DE69430703T2 - Verfahren zur korrektur der dicke von exzessiven aushärtenden, photometrisch geformten gegenständen - Google Patents

Verfahren zur korrektur der dicke von exzessiven aushärtenden, photometrisch geformten gegenständen

Info

Publication number
DE69430703T2
DE69430703T2 DE69430703T DE69430703T DE69430703T2 DE 69430703 T2 DE69430703 T2 DE 69430703T2 DE 69430703 T DE69430703 T DE 69430703T DE 69430703 T DE69430703 T DE 69430703T DE 69430703 T2 DE69430703 T2 DE 69430703T2
Authority
DE
Germany
Prior art keywords
overhang portion
thickness
section
data
cutout
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69430703T
Other languages
German (de)
English (en)
Other versions
DE69430703D1 (de
Inventor
Toshiroo Endoo
Norio Goto
Masumi Moritani
Masakatsu Ohkubo
Masahiko Ozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP27404193A external-priority patent/JP3173252B2/ja
Priority claimed from JP27647593A external-priority patent/JP3146805B2/ja
Priority claimed from JP06831094A external-priority patent/JP3477805B2/ja
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE69430703D1 publication Critical patent/DE69430703D1/de
Publication of DE69430703T2 publication Critical patent/DE69430703T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/124—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
    • B29C64/129—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask
    • B29C64/135—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask the energy source being concentrated, e.g. scanning lasers or focused light sources
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00—Data acquisition or data processing for additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0838—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C2037/90—Measuring, controlling or regulating
    • B29C2037/903—Measuring, controlling or regulating by means of a computer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/005—Compensating volume or shape change during moulding, in general

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
DE69430703T 1993-11-02 1994-11-01 Verfahren zur korrektur der dicke von exzessiven aushärtenden, photometrisch geformten gegenständen Expired - Fee Related DE69430703T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP27404193A JP3173252B2 (ja) 1993-11-02 1993-11-02 光造形方法及び光造形装置
JP27647593A JP3146805B2 (ja) 1993-11-05 1993-11-05 光造形方法及び光造形装置
JP06831094A JP3477805B2 (ja) 1994-04-06 1994-04-06 データ処理方法及び光造形装置
PCT/JP1994/001841 WO1995012485A1 (en) 1993-11-02 1994-11-01 Method of correcting thickness of excessive curing of photomolded article and apparatus therefor

Publications (2)

Publication Number Publication Date
DE69430703D1 DE69430703D1 (de) 2002-07-04
DE69430703T2 true DE69430703T2 (de) 2003-01-30

Family

ID=27299699

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69430703T Expired - Fee Related DE69430703T2 (de) 1993-11-02 1994-11-01 Verfahren zur korrektur der dicke von exzessiven aushärtenden, photometrisch geformten gegenständen
DE69432836T Expired - Fee Related DE69432836T2 (de) 1993-11-02 1994-11-01 Verfahren und vorrichtung zur korrektur der exzessiven ausgehärteten dicke von photometrisch geformten gegenständen

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69432836T Expired - Fee Related DE69432836T2 (de) 1993-11-02 1994-11-01 Verfahren und vorrichtung zur korrektur der exzessiven ausgehärteten dicke von photometrisch geformten gegenständen

Country Status (4)

Country Link
US (1) US5858297A (OSRAM)
EP (2) EP1136235B1 (OSRAM)
DE (2) DE69430703T2 (OSRAM)
WO (1) WO1995012485A1 (OSRAM)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5943235A (en) 1995-09-27 1999-08-24 3D Systems, Inc. Rapid prototyping system and method with support region data processing
US6270335B2 (en) 1995-09-27 2001-08-07 3D Systems, Inc. Selective deposition modeling method and apparatus for forming three-dimensional objects and supports
BR9610663A (pt) * 1995-09-27 1999-07-13 3D Systems Inc Método e aparelho para manipulação de dados e controle de sistema em um sistema de modelagem de depósito seletivo
US6051179A (en) * 1997-03-19 2000-04-18 Replicator Systems, Inc. Apparatus and method for production of three-dimensional models by spatial light modulator
US8481241B2 (en) 2000-03-13 2013-07-09 Stratasys Ltd. Compositions and methods for use in three dimensional model printing
US7300619B2 (en) 2000-03-13 2007-11-27 Objet Geometries Ltd. Compositions and methods for use in three dimensional model printing
US20030207959A1 (en) 2000-03-13 2003-11-06 Eduardo Napadensky Compositions and methods for use in three dimensional model printing
US6463872B1 (en) 2000-03-31 2002-10-15 Alcatel Laser photocuring system
US8460451B2 (en) 2011-02-23 2013-06-11 3D Systems, Inc. Support material and applications thereof
US9394441B2 (en) 2011-03-09 2016-07-19 3D Systems, Inc. Build material and applications thereof
US9157007B2 (en) 2011-03-09 2015-10-13 3D Systems, Incorporated Build material and applications thereof
EP3003722B1 (en) 2013-05-31 2019-10-23 Hewlett-Packard Development Company, L.P. Modifying a base layer of an object
JP7040236B2 (ja) * 2018-04-05 2022-03-23 富士フイルムビジネスイノベーション株式会社 三次元形状データの編集装置、三次元造形装置、三次元造形システム、及び三次元形状データの編集プログラム
US11498283B2 (en) * 2019-02-20 2022-11-15 General Electric Company Method and apparatus for build thickness control in additive manufacturing
US11782416B2 (en) * 2020-05-11 2023-10-10 General Electric Company Compensation for additive manufacturing

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4999789A (en) * 1987-02-05 1991-03-12 Hewlett-Packard Co. Method and apparatus for trimming B-spline descriptions of patches in a high performance three dimensional graphics system
JPH02228774A (ja) * 1989-03-02 1990-09-11 Fanuc Ltd ３次元パラメトリックモデリング方式
DE69131711T2 (de) * 1990-02-15 2000-06-21 3D Systems, Inc. Verfahren und apparat zur formung eines festen dreidimensionalen artikels aus einer flüssigkeit
JP2526164B2 (ja) * 1990-07-19 1996-08-21 株式会社 ヤマシタ 釣り針の製法
JPH0479827A (ja) * 1990-07-20 1992-03-13 Daiwa Seiko Inc 釣竿の継合装置
JP2715648B2 (ja) * 1990-09-29 1998-02-18 ソニー株式会社 立体形状形成装置
US5238639A (en) * 1990-10-31 1993-08-24 3D Systems, Inc. Method and apparatus for stereolithographic curl balancing
JPH0745195B2 (ja) * 1990-11-02 1995-05-17 三菱商事株式会社 高精度光固化造形装置
JPH0533901A (ja) * 1991-07-24 1993-02-09 Shigehisa Tamahashi 熱媒発電方法とその装置
JPH0533900A (ja) * 1991-07-30 1993-02-09 Toshiba Corp ガス供給装置
JPH05224721A (ja) * 1992-02-12 1993-09-03 Nec Software Ltd ３次元曲面形状加工方法
JPH05278124A (ja) * 1992-04-01 1993-10-26 Matsushita Electric Ind Co Ltd 光造形データ作成方法

Also Published As

Publication number Publication date
DE69432836D1 (de) 2003-07-24
EP1136235B1 (en) 2003-06-18
DE69432836T2 (de) 2004-05-13
EP0727302A4 (OSRAM) 1996-09-18
EP0727302B1 (en) 2002-05-29
EP0727302A1 (en) 1996-08-21
US5858297A (en) 1999-01-12
WO1995012485A1 (en) 1995-05-11
DE69430703D1 (de) 2002-07-04
EP1136235A1 (en) 2001-09-26

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee