DE69607531D1 - Montageelement - Google Patents
MontageelementInfo
- Publication number
- DE69607531D1 DE69607531D1 DE69607531T DE69607531T DE69607531D1 DE 69607531 D1 DE69607531 D1 DE 69607531D1 DE 69607531 T DE69607531 T DE 69607531T DE 69607531 T DE69607531 T DE 69607531T DE 69607531 D1 DE69607531 D1 DE 69607531D1
- Authority
- DE
- Germany
- Prior art keywords
- mounting element
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
- H01S5/02345—Wire-bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/0237—Fixing laser chips on mounts by soldering
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Semiconductor Lasers (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Led Device Packages (AREA)
- Conductive Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18196295A JP3165779B2 (ja) | 1995-07-18 | 1995-07-18 | サブマウント |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69607531D1 true DE69607531D1 (de) | 2000-05-11 |
DE69607531T2 DE69607531T2 (de) | 2001-01-11 |
Family
ID=16109918
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69607531T Expired - Lifetime DE69607531T2 (de) | 1995-07-18 | 1996-07-17 | Montageelement |
Country Status (5)
Country | Link |
---|---|
US (1) | US5770821A (de) |
EP (1) | EP0755074B1 (de) |
JP (1) | JP3165779B2 (de) |
KR (1) | KR100379975B1 (de) |
DE (1) | DE69607531T2 (de) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5605856A (en) * | 1995-03-14 | 1997-02-25 | University Of North Carolina | Method for designing an electronic integrated circuit with optical inputs and outputs |
JP3339369B2 (ja) * | 1997-05-30 | 2002-10-28 | 株式会社デンソー | レーザダイオード |
CA2252113A1 (en) * | 1997-10-29 | 1999-04-29 | Yoshihiko Numata | Substrate and process for producing the same |
JP3274647B2 (ja) | 1998-05-15 | 2002-04-15 | 日本電気株式会社 | 光半導体素子の実装構造 |
JP2002100826A (ja) * | 2000-09-21 | 2002-04-05 | Toshiba Corp | サブマウント材 |
US6636539B2 (en) * | 2001-05-25 | 2003-10-21 | Novalux, Inc. | Method and apparatus for controlling thermal variations in an optical device |
GB0124220D0 (en) * | 2001-10-09 | 2001-11-28 | Denselight Semiconductors Pte | Thermal circuit |
JP4030285B2 (ja) * | 2001-10-10 | 2008-01-09 | 株式会社トクヤマ | 基板及びその製造方法 |
US6599466B1 (en) | 2002-01-16 | 2003-07-29 | Adma Products, Inc. | Manufacture of lightweight metal matrix composites with controlled structure |
JP4189156B2 (ja) * | 2002-02-22 | 2008-12-03 | 株式会社トクヤマ | チップ貼設シート |
JP3982284B2 (ja) * | 2002-03-06 | 2007-09-26 | 住友電気工業株式会社 | サブマウントおよび半導体装置 |
JP3509809B2 (ja) * | 2002-04-30 | 2004-03-22 | 住友電気工業株式会社 | サブマウントおよび半導体装置 |
WO2004007386A2 (en) * | 2002-07-11 | 2004-01-22 | Alfalight, Inc. | Thermal barrier for an optical bench |
JP2004356429A (ja) * | 2003-05-29 | 2004-12-16 | Sumitomo Electric Ind Ltd | サブマウントおよびそれを用いた半導体装置 |
CN100442551C (zh) * | 2003-09-30 | 2008-12-10 | 株式会社东芝 | 发光装置 |
DE10351934B4 (de) * | 2003-11-07 | 2017-07-13 | Tridonic Jennersdorf Gmbh | Leuchtdioden-Anordnung mit wärmeabführender Platine |
DE10355600B4 (de) * | 2003-11-28 | 2021-06-24 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterchip und Verfahren zur Herstellung von Halbleiterchips |
JP4393187B2 (ja) | 2003-12-26 | 2010-01-06 | 日本オプネクスト株式会社 | 半導体光素子用チップキャリア、光モジュール、及び光送受信器 |
JP2006100625A (ja) * | 2004-09-30 | 2006-04-13 | Tokuyama Corp | ハンダ層付き基板 |
JP4372669B2 (ja) | 2004-11-25 | 2009-11-25 | 株式会社トクヤマ | 素子搭載用基板の製造方法 |
DE102008013028A1 (de) * | 2008-03-07 | 2009-09-10 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil, Gerät zur Aufzeichnung von Bildinformation und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils |
CN101465516B (zh) * | 2009-01-09 | 2010-12-01 | 西安炬光科技有限公司 | 一种大功率半导体激光器及其制备方法 |
JP2011048256A (ja) * | 2009-08-28 | 2011-03-10 | Yazaki Corp | 光コネクタ及び光トランシーバ |
KR20110085481A (ko) * | 2010-01-20 | 2011-07-27 | 삼성전자주식회사 | 적층 반도체 패키지 |
DE102010045783A1 (de) * | 2010-09-17 | 2012-03-22 | Osram Opto Semiconductors Gmbh | Trägersubstrat für ein optoelektronisches Bauelement, Verfahren zu dessen Herstellung und optoelektronisches Bauelement |
TWI613177B (zh) * | 2011-11-16 | 2018-02-01 | 製陶技術股份有限公司 | 製造一基材的方法 |
US9563233B2 (en) * | 2014-08-14 | 2017-02-07 | Microsoft Technology Licensing, Llc | Electronic device with plated electrical contact |
US9042048B1 (en) | 2014-09-30 | 2015-05-26 | Western Digital (Fremont), Llc | Laser-ignited reactive HAMR bonding |
JP6881746B2 (ja) * | 2016-04-25 | 2021-06-02 | 住友電工デバイス・イノベーション株式会社 | 光半導体装置 |
EP3565068B1 (de) * | 2018-04-30 | 2021-02-24 | FRAUNHOFER-GESELLSCHAFT zur Förderung der angewandten Forschung e.V. | Thermisch abstimmbarer laser und verfahren zur herstellung solch eines lasers |
CN114938693A (zh) * | 2019-12-26 | 2022-08-23 | 日亚化学工业株式会社 | 激光光源 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57184296A (en) * | 1981-05-09 | 1982-11-12 | Hitachi Ltd | Ceramic circuit board |
JPS61119051A (ja) * | 1984-11-15 | 1986-06-06 | Nec Corp | 半導体装置 |
US4732780A (en) * | 1985-09-26 | 1988-03-22 | General Electric Company | Method of making hermetic feedthrough in ceramic substrate |
JPS63144588A (ja) * | 1986-12-09 | 1988-06-16 | Mitsubishi Electric Corp | 半導体チツプレ−ザ用サブマウント |
US5529852A (en) * | 1987-01-26 | 1996-06-25 | Sumitomo Electric Industries, Ltd. | Aluminum nitride sintered body having a metallized coating layer on its surface |
US4894273A (en) * | 1987-05-22 | 1990-01-16 | Ceramics Process Systems Corp. | Bonding additives for refractory metallization inks |
JPH0750813B2 (ja) * | 1988-05-23 | 1995-05-31 | 三菱電機株式会社 | 半導体レーザ素子用サブマウント |
US4942076A (en) * | 1988-11-03 | 1990-07-17 | Micro Substrates, Inc. | Ceramic substrate with metal filled via holes for hybrid microcircuits and method of making the same |
DE3838461A1 (de) * | 1988-11-12 | 1990-05-23 | Krebsoege Gmbh Sintermetall | Pulvermetallurgischer werkstoff auf kupferbasis und dessen verwendung |
US5229549A (en) * | 1989-11-13 | 1993-07-20 | Sumitomo Electric Industries, Ltd. | Ceramic circuit board and a method of manufacturing the ceramic circuit board |
US5587111A (en) * | 1990-03-29 | 1996-12-24 | Vacuum Metallurgical Co., Ltd. | Metal paste, process for producing same and method of making a metallic thin film using the metal paste |
US5200249A (en) * | 1990-08-15 | 1993-04-06 | W. R. Grace & Co.-Conn. | Via metallization for AlN ceramic electronic package |
JPH04242088A (ja) * | 1991-01-16 | 1992-08-28 | Nec Corp | Icソケット |
JPH0548213A (ja) * | 1991-08-15 | 1993-02-26 | Tanaka Kikinzoku Kogyo Kk | 半導体レーザーのサブマウント |
JP2992380B2 (ja) * | 1991-08-27 | 1999-12-20 | 日本特殊陶業株式会社 | ビアホールメタライズを有するセラミック焼結体の製造方法 |
JP2990906B2 (ja) * | 1991-12-11 | 1999-12-13 | 株式会社日立製作所 | 半導体素子実装用ヒートシンク |
US5340947A (en) * | 1992-06-22 | 1994-08-23 | Cirqon Technologies Corporation | Ceramic substrates with highly conductive metal vias |
JPH06112585A (ja) * | 1992-09-25 | 1994-04-22 | Tanaka Kikinzoku Kogyo Kk | サブマウントの製造方法 |
JPH06163765A (ja) * | 1992-11-27 | 1994-06-10 | Nippon Avionics Co Ltd | 窒化アルミヒートシンクおよびその製造方法 |
US5429670A (en) * | 1993-04-26 | 1995-07-04 | Matsushita Electric Industrial Co., Ltd. | Gold paste for a ceramic circuit board |
US5561322A (en) * | 1994-11-09 | 1996-10-01 | International Business Machines Corporation | Semiconductor chip package with enhanced thermal conductivity |
-
1995
- 1995-07-18 JP JP18196295A patent/JP3165779B2/ja not_active Expired - Lifetime
-
1996
- 1996-07-12 US US08/679,673 patent/US5770821A/en not_active Expired - Lifetime
- 1996-07-16 KR KR1019960028666A patent/KR100379975B1/ko not_active IP Right Cessation
- 1996-07-17 EP EP96305256A patent/EP0755074B1/de not_active Expired - Lifetime
- 1996-07-17 DE DE69607531T patent/DE69607531T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP3165779B2 (ja) | 2001-05-14 |
EP0755074A3 (de) | 1998-04-01 |
JPH0936274A (ja) | 1997-02-07 |
EP0755074A2 (de) | 1997-01-22 |
EP0755074B1 (de) | 2000-04-05 |
DE69607531T2 (de) | 2001-01-11 |
US5770821A (en) | 1998-06-23 |
KR970008513A (ko) | 1997-02-24 |
KR100379975B1 (ko) | 2003-07-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |