DE69621107T2 - Verbesserungen in oder in Bezug auf Halbleiterchiptrennung - Google Patents
Verbesserungen in oder in Bezug auf HalbleiterchiptrennungInfo
- Publication number
- DE69621107T2 DE69621107T2 DE69621107T DE69621107T DE69621107T2 DE 69621107 T2 DE69621107 T2 DE 69621107T2 DE 69621107 T DE69621107 T DE 69621107T DE 69621107 T DE69621107 T DE 69621107T DE 69621107 T2 DE69621107 T2 DE 69621107T2
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor chip
- chip separation
- separation
- semiconductor
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US740295P | 1995-11-21 | 1995-11-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69621107D1 DE69621107D1 (de) | 2002-06-13 |
DE69621107T2 true DE69621107T2 (de) | 2002-10-31 |
Family
ID=21725937
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69621107T Expired - Lifetime DE69621107T2 (de) | 1995-11-21 | 1996-11-20 | Verbesserungen in oder in Bezug auf Halbleiterchiptrennung |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP0776029B1 (de) |
JP (1) | JPH09171979A (de) |
KR (1) | KR970030651A (de) |
CN (1) | CN1159075A (de) |
DE (1) | DE69621107T2 (de) |
SG (1) | SG67365A1 (de) |
TW (1) | TW347555B (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001110755A (ja) * | 1999-10-04 | 2001-04-20 | Tokyo Seimitsu Co Ltd | 半導体チップ製造方法 |
JP3368876B2 (ja) * | 1999-11-05 | 2003-01-20 | 株式会社東京精密 | 半導体チップ製造方法 |
TWI228780B (en) * | 2000-05-11 | 2005-03-01 | Disco Corp | Semiconductor wafer dividing method |
JP2001345289A (ja) * | 2000-05-31 | 2001-12-14 | Nec Corp | 半導体装置の製造方法 |
KR100856977B1 (ko) | 2004-11-11 | 2008-09-04 | 야마하 가부시키가이샤 | 반도체 장치, 반도체 웨이퍼, 칩 사이즈 패키지, 및 그제조 및 검사 방법 |
JP2006140276A (ja) * | 2004-11-11 | 2006-06-01 | Yamaha Corp | 半導体ウェーハとそれを用いた半導体素子及びチップサイズ・パッケージ並びに半導体ウェーハの製造方法、半導体ウェーハの検査方法 |
US8292690B2 (en) * | 2008-09-08 | 2012-10-23 | Semiconductor Components Industries, Llc | Thinned semiconductor wafer and method of thinning a semiconductor wafer |
CN101745993B (zh) * | 2008-12-10 | 2012-04-18 | 上海华虹Nec电子有限公司 | 形成风车形划片槽结构的方法 |
JP5637331B1 (ja) * | 2013-07-01 | 2014-12-10 | 富士ゼロックス株式会社 | 半導体片の製造方法、半導体片を含む回路基板および画像形成装置 |
JP6189208B2 (ja) * | 2013-12-26 | 2017-08-30 | 株式会社ディスコ | ウエーハの加工方法 |
JP2016031986A (ja) * | 2014-07-28 | 2016-03-07 | 株式会社ディスコ | ウェーハの加工方法 |
CN104860260A (zh) * | 2015-04-16 | 2015-08-26 | 中国电子科技集团公司第十三研究所 | Mems圆片级封装的划片方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4604161A (en) * | 1985-05-02 | 1986-08-05 | Xerox Corporation | Method of fabricating image sensor arrays |
US4814296A (en) * | 1987-08-28 | 1989-03-21 | Xerox Corporation | Method of fabricating image sensor dies for use in assembling arrays |
JPH04107155A (ja) * | 1990-08-28 | 1992-04-08 | Alps Electric Co Ltd | サーマルヘッドの製造方法 |
US5272114A (en) * | 1990-12-10 | 1993-12-21 | Amoco Corporation | Method for cleaving a semiconductor crystal body |
US5418190A (en) * | 1993-12-30 | 1995-05-23 | At&T Corp. | Method of fabrication for electro-optical devices |
-
1996
- 1996-11-16 SG SG1996011329A patent/SG67365A1/en unknown
- 1996-11-20 KR KR1019960055747A patent/KR970030651A/ko not_active Application Discontinuation
- 1996-11-20 DE DE69621107T patent/DE69621107T2/de not_active Expired - Lifetime
- 1996-11-20 EP EP96118646A patent/EP0776029B1/de not_active Expired - Lifetime
- 1996-11-21 JP JP8310989A patent/JPH09171979A/ja active Pending
- 1996-11-21 CN CN96121764A patent/CN1159075A/zh active Pending
-
1997
- 1997-03-03 TW TW086102464A patent/TW347555B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE69621107D1 (de) | 2002-06-13 |
JPH09171979A (ja) | 1997-06-30 |
EP0776029B1 (de) | 2002-05-08 |
TW347555B (en) | 1998-12-11 |
KR970030651A (ko) | 1997-06-26 |
CN1159075A (zh) | 1997-09-10 |
SG67365A1 (en) | 1999-09-21 |
EP0776029A1 (de) | 1997-05-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |