatte
KR100668129B1 (ko) * 2005-07-07 2007-01-11 백양케미칼(주) 프리플럭스 조성물
ATE482303T1 (de) * 2005-10-25 2010-10-15 Atotech Deutschland Gmbh Zusammensetzung und verfahren zur haftfähigkeitsverbesserung der polymerischen materialien auf kupfer- oder kupferlegierungsoberflächen
CN101029397B (zh) * 2006-03-03 2011-04-13 Mec株式会社 表面处理剂和使用了该表面处理剂的皮膜形成方法
JP4968909B2 (ja) * 2006-03-03 2012-07-04 メック株式会社 表面処理剤
US7794531B2 (en) * 2007-01-08 2010-09-14 Enthone Inc. Organic solderability preservative comprising high boiling temperature alcohol
US7883738B2 (en) * 2007-04-18 2011-02-08 Enthone Inc. Metallic surface enhancement
US10017863B2 (en) * 2007-06-21 2018-07-10 Joseph A. Abys Corrosion protection of bronzes
TWI453301B (zh) 2007-11-08 2014-09-21 Enthone 浸鍍銀塗層上的自組分子
US7972655B2 (en) * 2007-11-21 2011-07-05 Enthone Inc. Anti-tarnish coatings
JP4751464B2 (ja) * 2009-06-02 2011-08-17 住友電気工業株式会社 接続方法，接続構造および電子機器
WO2010140469A1 (ja) * 2009-06-01 2010-12-09 住友電気工業株式会社 接続方法，接続構造および電子機器
CN101697662B (zh) * 2009-10-29 2011-04-27 深圳市唯特偶新材料股份有限公司 一种高抗热性有机保焊剂
JP5351830B2 (ja) 2010-05-21 2013-11-27 日東電工株式会社 配線回路基板およびその製造方法
JP5615227B2 (ja) 2011-05-23 2014-10-29 四国化成工業株式会社 銅または銅合金の表面処理剤及びその利用
JP5615233B2 (ja) 2011-06-20 2014-10-29 四国化成工業株式会社 銅または銅合金の表面処理剤及びその利用
US9238864B2 (en) 2012-03-09 2016-01-19 Halliburton Energy Services, Inc. Controlled coating apparatus, systems, and methods
KR101454967B1 (ko) * 2012-08-08 2014-11-03 주식회사 에이스테크놀로지 표면 처리제 및 표면 처리 방법
JP6012393B2 (ja) * 2012-10-23 2016-10-25 四国化成工業株式会社 銅の表面処理剤および表面処理方法
JP5985368B2 (ja) * 2012-11-20 2016-09-06 四国化成工業株式会社 銅または銅合金の表面処理液及びその利用
US8961678B2 (en) 2012-12-20 2015-02-24 Rohm And Haas Electronic Materials Llc Organic solderability preservative and method
WO2014150723A1 (en) * 2013-03-15 2014-09-25 Ccl Label, Inc. Thin conductors, connectors, articles using such, and related methods
CN103498136B (zh) * 2013-06-28 2016-01-06 合肥工业大学 一种锌白铜用防高温变色剂及其使用方法
CN105350005B (zh) * 2014-08-20 2018-04-03 中国石油化工股份有限公司 一种含钝化剂的复配酸洗液及其制备方法
CN107148156B (zh) * 2017-05-08 2019-06-28 广东光华科技股份有限公司 3,6-二氧杂-1,8-辛二胺四乙酸衍生物的应用及osp处理液
CN109735838B (zh) * 2019-03-14 2021-06-29 广东省石油与精细化工研究院 一种铜面选择性有机可焊保护剂
CN115043779A (zh) * 2022-06-14 2022-09-13 广东金柏化学有限公司 一种2,4-二苯基咪唑化合物及其制备方法与应用
CN114833491B (zh) * 2022-06-21 2024-04-30 广东哈福技术股份有限公司 一种铜面选择性有机保焊剂及其使用方法
CN115011956A (zh) * 2022-06-28 2022-09-06 南通赛可特电子有限公司 一种有机铜面保护剂及其制备方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5618077A (en) * 1979-07-21 1981-02-20 Yukio Fujino Generation and generator utilizing balanced pulley rope type truck
JPS6141775A (ja) * 1984-08-01 1986-02-28 Hitachi Chem Co Ltd 銅の表面処理法
JP2913410B2 (ja) * 1990-02-13 1999-06-28 株式会社三和研究所 銅又は銅合金の表面処理剤
KR960008153B1 (ko) * 1989-10-03 1996-06-20 다찌바나 다이끼찌 금속 공작용 표면 처리제
EP0428383A1 (de) * 1989-11-13 1991-05-22 Shikoku Chemicals Corporation Verfahren zur Oberflächenbehandlung von Kupfer und Kupferlegierungen
TW217426B (de) * 1992-01-08 1993-12-11 Mekku Kk
JPH062176A (ja) * 1992-06-18 1994-01-11 Metsuku Kk 銅および銅合金の表面処理剤
JPH0681161A (ja) * 1992-08-31 1994-03-22 Hitachi Ltd 銅及び銅合金の表面処理剤
TW263534B (de) * 1993-08-11 1995-11-21 Makkusu Kk
JP2923596B2 (ja) * 1993-08-11 1999-07-26 メック株式会社 イミダゾール系化合物を用いた銅および銅合金の表面処理剤
JPH0779061A (ja) * 1993-09-07 1995-03-20 Mec Kk 銅および銅合金の表面処理剤
JPH07166381A (ja) * 1993-12-13 1995-06-27 Mec Kk 銅および銅合金の表面処理剤
JP2781954B2 (ja) * 1994-03-04 1998-07-30 メック株式会社 銅および銅合金の表面処理剤

Also Published As

Publication number Publication date
DE69700266D1 (de) 1999-07-22
US5795409A (en) 1998-08-18
CA2197965A1 (en) 1997-08-27
JPH09291372A (ja) 1997-11-11
SG54469A1 (en) 1998-11-16
EP0791671B1 (de) 1999-06-16
KR19980023952A (ko) 1998-07-06
KR100473905B1 (ko) 2005-09-06
EP0791671A1 (de) 1997-08-27
CA2197965C (en) 2005-01-11
JP3547028B2 (ja) 2004-07-28
TW393524B (en) 2000-06-11
ES2134034T3 (es) 1999-09-16

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Legal Events

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