DE69635721T2 - Glasschneidescheibe - Google Patents
Glasschneidescheibe Download PDFInfo
- Publication number
- DE69635721T2 DE69635721T2 DE69635721T DE69635721T DE69635721T2 DE 69635721 T2 DE69635721 T2 DE 69635721T2 DE 69635721 T DE69635721 T DE 69635721T DE 69635721 T DE69635721 T DE 69635721T DE 69635721 T2 DE69635721 T2 DE 69635721T2
- Authority
- DE
- Germany
- Prior art keywords
- glass
- cutting disc
- glass cutting
- line
- circumferential
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011521 glass Substances 0.000 title claims description 81
- 230000002093 peripheral effect Effects 0.000 claims description 11
- 239000005357 flat glass Substances 0.000 description 31
- 230000015572 biosynthetic process Effects 0.000 description 7
- 239000005391 art glass Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 238000006748 scratching Methods 0.000 description 3
- 230000002393 scratching effect Effects 0.000 description 3
- 241001499740 Plantago alpina Species 0.000 description 2
- 206010041662 Splinter Diseases 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000009191 jumping Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- WNEODWDFDXWOLU-QHCPKHFHSA-N 3-[3-(hydroxymethyl)-4-[1-methyl-5-[[5-[(2s)-2-methyl-4-(oxetan-3-yl)piperazin-1-yl]pyridin-2-yl]amino]-6-oxopyridin-3-yl]pyridin-2-yl]-7,7-dimethyl-1,2,6,8-tetrahydrocyclopenta[3,4]pyrrolo[3,5-b]pyrazin-4-one Chemical compound C([C@@H](N(CC1)C=2C=NC(NC=3C(N(C)C=C(C=3)C=3C(=C(N4C(C5=CC=6CC(C)(C)CC=6N5CC4)=O)N=CC=3)CO)=O)=CC=2)C)N1C1COC1 WNEODWDFDXWOLU-QHCPKHFHSA-N 0.000 description 1
- 229920001817 Agar Polymers 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 238000009760 electrical discharge machining Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 239000010687 lubricating oil Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/105—Details of cutting or scoring means, e.g. tips
- C03B33/107—Wheel design, e.g. materials, construction, shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B23/00—Portable grinding machines, e.g. hand-guided; Accessories therefor
- B24B23/08—Portable grinding machines designed for fastening on workpieces or other parts of particular section, e.g. for grinding commutators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
- B24B3/02—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of milling cutters
- B24B3/08—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of milling cutters of profile milling cutters, e.g. of disc type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
- B24B3/36—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades
- B24B3/46—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades of disc blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/12—Hand tools
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/30—Breaking or tearing apparatus
- Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
- Y10T225/321—Preliminary weakener
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/02—Other than completely through work thickness
- Y10T83/0333—Scoring
- Y10T83/0385—Rotary scoring blade
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/929—Tool or tool with support
- Y10T83/9372—Rotatable type
- Y10T83/9403—Disc type
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mining & Mineral Resources (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28717595 | 1995-11-06 | ||
| JP28717595 | 1995-11-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69635721D1 DE69635721D1 (de) | 2006-04-06 |
| DE69635721T2 true DE69635721T2 (de) | 2006-08-31 |
Family
ID=17714054
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69635721T Expired - Lifetime DE69635721T2 (de) | 1995-11-06 | 1996-03-07 | Glasschneidescheibe |
| DE69638332T Expired - Lifetime DE69638332D1 (de) | 1995-11-06 | 1996-03-07 | Glasschneidescheibe |
| DE69613655T Expired - Lifetime DE69613655T2 (de) | 1995-11-06 | 1996-03-07 | Glasschneidescheibe |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69638332T Expired - Lifetime DE69638332D1 (de) | 1995-11-06 | 1996-03-07 | Glasschneidescheibe |
| DE69613655T Expired - Lifetime DE69613655T2 (de) | 1995-11-06 | 1996-03-07 | Glasschneidescheibe |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US5836229A (OSRAM) |
| EP (5) | EP1092686B1 (OSRAM) |
| KR (1) | KR100279184B1 (OSRAM) |
| CN (1) | CN1125787C (OSRAM) |
| DE (3) | DE69635721T2 (OSRAM) |
| TW (1) | TW308581B (OSRAM) |
Families Citing this family (64)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3304828B2 (ja) * | 1997-06-10 | 2002-07-22 | 株式会社村田製作所 | 電子部品の製造方法 |
| US6402004B1 (en) * | 1998-09-16 | 2002-06-11 | Hoya Corporation | Cutting method for plate glass mother material |
| JP2989602B1 (ja) * | 1999-01-28 | 1999-12-13 | 三星ダイヤモンド工業株式会社 | ガラスカッタホィ―ル |
| JP4132569B2 (ja) * | 2000-05-01 | 2008-08-13 | 富士フイルム株式会社 | スリッタ刃 |
| JP3370314B2 (ja) | 2000-08-04 | 2003-01-27 | 三星ダイヤモンド工業株式会社 | 脆性基板用カッターホイール |
| EP1179512B1 (en) * | 2000-08-11 | 2011-12-28 | Mitsuboshi Diamond Industrial Co., Ltd. | Cutter wheel, apparatus and method for scribing brittle materials |
| TWI261049B (en) * | 2001-03-16 | 2006-09-01 | Mitsuboshi Diamond Ind Co Ltd | A scribing method, a cutter wheel, a scribing apparatus using the cutter wheel, and an apparatus for producing the cutter |
| TW528736B (en) * | 2001-04-02 | 2003-04-21 | Mitsuboshi Diamond Ind Co Ltd | Cutter wheel, device and method using the cutter wheel, method of dividing laminated substrate, and method and device for manufacturing cutter wheel |
| USD478104S1 (en) | 2001-11-30 | 2003-08-05 | Chang Bong Jung | Cutting wheel |
| USD465502S1 (en) | 2001-11-30 | 2002-11-12 | Chang Bong Jung | Cutting wheel |
| USD465503S1 (en) | 2001-11-30 | 2002-11-12 | Chang Bong Jung | Cutting wheel |
| USD465231S1 (en) | 2001-11-30 | 2002-11-05 | Chang Bong Jung | Cutting wheel |
| US7051911B2 (en) * | 2001-12-21 | 2006-05-30 | Eastman Kodak Company | Apparatus and method for cutting sheet materials |
| KR100665296B1 (ko) * | 2002-01-16 | 2007-01-04 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 취성재료 기판의 스크라이버, 취성재료 기판의 가공기,취성재료 기판 연마장치 및 취성재료 기판의절단시스템 |
| AU2003221112A1 (en) * | 2002-04-01 | 2003-10-13 | Mitsuboshi Diamond Industrial Co., Ltd. | Parting method for fragile material substrate and parting device using the method |
| US20040123717A1 (en) * | 2002-04-02 | 2004-07-01 | Kazuya Maekawa | Cutter wheel, device and method using the cutter wheel, method of dividing laminated substrate, and method and device for manufacturing cutter wheel |
| US20040161279A1 (en) * | 2002-09-16 | 2004-08-19 | Tzu-Feng Tseng | Apparatus for forming a folding-line |
| TWI286232B (en) * | 2002-10-29 | 2007-09-01 | Mitsuboshi Diamond Ind Co Ltd | Method and device for scribing fragile material substrate |
| CN101596721B (zh) * | 2002-11-22 | 2012-10-10 | 三星钻石工业股份有限公司 | 基板分断系统 |
| CN101585657B (zh) * | 2003-01-29 | 2012-03-21 | 三星宝石工业株式会社 | 基板切割设备和基板切割方法 |
| KR100923680B1 (ko) | 2003-04-29 | 2009-10-28 | 엘지디스플레이 주식회사 | 액정 표시패널의 절단장치 |
| JP2005001941A (ja) * | 2003-06-12 | 2005-01-06 | Thk Co Ltd | ダイヤモンドホイール及びスクライブ装置 |
| KR101185753B1 (ko) * | 2004-02-02 | 2012-09-26 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 취성재료 기판의 스크라이브 방법 및 절단방법 |
| WO2005087458A1 (ja) * | 2004-03-15 | 2005-09-22 | Mitsuboshi Diamond Industrial Co., Ltd. | 基板分断システム、基板製造装置、基板スクライブ方法および基板分断方法 |
| WO2006009113A1 (ja) * | 2004-07-16 | 2006-01-26 | Mitsuboshi Diamond Industrial Co., Ltd. | カッターホイールとその製造方法、手動スクライブ工具およびスクライブ装置 |
| TWI380868B (zh) * | 2005-02-02 | 2013-01-01 | Mitsuboshi Diamond Ind Co Ltdl | Fine processing method of sintered diamond using laser, cutter wheel for brittle material substrate, and method of manufacturing the same |
| CN102285009B (zh) * | 2005-07-06 | 2016-08-17 | 三星钻石工业股份有限公司 | 脆性材料用划线轮及脆性材料的划线方法及装置、工具 |
| US20070056171A1 (en) * | 2005-09-12 | 2007-03-15 | Jonathan Taryoto | CVD diamond cutter wheel |
| JP4219945B2 (ja) * | 2006-08-10 | 2009-02-04 | トーヨー産業株式会社 | ガラス切断用カッターホイル |
| WO2008087612A1 (en) * | 2007-01-19 | 2008-07-24 | Dutch Diamond Technologies B.V. | Cutting disk for forming a scribed line |
| US7837138B2 (en) * | 2007-05-03 | 2010-11-23 | Riley Power, Inc. | Swing hammer for particulate size reduction system |
| DE202007013307U1 (de) | 2007-09-22 | 2008-04-24 | Bohle Ag | Schneidrädchen |
| DE102007045383A1 (de) | 2007-09-22 | 2008-07-17 | Bohle Ag | Verfahren zur Herstellung von Schneidrädchen |
| DE202007013306U1 (de) * | 2007-09-22 | 2008-04-24 | Bohle Ag | Schneidrädchen |
| JP5237370B2 (ja) * | 2008-06-05 | 2013-07-17 | 三星ダイヤモンド工業株式会社 | スクライビングホイール及び脆性材料基板のスクライブ方法 |
| DE102008042855B4 (de) | 2008-10-15 | 2011-08-25 | MDI Schott Advanced Processing GmbH, 55120 | Verfahren zum Brechen von geschlossenen Freiformkonturen aus sprödbrüchigem Material |
| WO2010112496A1 (de) | 2009-03-30 | 2010-10-07 | Bohle Ag | Beschichtetes schneidrad und verfahren zu dessen herstellung |
| DE102009017316B4 (de) | 2009-04-16 | 2012-08-02 | Bohle Ag | Strukturiertes Schneidrad, Verfahren zu dessen Herstellung und Schneidvorrichtung |
| KR101174876B1 (ko) * | 2010-01-19 | 2012-08-17 | 삼성디스플레이 주식회사 | 유리기판용 절단 휠 |
| TWD143880S1 (zh) * | 2010-04-28 | 2011-11-21 | 三星鑽石工業股份有限公司 | 圖案化工具 |
| JP4923132B2 (ja) * | 2010-05-17 | 2012-04-25 | 三星ダイヤモンド工業株式会社 | ホイールホルダおよびその製造方法およびホイールホルダを用いたカッターホイール保持機構 |
| DE102010017625A1 (de) | 2010-06-28 | 2011-12-29 | Bohle Ag | Schneidwerkzeug, insbesondere Schneidrädchen und Verfahren zu dessen Herstellung |
| JP2012027272A (ja) * | 2010-07-23 | 2012-02-09 | Asahi Glass Co Ltd | 表示パネルの製造方法、および表示パネル |
| JP5174112B2 (ja) * | 2010-09-28 | 2013-04-03 | 三星ダイヤモンド工業株式会社 | スクライビングホイール |
| JP5365602B2 (ja) * | 2010-10-08 | 2013-12-11 | 三星ダイヤモンド工業株式会社 | スクライビングホイール及びその製造方法 |
| USD638451S1 (en) * | 2010-11-22 | 2011-05-24 | Klein Tools, Inc. | Scoring wheel |
| TWI462885B (zh) * | 2010-12-13 | 2014-12-01 | Mitsuboshi Diamond Ind Co Ltd | Method of breaking the substrate |
| JP5966564B2 (ja) * | 2011-06-08 | 2016-08-10 | 三星ダイヤモンド工業株式会社 | スクライビングホイール及びスクライブ方法 |
| JP5479424B2 (ja) * | 2011-09-30 | 2014-04-23 | 三星ダイヤモンド工業株式会社 | 脆性材料用スクライビングホイール、これを用いた脆性材料基板のスクライブ装置及びスクライブ工具 |
| CN106113293B (zh) * | 2012-03-08 | 2018-08-03 | 三星钻石工业股份有限公司 | 划线轮及其制造方法 |
| TWI511939B (zh) * | 2012-03-28 | 2015-12-11 | Mitsuboshi Diamond Ind Co Ltd | A scribing line, a scribing device, a scribing method, a manufacturing method for a display panel, and a display panel |
| CN102749748B (zh) * | 2012-07-11 | 2015-02-11 | 深圳市华星光电技术有限公司 | 液晶基板切割装置及其刀头监控方法 |
| JP6085895B2 (ja) * | 2012-07-27 | 2017-03-01 | イファ ダイヤモンド インダストリアル カンパニー,リミテッド | 微細構造の溝を持つスクライビングホイール |
| ES2478115B1 (es) * | 2012-12-18 | 2015-04-28 | Bellota Herramientas, S.A. | Cuchilla para herramienta de corte de una máquina cortadora de cerámica |
| JP6056575B2 (ja) * | 2013-03-18 | 2017-01-11 | 三星ダイヤモンド工業株式会社 | スクライブ方法及びスクライブ装置 |
| EP2871034A1 (en) * | 2013-11-12 | 2015-05-13 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Cutting tool and cutting method for laminates. |
| JP6488644B2 (ja) * | 2014-10-30 | 2019-03-27 | 三星ダイヤモンド工業株式会社 | 厚板ガラスのスクライブ方法、および、厚板ガラススクライブ用のスクライビングホイール |
| CN106542727B (zh) * | 2016-10-10 | 2019-03-05 | 华南理工大学 | 一种微磨削尖端精准诱导的曲面镜面脆裂成型方法 |
| JP6897950B2 (ja) * | 2016-12-28 | 2021-07-07 | 三星ダイヤモンド工業株式会社 | カッターホイール |
| JP6880447B2 (ja) * | 2017-03-28 | 2021-06-02 | トヨタ自動車株式会社 | 切断装置および回転刃 |
| US20190337175A1 (en) * | 2018-05-01 | 2019-11-07 | Pei-Keng Liu | Cutting device |
| US11565371B2 (en) * | 2018-12-31 | 2023-01-31 | Micron Technology, Inc. | Systems and methods for forming semiconductor cutting/trimming blades |
| CN112405878B (zh) * | 2020-09-30 | 2022-09-09 | 青岛铭青机电有限公司 | 一种陶瓷片产品自动掰板装置 |
| CN117220194B (zh) * | 2023-09-21 | 2025-03-14 | 山东送变电工程有限公司 | 一种输电线路施工作业免登塔划印装置 |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US537803A (en) * | 1895-04-16 | Stencil-making pen | ||
| US648791A (en) * | 1899-01-23 | 1900-05-01 | Henri Raynal | Apparatus for cutting pattern stencil-plates. |
| US1073592A (en) * | 1912-10-05 | 1913-09-23 | Pietro Torello | Marking device. |
| US1574819A (en) * | 1925-04-07 | 1926-03-02 | Carl Klaiber | Skinning tool. |
| DE1262814B (de) * | 1962-02-09 | 1968-03-07 | Schmid & Wezel | Trennscheiben fuer Enthaeutungsgeraete |
| US3353526A (en) * | 1963-10-18 | 1967-11-21 | Boart & Hard Metal Products S | Abrasive cutting tools such as saws |
| US3358370A (en) * | 1966-08-01 | 1967-12-19 | Richard W Logan | Composite blade structure |
| BE797819A (fr) * | 1972-04-10 | 1973-10-05 | Ppg Industries Inc | Procede et appareil de decoupe de verre en utilisant des fissures creees en dessous de la surface et articles obtenus |
| US3865293A (en) * | 1972-04-10 | 1975-02-11 | Ppg Industries Inc | Subsurface cracks |
| US3800991A (en) * | 1972-04-10 | 1974-04-02 | Ppg Industries Inc | Method of and an apparatus for cutting glass |
| US3756482A (en) * | 1972-04-28 | 1973-09-04 | Ppg Industries Inc | Method of removing trim from patterns |
| SU518286A1 (ru) * | 1975-03-21 | 1976-06-25 | Днепропетровский Металлургический Институт | Устройство дл ломки проката на заготовки |
| JPS54180463U (OSRAM) | 1978-06-10 | 1979-12-20 | ||
| US4423836A (en) * | 1981-10-02 | 1984-01-03 | Ppg Industries, Inc. | Apparatus for imposing a damage free score in a refractory piece |
| US4630509A (en) | 1983-03-26 | 1986-12-23 | Mclean Joseph G | Articulated assembly of members |
| JPS6223780A (ja) * | 1985-07-24 | 1987-01-31 | Canon Inc | 感熱転写材 |
| JPH0443433Y2 (OSRAM) | 1985-07-30 | 1992-10-14 | ||
| US4738028A (en) * | 1986-11-17 | 1988-04-19 | Belokin Martin P | Pizza cutter |
| US4891885A (en) * | 1987-10-19 | 1990-01-09 | Urschel Laboratories Incorporated | Method of making a knife having a scalloped cutting edge |
| JPH04224128A (ja) * | 1990-12-20 | 1992-08-13 | Idemitsu Petrochem Co Ltd | ガラス切断用刃 |
| DE4115107A1 (de) | 1991-05-08 | 1992-11-12 | Vollmer Werke Maschf | Verfahren und maschine zum elektroerosiven bearbeiten von schneidplatten |
| JPH05254865A (ja) * | 1992-03-11 | 1993-10-05 | Ookubo Seisakusho:Kk | ガラス切断用ホイールカッターおよびその研磨方法 |
| US5144749A (en) * | 1992-03-30 | 1992-09-08 | Chen Chien Tang | Utility knife |
| JPH0656451A (ja) * | 1992-08-05 | 1994-03-01 | Mitsuboshi Daiyamondo Kogyo Kk | ガラスカッター |
| DE59302911D1 (de) * | 1992-12-15 | 1996-07-18 | Peter Lisec | Vorrichtung zum Schneiden einer Glastafel |
-
1996
- 1996-03-06 TW TW085102753A patent/TW308581B/zh not_active IP Right Cessation
- 1996-03-07 DE DE69635721T patent/DE69635721T2/de not_active Expired - Lifetime
- 1996-03-07 EP EP00128223A patent/EP1092686B1/en not_active Expired - Lifetime
- 1996-03-07 EP EP06000330A patent/EP1666426B1/en not_active Expired - Lifetime
- 1996-03-07 EP EP09012165A patent/EP2133316A3/en not_active Withdrawn
- 1996-03-07 DE DE69638332T patent/DE69638332D1/de not_active Expired - Lifetime
- 1996-03-07 EP EP09012164A patent/EP2135848B1/en not_active Expired - Lifetime
- 1996-03-07 DE DE69613655T patent/DE69613655T2/de not_active Expired - Lifetime
- 1996-03-07 EP EP96103577A patent/EP0773194B1/en not_active Expired - Lifetime
- 1996-03-13 KR KR1019960006634A patent/KR100279184B1/ko not_active Ceased
- 1996-03-27 CN CN96101939A patent/CN1125787C/zh not_active Ceased
-
1997
- 1997-06-18 US US08/877,808 patent/US5836229A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP1092686A2 (en) | 2001-04-18 |
| EP1092686B1 (en) | 2006-01-11 |
| EP2135848A3 (en) | 2010-02-17 |
| EP2133316A2 (en) | 2009-12-16 |
| EP2135848A2 (en) | 2009-12-23 |
| DE69613655D1 (de) | 2001-08-09 |
| EP0773194A1 (en) | 1997-05-14 |
| EP2133316A3 (en) | 2010-02-10 |
| DE69613655T2 (de) | 2002-05-29 |
| EP1092686A3 (en) | 2001-05-16 |
| EP0773194B1 (en) | 2001-07-04 |
| EP2135848B1 (en) | 2012-05-16 |
| DE69635721D1 (de) | 2006-04-06 |
| US5836229A (en) | 1998-11-17 |
| CN1125787C (zh) | 2003-10-29 |
| EP1666426A1 (en) | 2006-06-07 |
| KR100279184B1 (ko) | 2001-01-15 |
| HK1038552A1 (en) | 2002-03-22 |
| HK1139920A1 (en) | 2010-09-30 |
| DE69638332D1 (de) | 2011-03-24 |
| EP1666426B1 (en) | 2011-02-09 |
| CN1150129A (zh) | 1997-05-21 |
| KR970025885A (ko) | 1997-06-24 |
| TW308581B (OSRAM) | 1997-06-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition |