DE69431535D1 - Verfahren zur Herstellung von einer Chalcopyrit-Halbleiterdünnschichtstruktur mit einem spezifischen Dotiermaterial - Google Patents

Verfahren zur Herstellung von einer Chalcopyrit-Halbleiterdünnschichtstruktur mit einem spezifischen Dotiermaterial

Info

Publication number
DE69431535D1
DE69431535D1 DE69431535T DE69431535T DE69431535D1 DE 69431535 D1 DE69431535 D1 DE 69431535D1 DE 69431535 T DE69431535 T DE 69431535T DE 69431535 T DE69431535 T DE 69431535T DE 69431535 D1 DE69431535 D1 DE 69431535D1
Authority
DE
Germany
Prior art keywords
producing
film structure
semiconductor thin
doping material
specific doping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69431535T
Other languages
English (en)
Other versions
DE69431535T2 (de
Inventor
Takayuki Negami
Mikihiko Nishitani
Shigemi Kohiki
Takahiro Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE69431535D1 publication Critical patent/DE69431535D1/de
Publication of DE69431535T2 publication Critical patent/DE69431535T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
    • H01L31/0264—Inorganic materials
    • H01L31/032—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312
    • H01L31/0322—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312 comprising only AIBIIICVI chalcopyrite compounds, e.g. Cu In Se2, Cu Ga Se2, Cu In Ga Se2
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/541—CuInSe2 material PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/153—Solar cells-implantations-laser beam
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/93—Ternary or quaternary semiconductor comprised of elements from three different groups, e.g. I-III-V

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Photovoltaic Devices (AREA)
  • Semiconductor Lasers (AREA)
  • Led Devices (AREA)
DE69431535T 1993-02-15 1994-02-10 Verfahren zur Herstellung von einer Chalcopyrit-Halbleiterdünnschichtstruktur mit einem spezifischen Dotiermaterial Expired - Lifetime DE69431535T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2528793A JP3337255B2 (ja) 1993-02-15 1993-02-15 カルコパイライト構造半導体薄膜とその製造方法、薄膜太陽電池の製造方法、および発光装置の製造方法

Publications (2)

Publication Number Publication Date
DE69431535D1 true DE69431535D1 (de) 2002-11-14
DE69431535T2 DE69431535T2 (de) 2003-06-26

Family

ID=12161808

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69410137T Expired - Fee Related DE69410137T2 (de) 1993-02-15 1994-02-10 Verfahren zur Herstellung einer chalkopyrit-Halbleiterschicht
DE69431535T Expired - Lifetime DE69431535T2 (de) 1993-02-15 1994-02-10 Verfahren zur Herstellung von einer Chalcopyrit-Halbleiterdünnschichtstruktur mit einem spezifischen Dotiermaterial

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69410137T Expired - Fee Related DE69410137T2 (de) 1993-02-15 1994-02-10 Verfahren zur Herstellung einer chalkopyrit-Halbleiterschicht

Country Status (4)

Country Link
US (2) US5389572A (de)
EP (2) EP0612112B1 (de)
JP (1) JP3337255B2 (de)
DE (2) DE69410137T2 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4442824C1 (de) * 1994-12-01 1996-01-25 Siemens Ag Solarzelle mit Chalkopyrit-Absorberschicht
EP0743686A3 (de) * 1995-05-15 1998-12-02 Matsushita Electric Industrial Co., Ltd Vorprodukt für Halbleiterdünnschichten und Verfahren zur Herstellung von Halbleiterdünnschichten
JPH10270733A (ja) * 1997-01-24 1998-10-09 Asahi Chem Ind Co Ltd ｐ型半導体、ｐ型半導体の製造方法、光起電力素子、発光素子
DE19723387C2 (de) * 1997-06-04 1999-05-12 Inst Oberflaechenmodifizierung Selektives Wasserstoff-Ionenstrahlätzen von binären Fremdphasen in Chalkopyrithalbleiter-Dünnschichten
US20100108118A1 (en) * 2008-06-02 2010-05-06 Daniel Luch Photovoltaic power farm structure and installation
US8884155B2 (en) 2006-04-13 2014-11-11 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US9236512B2 (en) 2006-04-13 2016-01-12 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US8729385B2 (en) 2006-04-13 2014-05-20 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US9865758B2 (en) 2006-04-13 2018-01-09 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
WO2009033503A1 (en) * 2007-09-12 2009-03-19 Flisom Ag Method for manufacturing a compound film
WO2009046178A1 (en) * 2007-10-02 2009-04-09 University Of Delaware I-iii-vi2 photovoltaic absorber layers
KR101271753B1 (ko) * 2009-11-20 2013-06-05 한국전자통신연구원 박막형 광 흡수층의 제조 방법, 이를 이용한 박막 태양전지 제조 방법 및 박막 태양전지
JP2013522881A (ja) 2010-03-10 2013-06-13 ダウ グローバル テクノロジーズ エルエルシー 可撓性太陽電池相互接続装置および方法
CN102024870B (zh) * 2010-04-19 2013-07-24 福建欧德生光电科技有限公司 半导体薄膜太阳能电池的制造系统和方法
US8802479B2 (en) 2010-06-03 2014-08-12 NuvoSun, Inc. Solar cell interconnection method using a flat metallic mesh
US9530926B2 (en) 2011-12-07 2016-12-27 NuvoSun, Inc. Automated flexible solar cell fabrication and interconnection utilizing rolls expanded metallic mesh
RU2567191C1 (ru) * 2014-07-10 2015-11-10 Федеральное государственное бюджетное учреждение науки Институт проблем химической физики Российской академии наук (ИПХФ РАН) Способ изготовления фоточувствительных халькопиритных пленок
CN111341664B (zh) * 2020-03-11 2022-09-20 鄂尔多斯应用技术学院 过渡金属元素掺杂CuGaS2的中间带薄膜及其制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4004342A (en) * 1976-02-23 1977-01-25 The United States Of America As Represented By The Secretary Of The Air Force Fabrication of ion implanted P-N junction devices
US4311728A (en) * 1980-10-24 1982-01-19 Exxon Research & Engineering Co. Method for depositing photoconductive zinc tin phosphide
US4915745A (en) * 1988-09-22 1990-04-10 Atlantic Richfield Company Thin film solar cell and method of making
JPH02270381A (ja) * 1989-04-11 1990-11-05 Matsushita Electric Ind Co Ltd 半導体発光素子の製造方法
US5078804A (en) * 1989-06-27 1992-01-07 The Boeing Company I-III-VI2 based solar cell utilizing the structure CuInGaSe2 CdZnS/ZnO
JPH04324647A (ja) * 1991-04-24 1992-11-13 Dowa Mining Co Ltd ＣｕＩｎＳｅ２薄膜の製法
DE69231288T2 (de) * 1991-09-27 2000-11-30 Matsushita Electric Industrial Co., Ltd. Verfahren zur Herstellung einer Verbindungshalbleiter-Dünnschicht
JPH05262504A (ja) * 1991-09-27 1993-10-12 Matsushita Electric Ind Co Ltd 化合物半導体、その薄膜製造方法及びそれを用いた半導体装置
US5286306A (en) * 1992-02-07 1994-02-15 Shalini Menezes Thin film photovoltaic cells from I-III-VI-VII compounds

Also Published As

Publication number Publication date
EP0817279A1 (de) 1998-01-07
US5389572A (en) 1995-02-14
EP0817279B1 (de) 2002-10-09
EP0612112B1 (de) 1998-05-13
US5474622A (en) 1995-12-12
EP0612112A2 (de) 1994-08-24
JP3337255B2 (ja) 2002-10-21
DE69431535T2 (de) 2003-06-26
DE69410137T2 (de) 1998-09-03
DE69410137D1 (de) 1998-06-18
JPH06244442A (ja) 1994-09-02
EP0612112A3 (de) 1994-12-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: JUNG, SCHIRDEWAHN, GRUENBERG, SCHNEIDER PATENTANWAELTE

8328 Change in the person/name/address of the agent

Representative=s name: ADVOTEC. PATENT- UND RECHTSANWAELTE, 80538 MUENCHE

8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP