DE69617210D1 - Verfahren und vorrichtung zum transportieren von leiterrahmen und in-line system dafür - Google Patents
Verfahren und vorrichtung zum transportieren von leiterrahmen und in-line system dafürInfo
- Publication number
- DE69617210D1 DE69617210D1 DE69617210T DE69617210T DE69617210D1 DE 69617210 D1 DE69617210 D1 DE 69617210D1 DE 69617210 T DE69617210 T DE 69617210T DE 69617210 T DE69617210 T DE 69617210T DE 69617210 D1 DE69617210 D1 DE 69617210D1
- Authority
- DE
- Germany
- Prior art keywords
- line system
- ladder frame
- system therefor
- transporting ladder
- transporting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950004187A KR960032667A (ko) | 1995-02-28 | 1995-02-28 | 리드프레임의 이송방법 |
| PCT/KR1996/000028 WO1996026875A1 (en) | 1995-02-28 | 1996-02-24 | Method and apparatus for transporting lead frame, and in-line system using them |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69617210D1 true DE69617210D1 (de) | 2002-01-03 |
| DE69617210T2 DE69617210T2 (de) | 2002-07-18 |
Family
ID=19409070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69617210T Expired - Fee Related DE69617210T2 (de) | 1995-02-28 | 1996-02-24 | Verfahren und vorrichtung zum transportieren von leiterrahmen und in-line system dafür |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US5987722A (de) |
| EP (1) | EP0809596B1 (de) |
| JP (1) | JPH10506361A (de) |
| KR (2) | KR960032667A (de) |
| CN (1) | CN1058467C (de) |
| DE (1) | DE69617210T2 (de) |
| WO (1) | WO1996026875A1 (de) |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6652515B1 (en) * | 1997-07-08 | 2003-11-25 | Atrionix, Inc. | Tissue ablation device assembly and method for electrically isolating a pulmonary vein ostium from an atrial wall |
| JP3400338B2 (ja) * | 1998-02-12 | 2003-04-28 | 株式会社新川 | バンプボンディング装置 |
| US6574858B1 (en) * | 1998-02-13 | 2003-06-10 | Micron Technology, Inc. | Method of manufacturing a chip package |
| KR20010070780A (ko) * | 2001-06-07 | 2001-07-27 | 박용석 | 액정표시장치용 유리기판 반송장치 |
| US20030102016A1 (en) * | 2001-12-04 | 2003-06-05 | Gary Bouchard | Integrated circuit processing system |
| US6703693B2 (en) * | 2001-12-13 | 2004-03-09 | Lg Cable Ltd. | Apparatus for reversing lead frame |
| KR100469906B1 (ko) * | 2002-07-24 | 2005-02-02 | 주식회사 신성이엔지 | 기판 부상 및 이송 장치 |
| KR20040013241A (ko) * | 2002-08-05 | 2004-02-14 | 권석창 | 아이씨 자재 피딩장치 |
| KR100524974B1 (ko) * | 2003-07-01 | 2005-10-31 | 삼성전자주식회사 | 양면 스택 멀티 칩 패키징을 위한 인라인 집적회로 칩패키지 제조 장치 및 이를 이용한 집적회로 칩 패키지제조 방법 |
| CN1315153C (zh) * | 2003-12-16 | 2007-05-09 | 广东工业大学 | 粘片机引线框架供送空间凸轮机构组合装置 |
| WO2006134953A1 (en) * | 2005-06-13 | 2006-12-21 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device bonding apparatus and method for bonding semiconductor device using the same |
| JP4889275B2 (ja) * | 2005-10-11 | 2012-03-07 | 株式会社日本設計工業 | 薄板状材料搬送用エアテーブル及び薄板状材料搬送装置 |
| JP4876640B2 (ja) * | 2006-03-09 | 2012-02-15 | セイコーエプソン株式会社 | ワーク搬送装置およびワーク搬送方法 |
| KR20070094259A (ko) * | 2006-03-17 | 2007-09-20 | 삼성테크윈 주식회사 | 와이어 본딩 설비 및 이를 이용한 와이어 본딩 방법 |
| JP5239606B2 (ja) * | 2007-10-04 | 2013-07-17 | 株式会社Ｉｈｉ | 浮上搬送装置及び浮上ユニット |
| KR20090070406A (ko) * | 2007-12-27 | 2009-07-01 | 삼성전자주식회사 | 피씨비 스트립과 그의 어셈블리 장치와 방법 |
| US20090166820A1 (en) * | 2007-12-27 | 2009-07-02 | Hem Takiar | Tsop leadframe strip of multiply encapsulated packages |
| WO2010109740A1 (ja) * | 2009-03-27 | 2010-09-30 | 株式会社アドバンテスト | 試験装置、試験方法および製造方法 |
| KR101316049B1 (ko) * | 2009-03-27 | 2013-10-07 | 가부시키가이샤 어드밴티스트 | 제조 장치, 제조 방법 및 패키지 디바이스 |
| EP2242098A1 (de) * | 2009-04-16 | 2010-10-20 | Nxp B.V. | Einseitiger Schienenträger |
| CN102466648A (zh) * | 2010-11-16 | 2012-05-23 | 邱鸿智 | X-ray自动连续式检测设备 |
| CN107658248B (zh) * | 2011-06-03 | 2021-06-22 | 豪锐恩科技私人有限公司 | 用于将半导体芯片置于衬底上的系统 |
| CN102263050B (zh) * | 2011-08-01 | 2013-05-01 | 苏州固锝电子股份有限公司 | 一种用于移动石墨舟上半导体晶粒的装置 |
| CN103295942A (zh) * | 2012-02-28 | 2013-09-11 | 无锡华润安盛科技有限公司 | 引线框阵列的上料系统 |
| US9721818B2 (en) | 2012-11-29 | 2017-08-01 | Texas Instruments Incorporated | Pressurized gas stopper for leadframe transporting apparatus |
| CN104701199B (zh) * | 2015-03-20 | 2018-03-13 | 北京中电科电子装备有限公司 | 一种倒装芯片键合设备 |
| TWI699582B (zh) * | 2015-07-01 | 2020-07-21 | 日商信越工程股份有限公司 | 貼合器件的製造裝置及製造方法 |
| DE102018129805B3 (de) * | 2018-11-26 | 2020-02-20 | Asm Assembly Systems Gmbh & Co. Kg | Aufnahme eines zu bestückenden Trägers mit Träger-Aufnahmevorrichtung aufweisend einen Grundkörper und ein Adapterelement sowie System und Bestückmaschine diese aufweisend und Verfahren zum Bestücken eines Trägers |
| CN113291825A (zh) * | 2021-05-20 | 2021-08-24 | 哈尔滨工业大学 | 一种精密气浮平台 |
| CN114023674B (zh) * | 2021-11-11 | 2022-06-07 | 天水华洋电子科技股份有限公司 | 一种基于集成电路引线框架表面处理装置 |
| CN116631927B (zh) * | 2023-07-19 | 2024-02-02 | 广州丰江微电子有限公司 | 带清洁功能的引线框架输送系统 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DD151387A1 (de) * | 1980-06-02 | 1981-10-14 | Erich Adler | Verfahren und vorrichtung zum automatischen transport und zur lageorientierung scheibenfoermiger objekte |
| JPS58157141A (ja) * | 1982-03-13 | 1983-09-19 | Fuji Seiki Seizosho:Kk | リ−ドフレ−ムケ−ス連続送出し装置 |
| US4749329A (en) * | 1982-12-06 | 1988-06-07 | Motorola, Inc. | Die pick mechanism for automatic assembly of semiconductor devices |
| US4851902A (en) * | 1986-10-29 | 1989-07-25 | Electroplating Engineers Of Japan, Limited | Auatomatic inspection system for IC lead frames and visual inspection method thereof |
| FR2632618A1 (fr) * | 1988-06-08 | 1989-12-15 | Commissariat Energie Atomique | Dispositif de transport sur coussin d'air avec guidage magnetique |
| JP2811613B2 (ja) * | 1991-09-02 | 1998-10-15 | ティーディーケイ株式会社 | 電子部品の製造方法及び装置 |
-
1995
- 1995-02-28 KR KR1019950004187A patent/KR960032667A/ko active Search and Examination
-
1996
- 1996-02-24 WO PCT/KR1996/000028 patent/WO1996026875A1/en active IP Right Grant
- 1996-02-24 KR KR1019960004514A patent/KR960032671A/ko not_active Application Discontinuation
- 1996-02-24 EP EP96903264A patent/EP0809596B1/de not_active Expired - Lifetime
- 1996-02-24 DE DE69617210T patent/DE69617210T2/de not_active Expired - Fee Related
- 1996-02-24 CN CN96192226A patent/CN1058467C/zh not_active Expired - Fee Related
- 1996-02-24 JP JP8526163A patent/JPH10506361A/ja active Pending
- 1996-02-28 US US08/608,249 patent/US5987722A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| KR960032667A (ko) | 1996-09-17 |
| CN1058467C (zh) | 2000-11-15 |
| EP0809596A1 (de) | 1997-12-03 |
| JPH10506361A (ja) | 1998-06-23 |
| KR960032671A (ko) | 1996-09-17 |
| EP0809596B1 (de) | 2001-11-21 |
| WO1996026875A1 (en) | 1996-09-06 |
| CN1176625A (zh) | 1998-03-18 |
| US5987722A (en) | 1999-11-23 |
| DE69617210T2 (de) | 2002-07-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |