DE69533078D1 - Schnittstelle für automatische Testanordnung - Google Patents

Schnittstelle für automatische Testanordnung

Info

Publication number
DE69533078D1
DE69533078D1 DE69533078T DE69533078T DE69533078D1 DE 69533078 D1 DE69533078 D1 DE 69533078D1 DE 69533078 T DE69533078 T DE 69533078T DE 69533078 T DE69533078 T DE 69533078T DE 69533078 D1 DE69533078 D1 DE 69533078D1
Authority
DE
Germany
Prior art keywords
interface
automatic test
test setup
setup
automatic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69533078T
Other languages
English (en)
Other versions
DE69533078T2 (de
Inventor
Alexander H Slocum
Michael A Chiu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teradyne Inc
Original Assignee
Teradyne Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teradyne Inc filed Critical Teradyne Inc
Application granted granted Critical
Publication of DE69533078D1 publication Critical patent/DE69533078D1/de
Publication of DE69533078T2 publication Critical patent/DE69533078T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/30—Structural combination of electric measuring instruments with basic electronic circuits, e.g. with amplifier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06705—Apparatus for holding or moving single probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T403/00—Joints and connections
    • Y10T403/32—Articulated members
DE69533078T 1994-09-01 1995-09-01 Schnittstelle für automatische Testanordnung Expired - Fee Related DE69533078T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29983194A 1994-09-01 1994-09-01
US299831 1994-09-01

Publications (2)

Publication Number Publication Date
DE69533078D1 true DE69533078D1 (de) 2004-07-01
DE69533078T2 DE69533078T2 (de) 2005-07-28

Family

ID=23156483

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69533078T Expired - Fee Related DE69533078T2 (de) 1994-09-01 1995-09-01 Schnittstelle für automatische Testanordnung

Country Status (7)

Country Link
US (2) US6104202A (de)
EP (1) EP0699913B1 (de)
JP (1) JPH0926458A (de)
KR (1) KR100379811B1 (de)
CN (1) CN1113404C (de)
DE (1) DE69533078T2 (de)
TW (1) TW273635B (de)

Families Citing this family (75)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5982182A (en) * 1994-09-01 1999-11-09 Chiu; Michael A. Interface apparatus for automatic test equipment with positioning modules incorporating kinematic surfaces
ATE205303T1 (de) * 1995-02-23 2001-09-15 Aesop Inc Manipulator für einen testkopf einer automatischen testanlage
EP0857150B1 (de) 1995-10-13 2002-03-27 Empak, Inc. 300 mm behälter mit mikroumgebung und seitentür und erdungsleitung
US6166552A (en) * 1996-06-10 2000-12-26 Motorola Inc. Method and apparatus for testing a semiconductor wafer
US6586954B2 (en) * 1998-02-10 2003-07-01 Celadon Systems, Inc. Probe tile for probing semiconductor wafer
US6201402B1 (en) 1997-04-08 2001-03-13 Celadon Systems, Inc. Probe tile and platform for large area wafer probing
FR2762682B1 (fr) * 1997-04-24 1999-07-16 Sgs Thomson Microelectronics Anneaux de serrage pour tetes de testeur de circuit integre
US5949002A (en) * 1997-11-12 1999-09-07 Teradyne, Inc. Manipulator for automatic test equipment with active compliance
US6316954B1 (en) 1998-07-13 2001-11-13 Ohio Associated Enterprises, Inc. High performance test interface
US6193430B1 (en) * 1999-03-18 2001-02-27 Aesop, Inc. Quasi-kinematic coupling and method for use in assembling and locating mechanical components and the like
US7349223B2 (en) * 2000-05-23 2008-03-25 Nanonexus, Inc. Enhanced compliant probe card systems having improved planarity
US6917525B2 (en) * 2001-11-27 2005-07-12 Nanonexus, Inc. Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs
US7382142B2 (en) * 2000-05-23 2008-06-03 Nanonexus, Inc. High density interconnect system having rapid fabrication cycle
US6812718B1 (en) 1999-05-27 2004-11-02 Nanonexus, Inc. Massively parallel interface for electronic circuits
US6340895B1 (en) * 1999-07-14 2002-01-22 Aehr Test Systems, Inc. Wafer-level burn-in and test cartridge
US6252415B1 (en) * 1999-09-14 2001-06-26 Advantest Corp. Pin block structure for mounting contact pins
US6310486B1 (en) 1999-10-01 2001-10-30 Teradyne, Inc. Integrated test cell
US6392428B1 (en) * 1999-11-16 2002-05-21 Eaglestone Partners I, Llc Wafer level interposer
US6734688B1 (en) 2000-05-15 2004-05-11 Teradyne, Inc. Low compliance tester interface
US7952373B2 (en) 2000-05-23 2011-05-31 Verigy (Singapore) Pte. Ltd. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
US6537831B1 (en) 2000-07-31 2003-03-25 Eaglestone Partners I, Llc Method for selecting components for a matched set using a multi wafer interposer
US6812048B1 (en) 2000-07-31 2004-11-02 Eaglestone Partners I, Llc Method for manufacturing a wafer-interposer assembly
US6813817B2 (en) 2000-09-15 2004-11-09 James Orsillo Method of using a replacement headplate to adapt a probe station
US6408500B1 (en) 2000-09-15 2002-06-25 James Orsillo Method of retrofitting a probe station
US7053646B2 (en) 2000-09-15 2006-05-30 Orsillo James F Apparatus and method for use in testing a semiconductor wafer
US6741072B2 (en) * 2000-09-15 2004-05-25 James E. Orsillo Docking system for connecting a tester to a probe station using an A-type docking configuration
US6420888B1 (en) * 2000-09-29 2002-07-16 Schlumberger Technologies, Inc. Test system and associated interface module
US6815712B1 (en) 2000-10-02 2004-11-09 Eaglestone Partners I, Llc Method for selecting components for a matched set from a wafer-interposer assembly
US6551122B2 (en) 2000-10-04 2003-04-22 Teradyne, Inc. Low profile pneumatically actuated docking module with power fault release
US6686657B1 (en) * 2000-11-07 2004-02-03 Eaglestone Partners I, Llc Interposer for improved handling of semiconductor wafers and method of use of same
US6496001B1 (en) 2000-11-14 2002-12-17 International Business Machines Corporation System and method for probe mechanism planarization
US6617867B2 (en) * 2000-11-29 2003-09-09 Teradyne, Inc. Mechanism for clamping device interface board to peripheral
US6529022B2 (en) * 2000-12-15 2003-03-04 Eaglestone Pareners I, Llc Wafer testing interposer for a conventional package
US6673653B2 (en) 2001-02-23 2004-01-06 Eaglestone Partners I, Llc Wafer-interposer using a ceramic substrate
JP4084301B2 (ja) * 2001-07-16 2008-04-30 インテスト コーポレイション 電子テストヘッドを取り扱い装置とドッキングするためのシステム、および電子テストヘッドを取り扱い装置とドッキングするための方法
US6570397B2 (en) 2001-08-07 2003-05-27 Agilent Technologies, Inc. Timing calibration and timing calibration verification of electronic circuit testers
EP1458634A1 (de) * 2001-11-27 2004-09-22 Entegris, Inc. Wafer-träger mit frontöffnung und erdleitung
US7813634B2 (en) 2005-02-28 2010-10-12 Tessera MEMS Technologies, Inc. Autofocus camera
US6850675B1 (en) * 2002-02-04 2005-02-01 Siwave, Inc. Base, payload and connecting structure and methods of making the same
US6661955B1 (en) 2002-02-04 2003-12-09 Siwave, Inc. Kinematic and non-kinematic passive alignment assemblies and methods of making the same
US6674585B1 (en) 2002-02-04 2004-01-06 Siwave, Inc. Flexure assemblies and methods of making the same
DE10216003B4 (de) * 2002-04-11 2005-03-10 Multitest Elektronische Syst Dockingvorrichtung
US6756800B2 (en) * 2002-04-16 2004-06-29 Teradyne, Inc. Semiconductor test system with easily changed interface unit
JP2003315408A (ja) * 2002-04-18 2003-11-06 Mitsubishi Electric Corp 半導体試験用テストボード
US6744267B2 (en) * 2002-07-16 2004-06-01 Nptest, Llc Test system and methodology
WO2004036384A2 (en) * 2002-10-18 2004-04-29 Intellocity Usa, Inc. Ichoose video advertising
US6833696B2 (en) * 2003-03-04 2004-12-21 Xandex, Inc. Methods and apparatus for creating a high speed connection between a device under test and automatic test equipment
US7235964B2 (en) * 2003-03-31 2007-06-26 Intest Corporation Test head positioning system and method
US6894523B2 (en) * 2003-07-01 2005-05-17 Intel Corporation System and method for testing semiconductor devices
US7145157B2 (en) * 2003-09-11 2006-12-05 Applied Materials, Inc. Kinematic ion implanter electrode mounting
JP2005265658A (ja) * 2004-03-19 2005-09-29 Tokyo Electron Ltd 複数種のテスタに対応可能なプローブ装置
KR100621627B1 (ko) * 2004-05-28 2006-09-19 삼성전자주식회사 웨이퍼 테스트 설비 및 그 설비의 정렬 방법
CN102253251B (zh) * 2004-09-03 2014-04-02 塞莱敦体系股份有限公司 用于探测半导体晶片的可置换探针装置
US7262619B2 (en) * 2005-02-28 2007-08-28 Texas Instruments Incorporated Semiconductor device test system
US7316579B2 (en) * 2005-09-16 2008-01-08 Ohio Associated Enterprises, Llc Zero insertion force cable interface
US7504822B2 (en) * 2005-10-28 2009-03-17 Teradyne, Inc. Automatic testing equipment instrument card and probe cabling system and apparatus
US7541819B2 (en) * 2005-10-28 2009-06-02 Teradyne, Inc. Modularized device interface with grounding insert between two strips
US7746060B2 (en) 2005-12-28 2010-06-29 Advantest Corporation Attachment apparatus, test head, and electronic device test system
US7728609B2 (en) * 2007-05-25 2010-06-01 Celadon Systems, Inc. Replaceable probe apparatus for probing semiconductor wafer
JP5184910B2 (ja) * 2008-02-13 2013-04-17 株式会社岡本工作機械製作所 基板の平面研削装置
KR100900162B1 (ko) 2009-01-13 2009-06-02 에버테크노 주식회사 마이크로폰 테스트시스템의 테스트장치
US8476918B2 (en) * 2010-04-28 2013-07-02 Tsmc Solid State Lighting Ltd. Apparatus and method for wafer level classification of light emitting device
CN103782182B (zh) 2011-07-12 2016-08-24 英泰斯特股份有限公司 驳接测试头与外围设备的方法与装置
US9259931B2 (en) 2012-12-19 2016-02-16 Cimpress Schweiz Gmbh System and method for print head alignment using alignment adapter
US9132660B2 (en) 2012-12-19 2015-09-15 Cimpress Schweiz Gmbh System and method for offline print head alignment
US8851616B2 (en) 2012-12-19 2014-10-07 Vistaprint Schweiz Gmbh Print head pre-alignment systems and methods
JP6488281B2 (ja) * 2013-05-14 2019-03-20 フォームファクター， インコーポレイテッド 交換可能プローブヘッドの自動取り付け及び取り外し
TWI548877B (zh) * 2015-01-13 2016-09-11 京元電子股份有限公司 半導體元件測試連接機構
DE102015109022B4 (de) * 2015-06-08 2018-08-23 Infineon Technologies Ag Modulares Messgerät zum Testen von Prüflingen mittels Schnittstellenelementen
WO2016200630A1 (en) * 2015-06-10 2016-12-15 Translarity, Inc. Lost motion gasket for semiconductor test, and associated systems and methods
CN106181629A (zh) * 2016-07-15 2016-12-07 绔ユ旦 一种太阳能供电的磨削装置
DE102017104516B4 (de) * 2017-03-03 2021-06-10 Turbodynamics Gmbh Plattenförmiges Verbindungssystem zum Verbinden von zwei Testeinheiten sowie Verbindungseinheit und Testsystem mit jeweils einem solchen plattenförmigen Verbindungssystem
TWI720769B (zh) * 2019-12-31 2021-03-01 致茂電子股份有限公司 測試設備及其活動式連結機構
US20220276281A1 (en) * 2021-03-01 2022-09-01 Formfactor, Inc. Method of centering probe head in mounting frame
CN115236360B (zh) * 2022-09-21 2022-11-22 百信信息技术有限公司 一种改进型多用途测试专用车

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3609539A (en) * 1968-09-28 1971-09-28 Ibm Self-aligning kelvin probe
US4055805A (en) * 1976-06-28 1977-10-25 Probe Rite, Inc. Multi-point test probe
US4195259A (en) * 1978-04-04 1980-03-25 Texas Instruments Incorporated Multiprobe test system and method of using same
US4357575A (en) * 1980-06-17 1982-11-02 Dit-Mco International Corporation Apparatus for use in testing printed circuit process boards having means for positioning such boards in proper juxtaposition with electrical contacting assemblies
US4443756A (en) * 1980-11-25 1984-04-17 Lightbody James D Apparatus and method for testing circuit boards
US4457664A (en) * 1982-03-22 1984-07-03 Ade Corporation Wafer alignment station
US4574625A (en) * 1983-04-12 1986-03-11 Federal Products Corporation Surface finish, displacement and contour scanner
US4610020A (en) * 1984-01-06 1986-09-02 The Perkin-Elmer Corporation X-ray mask ring and apparatus for making same
US4665360A (en) * 1985-03-11 1987-05-12 Eaton Corporation Docking apparatus
US4685661A (en) * 1985-06-21 1987-08-11 The United States Of America As Represented By The Secretary Of Commerce Method and mechanism for fixturing objects
US4694230A (en) * 1986-03-11 1987-09-15 Usa As Represented By The Secretary Of Commerce Micromanipulator system
US4751457A (en) * 1986-09-08 1988-06-14 Tektronix, Inc. Integrated circuit probe parallelism establishing method and apparatus
US4899107A (en) * 1988-09-30 1990-02-06 Micron Technology, Inc. Discrete die burn-in for nonpackaged die
US4987365A (en) * 1989-04-28 1991-01-22 Hewlett-Packard Company Method and apparatus for testing integrated circuits
US5015946A (en) * 1990-02-26 1991-05-14 Tektronix, Inc. High density probe
US5148103A (en) * 1990-10-31 1992-09-15 Hughes Aircraft Company Apparatus for testing integrated circuits
US5068601A (en) * 1991-02-11 1991-11-26 Credence Systems Corporation Dual function cam-ring system for DUT board parallel electrical inter-connection and prober/handler docking
US5559444A (en) * 1991-06-04 1996-09-24 Micron Technology, Inc. Method and apparatus for testing unpackaged semiconductor dice
US5414369A (en) * 1992-11-09 1995-05-09 Nhk Spring Co., Ltd. Coil spring-pressed needle contact probe modules with offset needles
US5530375A (en) * 1992-12-24 1996-06-25 International Business Machines Corporation Method of testing circuits and/or burning-in chips
US5469074A (en) * 1994-02-08 1995-11-21 The Whitaker Corporation Chip socket testing apparatus with adjustable contact force
US5642298A (en) * 1994-02-16 1997-06-24 Ade Corporation Wafer testing and self-calibration system

Also Published As

Publication number Publication date
KR100379811B1 (ko) 2003-05-23
US6104202A (en) 2000-08-15
CN1125898A (zh) 1996-07-03
DE69533078T2 (de) 2005-07-28
KR960012412A (ko) 1996-04-20
EP0699913A2 (de) 1996-03-06
JPH0926458A (ja) 1997-01-28
US5821764A (en) 1998-10-13
TW273635B (de) 1996-04-01
CN1113404C (zh) 2003-07-02
EP0699913A3 (de) 1997-04-16
EP0699913B1 (de) 2004-05-26

Similar Documents

Publication Publication Date Title
DE69533078D1 (de) Schnittstelle für automatische Testanordnung
DE69512642T2 (de) Test anschluss für netzwerkschnittstelleeinheitsmodul
DE69904854T2 (de) Testmodule für automatische testanordnung
DE69530103D1 (de) Verbindungselemente für mikroelektronische komponenten
DE19581288T1 (de) Automatisches Testsystem und -verfahren für Halbleitervorrichtungen
DE69737619D1 (de) Waschgerät für automatische Analysevorrichtung
DE69502696T2 (de) Horizontalausrichtanordnung für treppenaufzüge
DE69529223T2 (de) Testverfahren
ATE244408T1 (de) Immunochromatographische testvorrichtung
DE69824957D1 (de) Kabelanordnung für prüfvorrichtung
DE69518762T2 (de) Verbindungsvorrichtung für Leitungen
DE9405224U1 (de) Automatisches Analysegerät
FI955750A0 (fi) Viestimen testausmenetelmä
DE59700327D1 (de) Verbindungseinrichtung für Profilteile
DE9417628U1 (de) Prüfgerät für Baugerüste
DE69515623D1 (de) Testverbinder für automatische Testvorrichtung
DE29500678U1 (de) Prüfvorrichtung für Verkabelungsstecker
DE29613893U1 (de) Verbindungsvorrichtung für Geländer
DE9416307U1 (de) Prüfvorrichtung
DE29515513U1 (de) Startautomatik für Linienzugbeeinflussungsprüfstand
DE29515309U1 (de) Einschubvorrichtung für Tafeln
DE29505374U1 (de) Spannvorrichtung für Prüfmaschinen
KR960015317U (ko) 릴레이 테스터
KR960024231U (ko) 수압 테스트용 연결 장치
KR980005812U (ko) 통신장비 자동시험장치

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee