DE69716328D1 - Elektroplattierungsverfahren und Zusammenstellung - Google Patents

Elektroplattierungsverfahren und Zusammenstellung

Info

Publication number
DE69716328D1
DE69716328D1 DE69716328T DE69716328T DE69716328D1 DE 69716328 D1 DE69716328 D1 DE 69716328D1 DE 69716328 T DE69716328 T DE 69716328T DE 69716328 T DE69716328 T DE 69716328T DE 69716328 D1 DE69716328 D1 DE 69716328D1
Authority
DE
Germany
Prior art keywords
assembly
electroplating process
electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69716328T
Other languages
English (en)
Other versions
DE69716328T2 (de
Inventor
Wade Sonnenberg
Patrick J Houle
Thong B Luong
James G Shelnut
Gordon Fischer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Rohm and Haas Electronic Materials LLC
Original Assignee
Shipley Co Inc
Shipley Co LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co Inc, Shipley Co LLC filed Critical Shipley Co Inc
Publication of DE69716328D1 publication Critical patent/DE69716328D1/de
Application granted granted Critical
Publication of DE69716328T2 publication Critical patent/DE69716328T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/92—Electrolytic coating of circuit board or printed circuit, other than selected area coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
DE69716328T 1996-04-01 1997-03-20 Elektroplattierungsverfahren und Zusammenstellung Expired - Fee Related DE69716328T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/625,126 US5667662A (en) 1996-04-01 1996-04-01 Electroplating process and composition

Publications (2)

Publication Number Publication Date
DE69716328D1 true DE69716328D1 (de) 2002-11-21
DE69716328T2 DE69716328T2 (de) 2003-07-10

Family

ID=24504696

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69716328T Expired - Fee Related DE69716328T2 (de) 1996-04-01 1997-03-20 Elektroplattierungsverfahren und Zusammenstellung

Country Status (4)

Country Link
US (1) US5667662A (de)
EP (1) EP0799911B1 (de)
JP (1) JPH1046389A (de)
DE (1) DE69716328T2 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6017967A (en) * 1996-04-01 2000-01-25 Shipley Company, L.L.C. Electroplating process and composition
US6123995A (en) * 1998-03-06 2000-09-26 Shipley Company, L.L.C. Method of manufacture of multilayer circuit boards
DE19917569A1 (de) * 1999-04-19 2000-10-26 Forschungszentrum Juelich Gmbh Wasserkontinuierliches System, Verfahren zur Poymerisation sowie Verwendung des wasserkontinuierlichen Systems
US6582583B1 (en) 1998-11-30 2003-06-24 The United States Of America As Represented By The Department Of Health And Human Services Amperometric biomimetic enzyme sensors based on modified cyclodextrin as electrocatalysts
US6899829B2 (en) * 2000-11-30 2005-05-31 Shipley Company, L.L.C. Conductive polymer colloidal compositions with selectivity for non-conductive surfaces
US7560015B2 (en) * 2002-05-27 2009-07-14 Concast Ag Process for electrolytic coating of a strand casting mould
US8252381B1 (en) * 2007-04-06 2012-08-28 CSL, Inc. Molecular coating on metal surfaces
EP2465976B1 (de) 2010-12-15 2013-04-03 Rohm and Haas Electronic Materials LLC Verfahren zum Elektroplattieren gleichmäßiger Kupferschichten an den Kanten und Seitenwänden von Durchgangslöchern eines Substrats
KR20140098229A (ko) * 2011-12-02 2014-08-07 비와이케이-케미 게엠베하 비도전성 기판상에 전기 도전성 구조를 생산하는 방법 및 이러한 방법으로 만들어진 구조
CN109110878B (zh) * 2018-09-09 2021-11-05 中国海洋大学 一种提高复合正渗透膜水通量的方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4526706A (en) * 1980-05-01 1985-07-02 Eastman Kodak Company Conductive latex compositions, elements and processes
JPH0778116B2 (ja) * 1987-02-09 1995-08-23 住友化学工業株式会社 ポリピロ−ル類水分散液の製造方法
JPH02123175A (ja) * 1988-10-31 1990-05-10 Mitsui Petrochem Ind Ltd 金属缶内面被覆用塗料
US5049303A (en) * 1988-11-09 1991-09-17 Lever Brothers Company, Division Of Conopco, Inc. Detergent compositions containing a mixture of an ethylene oxide/propylene oxide block copolymer and a polycarboxylate
US5415762A (en) * 1993-08-18 1995-05-16 Shipley Company Inc. Electroplating process and composition

Also Published As

Publication number Publication date
JPH1046389A (ja) 1998-02-17
DE69716328T2 (de) 2003-07-10
EP0799911B1 (de) 2002-10-16
EP0799911A1 (de) 1997-10-08
US5667662A (en) 1997-09-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee