DE69630554D1 - Mikrobearbeitungsgerät und -verfahren - Google Patents

Mikrobearbeitungsgerät und -verfahren

Info

Publication number
DE69630554D1
DE69630554D1 DE69630554T DE69630554T DE69630554D1 DE 69630554 D1 DE69630554 D1 DE 69630554D1 DE 69630554 T DE69630554 T DE 69630554T DE 69630554 T DE69630554 T DE 69630554T DE 69630554 D1 DE69630554 D1 DE 69630554D1
Authority
DE
Germany
Prior art keywords
micromachining device
micromachining
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69630554T
Other languages
English (en)
Other versions
DE69630554T2 (de
Inventor
Masahiro Hatakeyama
Katsunori Ichiki
Takao Kato
Masaaki Kajiyama
Takashi Tsuzuki
Yotaro Hatamura
Masayuki Nakao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP09793395A external-priority patent/JP3346672B2/ja
Priority claimed from JP7097932A external-priority patent/JPH08267257A/ja
Priority claimed from JP04663296A external-priority patent/JP3343188B2/ja
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of DE69630554D1 publication Critical patent/DE69630554D1/de
Application granted granted Critical
Publication of DE69630554T2 publication Critical patent/DE69630554T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/3002—Details
    • H01J37/3005—Observing the objects or the point of impact on the object
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the objects or the material; Means for adjusting diaphragms or lenses associated with the support

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Welding Or Cutting Using Electron Beams (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
DE69630554T 1995-03-30 1996-03-29 Mikrobearbeitungsgerät und -verfahren Expired - Fee Related DE69630554T2 (de)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP09793395A JP3346672B2 (ja) 1995-03-30 1995-03-30 エネルギービームによる加工装置
JP9793295 1995-03-30
JP9793495 1995-03-30
JP9793395 1995-03-30
JP7097932A JPH08267257A (ja) 1995-03-30 1995-03-30 微細被加工物の作業装置及び作業方法
JP9793495 1995-03-30
JP04663296A JP3343188B2 (ja) 1995-03-30 1996-02-08 微小部品用パレット及びそれを用いた作業装置
JP4663296 1996-02-08

Publications (2)

Publication Number Publication Date
DE69630554D1 true DE69630554D1 (de) 2003-12-11
DE69630554T2 DE69630554T2 (de) 2004-09-23

Family

ID=27461904

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69630554T Expired - Fee Related DE69630554T2 (de) 1995-03-30 1996-03-29 Mikrobearbeitungsgerät und -verfahren

Country Status (3)

Country Link
US (1) US5852298A (de)
EP (1) EP0735564B1 (de)
DE (1) DE69630554T2 (de)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0731490A3 (de) * 1995-03-02 1998-03-11 Ebara Corporation Ultrafeines Mikroherstellungsverfahren unter Verwendung eines Energiebündel
US5905266A (en) * 1996-12-19 1999-05-18 Schlumberger Technologies, Inc. Charged particle beam system with optical microscope
US6828566B2 (en) * 1997-07-22 2004-12-07 Hitachi Ltd Method and apparatus for specimen fabrication
US6538254B1 (en) * 1997-07-22 2003-03-25 Hitachi, Ltd. Method and apparatus for sample fabrication
WO1999034418A1 (fr) * 1997-12-26 1999-07-08 Nikon Corporation Appareil d'exposition, procede pour produire cet appareil, et methode d'exposition, ainsi que dispositif et procede pour fabriquer ce dispositif
US6049650A (en) * 1998-04-17 2000-04-11 Seagate Technology, Inc. Structure for micro-machine optical tooling and method for making and using
US6473553B1 (en) 1998-04-17 2002-10-29 Seagate Technology Llc Apparatus for holding and engaging micro-machined objects and method for making same
JP2001015056A (ja) * 1999-04-28 2001-01-19 Canon Inc 試料ホルダーおよび該試料ホルダーに用いるスペーサー
JP2001088100A (ja) * 1999-09-24 2001-04-03 Japan Science & Technology Corp マイクロマニピュレーション方法
RU2164718C1 (ru) * 2000-07-04 2001-03-27 Общество с ограниченной ответственностью "Агентство маркетинга научных разработок" Установка для формирования наноструктур на поверхности полупроводниковых пластин ионными пучками
JP4178741B2 (ja) * 2000-11-02 2008-11-12 株式会社日立製作所 荷電粒子線装置および試料作製装置
EP1209737B2 (de) * 2000-11-06 2014-04-30 Hitachi, Ltd. Verfahren zur Herstellung von Proben
US20040257561A1 (en) * 2000-11-24 2004-12-23 Takao Nakagawa Apparatus and method for sampling
US6630668B1 (en) * 2001-10-04 2003-10-07 The United States Of America As Represented By The United States Department Of Energy Remote control of a scanning electron microscope aperture and gun alignment
DE10352842B4 (de) * 2003-11-10 2006-03-09 Jaroslav Jan Hatle Bewegungsantrieb für eine Ionenstrahlbearbeitungsanlage
DE102004010535B4 (de) * 2003-11-10 2006-04-27 Jaroslav Jan Hatle Bewegungsantrieb für eine Ionenstrahlbearbeitungsanlage
US7164128B2 (en) * 2003-11-25 2007-01-16 Hitachi High-Technologies Corporation Method and apparatus for observing a specimen
JP2005310757A (ja) * 2004-03-23 2005-11-04 Sii Nanotechnology Inc 微細３次元構造物作製装置及び方法
JP2006059701A (ja) * 2004-08-20 2006-03-02 Sii Nanotechnology Inc 荷電粒子ビーム装置およびそれを用いた狭ギャップ電極形成方法
DE102005039483A1 (de) * 2005-08-18 2007-02-22 Carl Zeiss Smt Ag Vorrichtung und Verfahren zur Bearbeitung eines optischen Elements mit einer Teilchenstrahlquelle
US8114685B2 (en) * 2005-09-05 2012-02-14 Pioneer Corporation Method of manufacturing material to be etched
US7301157B2 (en) * 2005-09-28 2007-11-27 Fei Company Cluster tool for microscopic processing of samples
EP1780764A1 (de) * 2005-11-01 2007-05-02 FEI Company Bühnenanordnung, teilchenoptische Vorrichtung mit einer derartigen Anordnung und Verfahren zur Behandlung einer Probe in einer derartigen Vorrichtung
JP4685627B2 (ja) * 2005-12-28 2011-05-18 株式会社日立ハイテクノロジーズ 試料加工方法
JP4789260B2 (ja) * 2006-08-23 2011-10-12 エスアイアイ・ナノテクノロジー株式会社 荷電粒子ビーム装置及びアパーチャの軸調整方法
US7834315B2 (en) * 2007-04-23 2010-11-16 Omniprobe, Inc. Method for STEM sample inspection in a charged particle beam instrument
DE102007048559B4 (de) * 2007-10-09 2009-10-01 Ntg Neue Technologien Gmbh & Co Kg Vorrichtung zur Strahlbearbeitung von Werkstücken, Ionenstrahlbearbeitungsanlage
USRE43925E1 (en) * 2008-11-21 2013-01-15 Industrial Technology Research Institute Three dimensional profile inspecting apparatus
TWI387721B (zh) * 2008-11-21 2013-03-01 Ind Tech Res Inst 三維形貌檢測裝置
TWI392864B (zh) * 2009-04-03 2013-04-11 Ind Tech Res Inst 光學檢測裝置
CN102473576B (zh) * 2009-07-30 2015-06-24 株式会社日立高新技术 离子铣削装置
SG177823A1 (en) * 2010-07-06 2012-02-28 Camtek Ltd Method and system for preparing a lamella
SG177822A1 (en) * 2010-07-06 2012-02-28 Camtek Ltd Method and system for preparing a sample
WO2014133530A1 (en) * 2013-02-28 2014-09-04 Freitas Robert A Jr Mechanosynthesis trajectories
CN103341750B (zh) * 2013-07-12 2015-11-18 中国科学院自动化研究所 一种用于柔性微零件的装配系统与方法
JP6649891B2 (ja) * 2014-02-26 2020-02-19 ブリガム・アンド・ウイミンズ・ホスピタル・インコーポレイテッド 細胞浮揚およびモニタリングのための系および方法
DE102014009269B4 (de) * 2014-06-25 2017-06-08 Thyssenkrupp Ag Vorrichtung zur räumlichen Ausrichtung eines berührungslosen Messkopfes
CN105225910B (zh) * 2015-09-25 2017-11-28 苏州大学 基于扫描电子显微镜的微操作系统
US10242842B2 (en) * 2016-03-25 2019-03-26 Hitachi High-Tech Science Corporation Method for cross-section processing and observation and apparatus therefor
WO2018089578A1 (en) * 2016-11-10 2018-05-17 President And Fellows Of Harvard College Gridtape imaging stage
CN107363492B (zh) * 2017-06-26 2019-07-05 江苏密斯欧智能科技有限公司 一种自动装配线上提高装配精度的方法
EP3432338B1 (de) * 2017-07-20 2019-10-23 FEI Company Probenherstellung und untersuchung in einem doppelstrahlladungsträgerteilchenmikroskop
CZ309656B6 (cs) * 2018-10-10 2023-06-21 Tescan Brno, S.R.O. Zařízení s alespoň jedním polohovatelným držákem vzorků a způsob změny úhlu náklonu držáku a způsob přípravy lamely
CN113547468B (zh) * 2021-07-29 2023-01-06 中国科学院长春光学精密机械与物理研究所 预倾斜样品夹具及样品加工方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5818850A (ja) * 1981-07-24 1983-02-03 Hitachi Ltd 試料移動装置
US4843563A (en) * 1985-03-25 1989-06-27 Canon Kabushiki Kaisha Step-and-repeat alignment and exposure method and apparatus
US4639301B2 (en) * 1985-04-24 1999-05-04 Micrion Corp Focused ion beam processing
JPS61287229A (ja) * 1985-06-14 1986-12-17 Nippon Kogaku Kk <Nikon> 露光装置、及び該露光装置を用いた回路パターン製造方法
US4663511A (en) * 1986-05-02 1987-05-05 The United States Of America As Represented By The United States Department Of Energy Stereoscopic optical viewing system
JP2653056B2 (ja) * 1987-07-28 1997-09-10 日新電機株式会社 表面解析装置
DE3802598C1 (de) * 1988-01-29 1989-04-13 Karl Heinz 3057 Neustadt De Stellmann
JP2523177B2 (ja) * 1989-04-28 1996-08-07 日本写真印刷株式会社 位置決めテ―ブル
JP2909828B2 (ja) * 1989-07-05 1999-06-23 セイコーインスツルメンツ株式会社 複合走査型トンネル顕微鏡
US5229607A (en) * 1990-04-19 1993-07-20 Hitachi, Ltd. Combination apparatus having a scanning electron microscope therein
JP2965739B2 (ja) * 1991-03-28 1999-10-18 大日本印刷株式会社 集束イオンビーム装置
JP2774884B2 (ja) * 1991-08-22 1998-07-09 株式会社日立製作所 試料の分離方法及びこの分離方法で得た分離試料の分析方法
JPH07122468A (ja) * 1993-10-28 1995-05-12 Mitsubishi Electric Corp 電子ビーム描画装置およびその装置を用いた描画方法

Also Published As

Publication number Publication date
US5852298A (en) 1998-12-22
EP0735564A2 (de) 1996-10-02
EP0735564B1 (de) 2003-11-05
DE69630554T2 (de) 2004-09-23
EP0735564A3 (de) 1998-01-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee