DE69501243D1 - Elektronische und/oder magnetische Vorrichtung - Google Patents
Elektronische und/oder magnetische VorrichtungInfo
- Publication number
- DE69501243D1 DE69501243D1 DE69501243T DE69501243T DE69501243D1 DE 69501243 D1 DE69501243 D1 DE 69501243D1 DE 69501243 T DE69501243 T DE 69501243T DE 69501243 T DE69501243 T DE 69501243T DE 69501243 D1 DE69501243 D1 DE 69501243D1
- Authority
- DE
- Germany
- Prior art keywords
- electronic
- magnetic device
- magnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3109—Details
- G11B5/313—Disposition of layers
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/004—Printed inductances with the coil helically wound around an axis without a core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/03—Manufacturing methods
- H01L2224/036—Manufacturing methods by patterning a pre-deposited material
- H01L2224/0361—Physical or chemical etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/03—Manufacturing methods
- H01L2224/036—Manufacturing methods by patterning a pre-deposited material
- H01L2224/03622—Manufacturing methods by patterning a pre-deposited material using masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0542—Continuous temporary metal layer over metal pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22144494 | 1994-09-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69501243D1 true DE69501243D1 (de) | 1998-01-29 |
DE69501243T2 DE69501243T2 (de) | 1998-05-20 |
Family
ID=16766837
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69501243T Expired - Fee Related DE69501243T2 (de) | 1994-09-16 | 1995-09-15 | Elektronische und/oder magnetische Vorrichtung |
Country Status (3)
Country | Link |
---|---|
US (1) | US5738931A (de) |
EP (1) | EP0702379B1 (de) |
DE (1) | DE69501243T2 (de) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000174206A (ja) * | 1998-12-10 | 2000-06-23 | Sony Corp | 半導体装置およびその製造方法 |
TW444252B (en) * | 1999-03-19 | 2001-07-01 | Toshiba Corp | Semiconductor apparatus and its fabricating method |
JP2000322709A (ja) * | 1999-05-13 | 2000-11-24 | Alps Electric Co Ltd | 薄膜素子およびその製造方法 |
JP3363832B2 (ja) * | 1999-05-13 | 2003-01-08 | アルプス電気株式会社 | 薄膜構造体およびその製造方法 |
US6369983B1 (en) * | 1999-08-13 | 2002-04-09 | Read-Rite Corporation | Write head having a dry-etchable antireflective intermediate layer |
JP2001244123A (ja) | 2000-02-28 | 2001-09-07 | Kawatetsu Mining Co Ltd | 表面実装型平面磁気素子及びその製造方法 |
JP3320397B2 (ja) * | 2000-03-09 | 2002-09-03 | クラリアント ジャパン 株式会社 | 逆テーパー状レジストパターンの形成方法 |
US6653573B2 (en) * | 2000-04-04 | 2003-11-25 | Nec Tokin Corporation | Wiring board comprising granular magnetic film |
JP2001307313A (ja) * | 2000-04-20 | 2001-11-02 | Fujitsu Ltd | 薄膜ヘッドの製造方法 |
TWI312166B (en) * | 2001-09-28 | 2009-07-11 | Toppan Printing Co Ltd | Multi-layer circuit board, integrated circuit package, and manufacturing method for multi-layer circuit board |
JP3775499B2 (ja) * | 2002-01-08 | 2006-05-17 | 株式会社リコー | 半導体装置及びその製造方法、並びにdc−dcコンバータ |
JP3745316B2 (ja) | 2002-06-24 | 2006-02-15 | Necエレクトロニクス株式会社 | 半導体集積回路及びその製造方法 |
JP2005261987A (ja) * | 2002-09-06 | 2005-09-29 | Joiaasu Kk | 活性化装置 |
US7358195B2 (en) * | 2003-04-01 | 2008-04-15 | Lg.Philips Lcd Co., Ltd. | Method for fabricating liquid crystal display device |
JP4268434B2 (ja) * | 2003-04-09 | 2009-05-27 | 大日本印刷株式会社 | 配線基板の製造方法 |
JP2005191408A (ja) * | 2003-12-26 | 2005-07-14 | Matsushita Electric Ind Co Ltd | コイル導電体とその製造方法およびこれを用いた電子部品 |
JP2006154569A (ja) * | 2004-11-30 | 2006-06-15 | Tokyo Ohka Kogyo Co Ltd | レジストパターンおよび導体パターンの製造方法 |
PE20061324A1 (es) | 2005-04-29 | 2007-01-15 | Centocor Inc | Anticuerpos anti-il-6, composiciones, metodos y usos |
TWI277373B (en) * | 2005-09-16 | 2007-03-21 | Foxconn Advanced Tech Inc | Method of continuous producing flexible printed circuit board |
JP4775978B2 (ja) * | 2007-10-30 | 2011-09-21 | 太陽誘電株式会社 | 弾性波素子、デュープレクサ、通信モジュール、および通信装置 |
US8188235B2 (en) | 2008-06-18 | 2012-05-29 | Pfizer Inc. | Antibodies to IL-6 and their uses |
US8445375B2 (en) * | 2009-09-29 | 2013-05-21 | Semiconductor Components Industries, Llc | Method for manufacturing a semiconductor component |
TWM397591U (en) * | 2010-04-22 | 2011-02-01 | Mao Bang Electronic Co Ltd | Bumping structure |
US9425146B2 (en) * | 2010-09-28 | 2016-08-23 | Infineon Technologies Ag | Semiconductor structure and method for making same |
US20130241058A1 (en) * | 2012-03-16 | 2013-09-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wire Bonding Structures for Integrated Circuits |
WO2015125460A1 (en) * | 2014-02-18 | 2015-08-27 | Skyworks Panasonic Filter Solutions Japan Co., Ltd. | Acoustic wave elements and ladder filters using same |
CN205726641U (zh) * | 2016-01-04 | 2016-11-23 | 奥特斯(中国)有限公司 | 具有不同面层的部件载体及含有该部件载体的电子设备 |
DE102016216308B4 (de) | 2016-08-30 | 2022-06-15 | Schweizer Electronic Ag | Leiterplatte und Verfahren zu deren Herstellung |
US10998463B2 (en) | 2016-11-15 | 2021-05-04 | Shin-Etsu Chemical Co., Ltd. | High efficiency solar cell and method for manufacturing high efficiency solar cell |
US11395405B2 (en) * | 2018-08-28 | 2022-07-19 | Kyocera Corporation | Wiring substrate and electronic device |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2040180B2 (de) * | 1970-01-22 | 1977-08-25 | Intel Corp, Mountain View, Calif. (V.St.A.) | Verfahren zur verhinderung von mechanischen bruechen einer duennen, die oberflaeche eines halbleiterkoerpers ueberdeckende isolierschichten ueberziehenden elektrisch leitenden schicht |
US3862017A (en) * | 1970-02-04 | 1975-01-21 | Hideo Tsunemitsu | Method for producing a thin film passive circuit element |
GB1527894A (en) * | 1975-10-15 | 1978-10-11 | Mullard Ltd | Methods of manufacturing electronic devices |
JPS59126665A (ja) * | 1983-01-10 | 1984-07-21 | Hitachi Ltd | 厚膜混成集積回路 |
JPS60128641A (ja) * | 1983-12-16 | 1985-07-09 | Hitachi Ltd | 多層配線 |
JPS6320079A (ja) * | 1986-07-11 | 1988-01-27 | ヤンマー農機株式会社 | 穀粒などの粒状体の感知センサ−装置 |
JPH01277311A (ja) * | 1988-04-28 | 1989-11-07 | Hitachi Ltd | 薄膜磁気ヘッド |
-
1995
- 1995-09-13 US US08/527,868 patent/US5738931A/en not_active Expired - Fee Related
- 1995-09-15 DE DE69501243T patent/DE69501243T2/de not_active Expired - Fee Related
- 1995-09-15 EP EP95306536A patent/EP0702379B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5738931A (en) | 1998-04-14 |
DE69501243T2 (de) | 1998-05-20 |
EP0702379B1 (de) | 1997-12-17 |
EP0702379A1 (de) | 1996-03-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |