DE69501243T2 - Elektronische und/oder magnetische Vorrichtung - Google Patents

Elektronische und/oder magnetische Vorrichtung

Info

Publication number
DE69501243T2
DE69501243T2 DE69501243T DE69501243T DE69501243T2 DE 69501243 T2 DE69501243 T2 DE 69501243T2 DE 69501243 T DE69501243 T DE 69501243T DE 69501243 T DE69501243 T DE 69501243T DE 69501243 T2 DE69501243 T2 DE 69501243T2
Authority
DE
Germany
Prior art keywords
electronic
magnetic device
magnetic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69501243T
Other languages
English (en)
Other versions
DE69501243D1 (de
Inventor
Toshiro Sato
Tetsuhiko Mizoguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of DE69501243D1 publication Critical patent/DE69501243D1/de
Application granted granted Critical
Publication of DE69501243T2 publication Critical patent/DE69501243T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
    • G11B5/3109—Details
    • G11B5/313—Disposition of layers
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
    • G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F2017/004—Printed inductances with the coil helically wound around an axis without a core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/03—Manufacturing methods
    • H01L2224/036—Manufacturing methods by patterning a pre-deposited material
    • H01L2224/0361—Physical or chemical etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/03—Manufacturing methods
    • H01L2224/036—Manufacturing methods by patterning a pre-deposited material
    • H01L2224/03622—Manufacturing methods by patterning a pre-deposited material using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0542—Continuous temporary metal layer over metal pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
DE69501243T 1994-09-16 1995-09-15 Elektronische und/oder magnetische Vorrichtung Expired - Fee Related DE69501243T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22144494 1994-09-16

Publications (2)

Publication Number Publication Date
DE69501243D1 DE69501243D1 (de) 1998-01-29
DE69501243T2 true DE69501243T2 (de) 1998-05-20

Family

ID=16766837

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69501243T Expired - Fee Related DE69501243T2 (de) 1994-09-16 1995-09-15 Elektronische und/oder magnetische Vorrichtung

Country Status (3)

Country Link
US (1) US5738931A (de)
EP (1) EP0702379B1 (de)
DE (1) DE69501243T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016216308A1 (de) 2016-08-30 2018-03-01 Continental Automotive Gmbh Leiterplatte und Verfahren zu deren Herstellung

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JP2000174206A (ja) * 1998-12-10 2000-06-23 Sony Corp 半導体装置およびその製造方法
TW444252B (en) * 1999-03-19 2001-07-01 Toshiba Corp Semiconductor apparatus and its fabricating method
JP2000322709A (ja) * 1999-05-13 2000-11-24 Alps Electric Co Ltd 薄膜素子およびその製造方法
JP3363832B2 (ja) * 1999-05-13 2003-01-08 アルプス電気株式会社 薄膜構造体およびその製造方法
US6369983B1 (en) * 1999-08-13 2002-04-09 Read-Rite Corporation Write head having a dry-etchable antireflective intermediate layer
JP2001244123A (ja) 2000-02-28 2001-09-07 Kawatetsu Mining Co Ltd 表面実装型平面磁気素子及びその製造方法
JP3320397B2 (ja) * 2000-03-09 2002-09-03 クラリアント ジャパン 株式会社 逆テーパー状レジストパターンの形成方法
SG100666A1 (en) 2000-04-04 2003-12-26 Nec Tokin Corp Wiring board comprising granular magnetic film
JP2001307313A (ja) * 2000-04-20 2001-11-02 Fujitsu Ltd 薄膜ヘッドの製造方法
TWI312166B (en) * 2001-09-28 2009-07-11 Toppan Printing Co Ltd Multi-layer circuit board, integrated circuit package, and manufacturing method for multi-layer circuit board
JP3775499B2 (ja) * 2002-01-08 2006-05-17 株式会社リコー 半導体装置及びその製造方法、並びにｄｃ−ｄｃコンバータ
JP3745316B2 (ja) 2002-06-24 2006-02-15 Ｎｅｃエレクトロニクス株式会社 半導体集積回路及びその製造方法
JP2005261987A (ja) * 2002-09-06 2005-09-29 Joiaasu Kk 活性化装置
US7358195B2 (en) * 2003-04-01 2008-04-15 Lg.Philips Lcd Co., Ltd. Method for fabricating liquid crystal display device
JP4268434B2 (ja) * 2003-04-09 2009-05-27 大日本印刷株式会社 配線基板の製造方法
JP2005191408A (ja) * 2003-12-26 2005-07-14 Matsushita Electric Ind Co Ltd コイル導電体とその製造方法およびこれを用いた電子部品
JP2006154569A (ja) * 2004-11-30 2006-06-15 Tokyo Ohka Kogyo Co Ltd レジストパターンおよび導体パターンの製造方法
PA8672101A1 (es) 2005-04-29 2006-12-07 Centocor Inc Anticuerpos anti-il-6, composiciones, métodos y usos
TWI277373B (en) * 2005-09-16 2007-03-21 Foxconn Advanced Tech Inc Method of continuous producing flexible printed circuit board
WO2009057195A1 (ja) * 2007-10-30 2009-05-07 Fujitsu Limited 弾性波素子、デュープレクサ、通信モジュール、および通信装置
US8188235B2 (en) 2008-06-18 2012-05-29 Pfizer Inc. Antibodies to IL-6 and their uses
US8445375B2 (en) * 2009-09-29 2013-05-21 Semiconductor Components Industries, Llc Method for manufacturing a semiconductor component
TWM397591U (en) * 2010-04-22 2011-02-01 Mao Bang Electronic Co Ltd Bumping structure
US9425146B2 (en) * 2010-09-28 2016-08-23 Infineon Technologies Ag Semiconductor structure and method for making same
US20130241058A1 (en) * 2012-03-16 2013-09-19 Taiwan Semiconductor Manufacturing Company, Ltd. Wire Bonding Structures for Integrated Circuits
CN106031031B (zh) 2014-02-18 2019-03-08 天工滤波方案日本有限公司 声波元件和使用声波元件的梯型滤波器
CN205726641U (zh) * 2016-01-04 2016-11-23 奥特斯(中国)有限公司 具有不同面层的部件载体及含有该部件载体的电子设备
WO2018092172A1 (ja) 2016-11-15 2018-05-24 信越化学工業株式会社 高効率太陽電池及び高効率太陽電池の製造方法
EP3846597A4 (de) * 2018-08-28 2022-05-18 Kyocera Corporation Leiterplatte und elektronische vorrichtung

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DE2040180B2 (de) * 1970-01-22 1977-08-25 Intel Corp, Mountain View, Calif. (V.St.A.) Verfahren zur verhinderung von mechanischen bruechen einer duennen, die oberflaeche eines halbleiterkoerpers ueberdeckende isolierschichten ueberziehenden elektrisch leitenden schicht
US3862017A (en) * 1970-02-04 1975-01-21 Hideo Tsunemitsu Method for producing a thin film passive circuit element
GB1527894A (en) * 1975-10-15 1978-10-11 Mullard Ltd Methods of manufacturing electronic devices
JPS59126665A (ja) * 1983-01-10 1984-07-21 Hitachi Ltd 厚膜混成集積回路
JPS60128641A (ja) * 1983-12-16 1985-07-09 Hitachi Ltd 多層配線
JPS6320079A (ja) * 1986-07-11 1988-01-27 ヤンマー農機株式会社 穀粒などの粒状体の感知センサ−装置
JPH01277311A (ja) * 1988-04-28 1989-11-07 Hitachi Ltd 薄膜磁気ヘッド

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016216308A1 (de) 2016-08-30 2018-03-01 Continental Automotive Gmbh Leiterplatte und Verfahren zu deren Herstellung
US10834810B2 (en) 2016-08-30 2020-11-10 Schweizer Electronic Ag Circuit board and method for production thereof
DE102016216308B4 (de) 2016-08-30 2022-06-15 Schweizer Electronic Ag Leiterplatte und Verfahren zu deren Herstellung

Also Published As

Publication number Publication date
EP0702379A1 (de) 1996-03-20
DE69501243D1 (de) 1998-01-29
EP0702379B1 (de) 1997-12-17
US5738931A (en) 1998-04-14

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