DE69506184T2 - Thermisch und optisch isolierte oberflächenemittierende Laserdioden - Google Patents

Thermisch und optisch isolierte oberflächenemittierende Laserdioden

Info

Publication number
DE69506184T2
DE69506184T2 DE69506184T DE69506184T DE69506184T2 DE 69506184 T2 DE69506184 T2 DE 69506184T2 DE 69506184 T DE69506184 T DE 69506184T DE 69506184 T DE69506184 T DE 69506184T DE 69506184 T2 DE69506184 T2 DE 69506184T2
Authority
DE
Germany
Prior art keywords
thermally
emitting laser
surface emitting
laser diodes
insulated surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69506184T
Other languages
English (en)
Other versions
DE69506184D1 (de
Inventor
Shih-Yuan Wang
Michael R T Tan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avago Technologies International Sales Pte Ltd
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Application granted granted Critical
Publication of DE69506184D1 publication Critical patent/DE69506184D1/de
Publication of DE69506184T2 publication Critical patent/DE69506184T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/40Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/42Arrays of surface emitting lasers
    • H01S5/423Arrays of surface emitting lasers having a vertical cavity
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/024Arrangements for thermal management
    • H01S5/02461Structure or details of the laser chip to manipulate the heat flow, e.g. passive layers in the chip with a low heat conductivity
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S2301/00Functional characteristics
    • H01S2301/17Semiconductor lasers comprising special layers
    • H01S2301/176Specific passivation layers on surfaces other than the emission facet
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/024Arrangements for thermal management
    • H01S5/02469Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/04Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042Electrical excitation ; Circuits therefor
    • H01S5/0425Electrodes, e.g. characterised by the structure
    • H01S5/04254Electrodes, e.g. characterised by the structure characterised by the shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/10Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • H01S5/18308Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/10Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • H01S5/18344Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] characterized by the mesa, e.g. dimensions or shape of the mesa
    • H01S5/18347Mesa comprising active layer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/20Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/2054Methods of obtaining the confinement
    • H01S5/2081Methods of obtaining the confinement using special etching techniques

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
DE69506184T 1994-07-07 1995-06-07 Thermisch und optisch isolierte oberflächenemittierende Laserdioden Expired - Fee Related DE69506184T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/271,606 US5729563A (en) 1994-07-07 1994-07-07 Method and apparatus for optically and thermally isolating surface emitting laser diodes

Publications (2)

Publication Number Publication Date
DE69506184D1 DE69506184D1 (de) 1999-01-07
DE69506184T2 true DE69506184T2 (de) 1999-04-15

Family

ID=23036289

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69506184T Expired - Fee Related DE69506184T2 (de) 1994-07-07 1995-06-07 Thermisch und optisch isolierte oberflächenemittierende Laserdioden

Country Status (4)

Country Link
US (1) US5729563A (de)
EP (1) EP0691717B1 (de)
JP (1) JP3787376B2 (de)
DE (1) DE69506184T2 (de)

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US6052399A (en) * 1997-08-29 2000-04-18 Xerox Corporation Independently addressable laser array with native oxide for optical confinement and electrical isolation
EP1019992B1 (de) * 1997-10-10 2006-06-14 Cymer, Inc. Pulsenergiesteuerung für excimer-laser
US6069908A (en) * 1998-02-09 2000-05-30 Hewlwtt-Packard Company N-drive or P-drive VCSEL array
US6117699A (en) * 1998-04-10 2000-09-12 Hewlett-Packard Company Monolithic multiple wavelength VCSEL array
US6268457B1 (en) 1999-06-10 2001-07-31 Allied Signal, Inc. Spin-on glass anti-reflective coatings for photolithography
KR100804873B1 (ko) * 1999-06-10 2008-02-20 얼라이드시그날 인코퍼레이티드 포토리소그래피용 sog 반사방지 코팅
US6251791B1 (en) * 1999-07-20 2001-06-26 United Microelectronics Corp. Eliminating etching microloading effect by in situ deposition and etching
US6351481B1 (en) * 1999-10-06 2002-02-26 Opto Power Corp Diode laser with screening window and method of fabrication
WO2001078261A2 (en) * 2000-04-10 2001-10-18 Lenslet Ltd. Ofdm modem with an optical processor
US6936900B1 (en) * 2000-05-04 2005-08-30 Osemi, Inc. Integrated transistor devices
US6368400B1 (en) 2000-07-17 2002-04-09 Honeywell International Absorbing compounds for spin-on-glass anti-reflective coatings for photolithography
KR100727907B1 (ko) * 2000-07-20 2007-06-14 삼성전자주식회사 다중 파장 표면광 레이저 및 그 제조방법
US6573528B2 (en) * 2000-10-12 2003-06-03 Walter David Braddock Detector diode with internal calibration structure
US6753214B1 (en) * 2001-02-16 2004-06-22 Optical Communication Products, Inc. Photodetector with isolation implant region for reduced device capacitance and increased bandwidth
GB2377318A (en) * 2001-07-03 2003-01-08 Mitel Semiconductor Ab Vertical Cavity Surface Emitting Laser
US8129253B2 (en) * 2001-08-13 2012-03-06 Finisar Corporation Providing current control over wafer borne semiconductor devices using trenches
JP2003282939A (ja) * 2002-03-26 2003-10-03 Oki Degital Imaging:Kk 半導体発光装置及びその製造方法
US6989556B2 (en) * 2002-06-06 2006-01-24 Osemi, Inc. Metal oxide compound semiconductor integrated transistor devices with a gate insulator structure
US7187045B2 (en) * 2002-07-16 2007-03-06 Osemi, Inc. Junction field effect metal oxide compound semiconductor integrated transistor devices
TW565975B (en) * 2002-12-27 2003-12-11 Ind Tech Res Inst Oxide confined type vertical cavity surface emitting laser device and the manufacturing method thereof
WO2005048318A2 (en) * 2003-11-17 2005-05-26 Osemi, Inc. Nitride metal oxide semiconductor integrated transistor devices
US8053159B2 (en) 2003-11-18 2011-11-08 Honeywell International Inc. Antireflective coatings for via fill and photolithography applications and methods of preparation thereof
WO2005061756A1 (en) * 2003-12-09 2005-07-07 Osemi, Inc. High temperature vacuum evaporation apparatus
US7372886B2 (en) * 2004-06-07 2008-05-13 Avago Technologies Fiber Ip Pte Ltd High thermal conductivity vertical cavity surface emitting laser (VCSEL)
JP2006245132A (ja) * 2005-03-01 2006-09-14 Sumitomo Electric Ind Ltd 半導体光素子および半導体光素子を作製する方法
US7247885B2 (en) * 2005-05-26 2007-07-24 Avago Technologies General Ip (Singapore) Ltd. Pte. Carrier confinement in light-emitting group IV semiconductor devices
JP4892940B2 (ja) * 2005-11-29 2012-03-07 富士ゼロックス株式会社 面発光型半導体レーザ装置およびその製造方法
JP2007294744A (ja) * 2006-04-26 2007-11-08 Ricoh Co Ltd 面発光レーザアレイ、光走査装置及び画像形成装置
US8642246B2 (en) 2007-02-26 2014-02-04 Honeywell International Inc. Compositions, coatings and films for tri-layer patterning applications and methods of preparation thereof
JP5177358B2 (ja) * 2007-06-15 2013-04-03 株式会社リコー 面発光レーザアレイ、光走査装置、画像形成装置、光伝送モジュール及び光伝送システム
TWM363080U (en) * 2009-01-21 2009-08-11 Pixart Imaging Inc Packaging structure
US8557877B2 (en) 2009-06-10 2013-10-15 Honeywell International Inc. Anti-reflective coatings for optically transparent substrates
SE534346C2 (sv) * 2009-12-04 2011-07-19 Ekklippan Ab Integrerat chip innefattande dike
US8864898B2 (en) 2011-05-31 2014-10-21 Honeywell International Inc. Coating formulations for optical elements
US8644712B2 (en) 2011-06-23 2014-02-04 Avago Technologies General Ip (Singapore) Pte. Ltd. Opto-electronic transceiver module with housing having thermally conductive protrusion
JP2014007335A (ja) * 2012-06-26 2014-01-16 Hamamatsu Photonics Kk 半導体発光素子
US9306671B2 (en) 2012-12-07 2016-04-05 Applied Optoelectronics, Inc. Thermally isolated multi-channel transmitter optical subassembly and optical transceiver module including same
US9236945B2 (en) 2012-12-07 2016-01-12 Applied Optoelectronics, Inc. Thermally shielded multi-channel transmitter optical subassembly and optical transceiver module including same
US9614620B2 (en) 2013-02-06 2017-04-04 Applied Optoelectronics, Inc. Coaxial transmitter optical subassembly (TOSA) with cuboid type to laser package and optical transceiver including same
WO2016191359A1 (en) 2015-05-22 2016-12-01 Applied Optoelectronics, Inc. Coaxial transmitter optical subassembly (tosa) with cuboid type to laser package and optical transceiver including same
EP2954628A4 (de) * 2013-02-06 2016-09-28 Applied Optoelectronics Inc Optische baugruppe für einen wärmeabgeschirmten mehrkanalsender und optisches sende-/empfangsmodul damit
JP6803842B2 (ja) 2015-04-13 2020-12-23 ハネウェル・インターナショナル・インコーポレーテッドHoneywell International Inc. オプトエレクトロニクス用途のためのポリシロキサン製剤及びコーティング
US9876576B2 (en) 2016-03-17 2018-01-23 Applied Optoelectronics, Inc. Layered coaxial transmitter optical subassemblies with support bridge therebetween
US20210098962A1 (en) * 2019-10-01 2021-04-01 Facebook Technologies, Llc Vertical cavity surface-emitting laser (vcsel) with a light barrier

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Also Published As

Publication number Publication date
US5729563A (en) 1998-03-17
DE69506184D1 (de) 1999-01-07
JPH0832178A (ja) 1996-02-02
EP0691717A1 (de) 1996-01-10
EP0691717B1 (de) 1998-11-25
JP3787376B2 (ja) 2006-06-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: AGILENT TECHNOLOGIES, INC. (N.D.GES.D.STAATES DELA

8327 Change in the person/name/address of the patent owner

Owner name: AVAGO TECHNOLOGIES FIBER IP (SINGAPORE) PTE. LTD.,

8339 Ceased/non-payment of the annual fee