DE69511928T2 - Verfahren zum Verbinden zweier mit Leiterbahnen versehener Bänder und Magnetkopf mit zwei nach diesem Verfahren miteinander verbundenen Bändern - Google Patents

Verfahren zum Verbinden zweier mit Leiterbahnen versehener Bänder und Magnetkopf mit zwei nach diesem Verfahren miteinander verbundenen Bändern

Info

Publication number
DE69511928T2
DE69511928T2 DE69511928T DE69511928T DE69511928T2 DE 69511928 T2 DE69511928 T2 DE 69511928T2 DE 69511928 T DE69511928 T DE 69511928T DE 69511928 T DE69511928 T DE 69511928T DE 69511928 T2 DE69511928 T2 DE 69511928T2
Authority
DE
Germany
Prior art keywords
strips
conductor parts
free
adhesive
free conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69511928T
Other languages
German (de)
English (en)
Other versions
DE69511928D1 (de
Inventor
Martinus Antonius Franciscus Vervoort
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of DE69511928D1 publication Critical patent/DE69511928D1/de
Application granted granted Critical
Publication of DE69511928T2 publication Critical patent/DE69511928T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/61—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
    • G11B5/3103—Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49194—Assembling elongated conductors, e.g., splicing, etc.
    • Y10T29/49201—Assembling elongated conductors, e.g., splicing, etc. with overlapping orienting

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Magnetic Heads (AREA)
  • Multi-Conductor Connections (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Toys (AREA)
DE69511928T 1994-04-22 1995-04-18 Verfahren zum Verbinden zweier mit Leiterbahnen versehener Bänder und Magnetkopf mit zwei nach diesem Verfahren miteinander verbundenen Bändern Expired - Fee Related DE69511928T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
BE9400416A BE1008374A3 (nl) 1994-04-22 1994-04-22 Werkwijze voor het verbinden van twee van sporenpatronen voorziene strippen, alsmede magneetkop voorzien van twee volgens de werkwijze met elkaar verbonden strippen.

Publications (2)

Publication Number Publication Date
DE69511928D1 DE69511928D1 (de) 1999-10-14
DE69511928T2 true DE69511928T2 (de) 2000-07-20

Family

ID=3888116

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69511928T Expired - Fee Related DE69511928T2 (de) 1994-04-22 1995-04-18 Verfahren zum Verbinden zweier mit Leiterbahnen versehener Bänder und Magnetkopf mit zwei nach diesem Verfahren miteinander verbundenen Bändern

Country Status (7)

Country Link
US (1) US5640759A (cg-RX-API-DMAC7.html)
EP (1) EP0678933B1 (cg-RX-API-DMAC7.html)
JP (1) JPH07302971A (cg-RX-API-DMAC7.html)
KR (1) KR950034078A (cg-RX-API-DMAC7.html)
BE (1) BE1008374A3 (cg-RX-API-DMAC7.html)
DE (1) DE69511928T2 (cg-RX-API-DMAC7.html)
TW (1) TW296450B (cg-RX-API-DMAC7.html)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3646670A (en) * 1968-07-19 1972-03-07 Hitachi Chemical Co Ltd Method for connecting conductors
AT303049B (de) * 1971-02-03 1972-11-10 Sauter Dr Fritz Verfahren zur Herstellung von neuen 3,4-Dihydro-thieno-[2,3-d][1,2,3]triazin-4-on-Derivaten und ihren Salzen
JPS5357481A (en) * 1976-11-04 1978-05-24 Canon Inc Connecting process
FR2541828B1 (fr) * 1983-02-28 1985-09-13 Inf Milit Spatiale Aeronaut Dispositif de connexion electrique entre deux cartes de circuits imprimes et procede de connexion de deux cartes de circuits imprimes a l'aide d'un tel dispositif
JPS618708A (ja) * 1984-06-22 1986-01-16 Tokyo Electric Co Ltd 磁気ヘツドにおけるコイル引出し線の固定方法
JPH03106578A (ja) * 1989-09-20 1991-05-07 Sumitomo Special Metals Co Ltd スポット状部分クラッド材の製造方法
JP2946737B2 (ja) * 1990-11-05 1999-09-06 松下電器産業株式会社 磁気ヘッドのリード線固定方法
JP2931477B2 (ja) * 1991-06-07 1999-08-09 シャープ株式会社 薄膜磁気ヘッド構造体およびその製造方法

Also Published As

Publication number Publication date
DE69511928D1 (de) 1999-10-14
US5640759A (en) 1997-06-24
EP0678933A1 (en) 1995-10-25
EP0678933B1 (en) 1999-09-08
TW296450B (cg-RX-API-DMAC7.html) 1997-01-21
KR950034078A (ko) 1995-12-26
JPH07302971A (ja) 1995-11-14
BE1008374A3 (nl) 1996-04-02

Similar Documents

Publication Publication Date Title
DE60001776T2 (de) Einkapselungsverfahren einer halbleiteranordnung mit einem anisotropisch leitenden klebstoff
DE3880716T2 (de) Verbinden von thermoplastischen Schichten.
DE10037183B4 (de) Verfahren zum Verbinden von Leiterplatten und Verbindungsaufbau
DE60034756T2 (de) Flip-Chip-Montage eines IC auf eine Leiterplatte
AT398877B (de) Zwei- oder mehrlagige leiterplatte, verfahren zum herstellen einer solchen leiterplatte und laminat für die herstellung einer solchen leiterplatte nach einem solchen verfahren
DE2111396B2 (de) Verfahren zur herstellung elektrischer leiterplatten
DE2227701C3 (de) Verfahren zur Herstellung von Schal tungs-Zwischenverbindungen
DE3787987T2 (de) Anisotropisches elastomeres Zwischenverbindungssystem.
DE2831984A1 (de) Elektrische verbindung zwischen zwei auf getrennte traeger aufgebrachten elektrischen schaltkreisen
DE69414686T2 (de) Elektrische verbindungsstruktur und verfahren zum elektrischen verbinden von anschluessen untereinander
DE69312196T2 (de) Verfahren zur Vorbereitung der Montage eines Chips auf einem Substrat
DE102007058497A1 (de) Laminierte mehrschichtige Leiterplatte
DE69015854T2 (de) Anordnung von Halbleiterbauelementen und Verfahren und Vorrichtung zur Montage von Halbleiterbauelementen.
DE3149641A1 (de) "eleketrische schaltungsplatte und verfahren zu ihrer herstellung"
DE19522338B4 (de) Chipträgeranordnung mit einer Durchkontaktierung
DE69127316T2 (de) Verfahren zum Zusammenbau eines Leiterrahmens
DE69112329T2 (de) Verfahren zur Herstellung eines Lautsprecherdämpfers und Lautsprecherdämpfer resultierend aus diesem Verfahren.
DE3240754C2 (cg-RX-API-DMAC7.html)
DE2364520C3 (de) Verfahren zur Herstellung einer gedruckten Schaltung
DE3212295A1 (de) Verfahren zum verbinden zweier flaechen von platten
EP0897654B1 (de) Verfahren zur herstellung elektrisch leitender verbindungen zwischen zwei oder mehr leiterstrukturen
DE69511928T2 (de) Verfahren zum Verbinden zweier mit Leiterbahnen versehener Bänder und Magnetkopf mit zwei nach diesem Verfahren miteinander verbundenen Bändern
DE3610998A1 (de) Duennfilm-magnetkopf
DE69317373T2 (de) Hohlgeformte Plastikpackung für Halbleiteranordnung und Herstellungsverfahren
DE10151657C1 (de) Verfahren zur Montage eines Chips auf einem Substrat

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee