DE69635236D1 - Verbesserungen an Halbleiteranordnungen - Google Patents
Verbesserungen an HalbleiteranordnungenInfo
- Publication number
- DE69635236D1 DE69635236D1 DE69635236T DE69635236T DE69635236D1 DE 69635236 D1 DE69635236 D1 DE 69635236D1 DE 69635236 T DE69635236 T DE 69635236T DE 69635236 T DE69635236 T DE 69635236T DE 69635236 D1 DE69635236 D1 DE 69635236D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor devices
- semiconductor
- devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
- H01L21/02134—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC the material comprising hydrogen silsesquioxane, e.g. HSQ
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
- H01L21/02337—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a gas or vapour
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/312—Organic layers, e.g. photoresist
- H01L21/3121—Layers comprising organo-silicon compounds
- H01L21/3122—Layers comprising organo-silicon compounds layers comprising polysiloxane compounds
- H01L21/3124—Layers comprising organo-silicon compounds layers comprising polysiloxane compounds layers comprising hydrogen silsesquioxane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02203—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being porous
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
- H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
- H01L21/02214—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen
- H01L21/02216—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Formation Of Insulating Films (AREA)
- Paints Or Removers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US390181 | 1995-02-17 | ||
US08/390,181 US5656555A (en) | 1995-02-17 | 1995-02-17 | Modified hydrogen silsesquioxane spin-on glass |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69635236D1 true DE69635236D1 (de) | 2006-02-16 |
DE69635236T2 DE69635236T2 (de) | 2006-07-13 |
Family
ID=23541429
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69635236T Expired - Lifetime DE69635236T2 (de) | 1995-02-17 | 1996-02-16 | Verbesserungen an Halbleiteranordnungen |
Country Status (4)
Country | Link |
---|---|
US (2) | US5656555A (de) |
EP (1) | EP0727817B1 (de) |
JP (1) | JPH08250490A (de) |
DE (1) | DE69635236T2 (de) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09143420A (ja) * | 1995-09-21 | 1997-06-03 | Asahi Glass Co Ltd | 低誘電率樹脂組成物 |
EP0810648A3 (de) * | 1996-05-31 | 1997-12-29 | Texas Instruments Incorporated | Verbesserungen in oder in Bezug auf Halbleiteranordnungen |
US5981354A (en) * | 1997-03-12 | 1999-11-09 | Advanced Micro Devices, Inc. | Semiconductor fabrication employing a flowable oxide to enhance planarization in a shallow trench isolation process |
US6015457A (en) * | 1997-04-21 | 2000-01-18 | Alliedsignal Inc. | Stable inorganic polymers |
US6492282B1 (en) * | 1997-04-30 | 2002-12-10 | Siemens Aktiengesellschaft | Integrated circuits and manufacturing methods |
JPH1116904A (ja) * | 1997-06-26 | 1999-01-22 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
US5888911A (en) * | 1997-10-23 | 1999-03-30 | Advanced Micro Devices, Inc. | HSQ processing for reduced dielectric constant |
US6297125B1 (en) * | 1998-01-23 | 2001-10-02 | Texas Instruments Incorporated | Air-bridge integration scheme for reducing interconnect delay |
US6177199B1 (en) | 1999-01-07 | 2001-01-23 | Alliedsignal Inc. | Dielectric films from organohydridosiloxane resins with low organic content |
JP3175691B2 (ja) | 1998-05-08 | 2001-06-11 | 日本電気株式会社 | 多層配線半導体装置の製造方法 |
TW441006B (en) * | 1998-05-18 | 2001-06-16 | United Microelectronics Corp | Method of forming inter-metal dielectric layer |
US7923383B2 (en) * | 1998-05-21 | 2011-04-12 | Tokyo Electron Limited | Method and apparatus for treating a semi-conductor substrate |
US6420278B1 (en) * | 1998-06-12 | 2002-07-16 | Advanced Micro Devices, Inc. | Method for improving the dielectric constant of silicon-based semiconductor materials |
US6140221A (en) * | 1998-07-29 | 2000-10-31 | Philips Electronics North America Corp. | Method for forming vias through porous dielectric material and devices formed thereby |
US6407007B1 (en) * | 1998-11-17 | 2002-06-18 | Taiwan Semiconductor Manufacturing Company | Method to solve the delamination of a silicon nitride layer from an underlying spin on glass layer |
WO2000041231A1 (en) * | 1999-01-07 | 2000-07-13 | Alliedsignal, Inc. | Dielectric films from organohydridosiloxane resins |
US6436850B1 (en) | 1999-09-01 | 2002-08-20 | Guarionex Morales | Method of degassing low k dielectric for metal deposition |
US20050158666A1 (en) * | 1999-10-15 | 2005-07-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Lateral etch inhibited multiple etch method for etching material etchable with oxygen containing plasma |
DE60204502T2 (de) * | 2001-03-27 | 2006-05-18 | Samsung Electronics Co., Ltd., Suwon | Polysiloxanharz und Verfahren zur Herstellung einer Zwischenschicht daraus für Wafer |
US6667249B1 (en) | 2002-03-20 | 2003-12-23 | Taiwan Semiconductor Manufacturing Company | Minimizing coating defects in low dielectric constant films |
US6737117B2 (en) | 2002-04-05 | 2004-05-18 | Dow Corning Corporation | Hydrosilsesquioxane resin compositions having improved thin film properties |
EP1495066B1 (de) * | 2002-04-18 | 2008-07-16 | LG Chem, Ltd. | Organisches silicatpolymer und dieses umfassender isolierfilm |
US20040132280A1 (en) * | 2002-07-26 | 2004-07-08 | Dongbu Electronics Co. Ltd. | Method of forming metal wiring in a semiconductor device |
US7205248B2 (en) * | 2003-02-04 | 2007-04-17 | Micron Technology, Inc. | Method of eliminating residual carbon from flowable oxide fill |
KR20080017368A (ko) * | 2005-06-15 | 2008-02-26 | 다우 코닝 코포레이션 | 수소 실세스퀴옥산의 경화 방법 및 나노미터 크기의트렌치에서의 치밀화 방법 |
CA2628473C (en) * | 2005-11-30 | 2014-07-22 | Lg Chem, Ltd. | Microcellular foam of thermoplastic resin prepared with die having improved cooling property and method for preparing the same |
US8173077B2 (en) * | 2005-12-16 | 2012-05-08 | The Curators Of The University Of Missouri | Reusable PCR amplification system and method |
US7556972B2 (en) * | 2007-01-25 | 2009-07-07 | International Business Machines Corporation | Detection and characterization of SiCOH-based dielectric materials during device fabrication |
CN106794450B (zh) | 2014-08-29 | 2020-12-25 | 日东电工株式会社 | 光催化涂层及其制备方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0751634B2 (ja) * | 1986-10-20 | 1995-06-05 | 東芝シリコ−ン株式会社 | 表面処理された真球状ポリメチルシルセスキオキサン粉末 |
US4756977A (en) * | 1986-12-03 | 1988-07-12 | Dow Corning Corporation | Multilayer ceramics from hydrogen silsesquioxane |
US4847162A (en) * | 1987-12-28 | 1989-07-11 | Dow Corning Corporation | Multilayer ceramics coatings from the ceramification of hydrogen silsequioxane resin in the presence of ammonia |
CA2027031A1 (en) * | 1989-10-18 | 1991-04-19 | Loren A. Haluska | Hermetic substrate coatings in an inert gas atmosphere |
US4973526A (en) * | 1990-02-15 | 1990-11-27 | Dow Corning Corporation | Method of forming ceramic coatings and resulting articles |
JP2928341B2 (ja) * | 1990-07-03 | 1999-08-03 | 三菱電機株式会社 | シリコーンラダー系樹脂塗布液組成物 |
US5152834A (en) * | 1990-09-14 | 1992-10-06 | Ncr Corporation | Spin-on glass composition |
US5091162A (en) * | 1990-10-01 | 1992-02-25 | Dow Corning Corporation | Perhydrosiloxane copolymers and their use as coating materials |
US5380555A (en) * | 1993-02-09 | 1995-01-10 | Dow Corning Toray Silicone Co., Ltd. | Methods for the formation of a silicon oxide film |
US5387480A (en) * | 1993-03-08 | 1995-02-07 | Dow Corning Corporation | High dielectric constant coatings |
US5320868A (en) * | 1993-09-13 | 1994-06-14 | Dow Corning Corporation | Method of forming SI-O containing coatings |
US5441765A (en) * | 1993-09-22 | 1995-08-15 | Dow Corning Corporation | Method of forming Si-O containing coatings |
JP2751820B2 (ja) * | 1994-02-28 | 1998-05-18 | 日本電気株式会社 | 半導体装置の製造方法 |
US5516867A (en) * | 1995-05-12 | 1996-05-14 | Dow Corning Corporation | Modified hydrogen silsesquioxane resin |
-
1995
- 1995-02-17 US US08/390,181 patent/US5656555A/en not_active Expired - Lifetime
- 1995-06-07 US US08/476,294 patent/US5665849A/en not_active Expired - Lifetime
-
1996
- 1996-02-16 DE DE69635236T patent/DE69635236T2/de not_active Expired - Lifetime
- 1996-02-16 JP JP8029627A patent/JPH08250490A/ja active Pending
- 1996-02-16 EP EP96102370A patent/EP0727817B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0727817A2 (de) | 1996-08-21 |
US5656555A (en) | 1997-08-12 |
EP0727817B1 (de) | 2005-10-05 |
DE69635236T2 (de) | 2006-07-13 |
JPH08250490A (ja) | 1996-09-27 |
EP0727817A3 (de) | 1998-05-13 |
US5665849A (en) | 1997-09-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |