DE69430036T2 - Testvorrichtung für integrierte Schaltungen - Google Patents

Testvorrichtung für integrierte Schaltungen

Info

Publication number
DE69430036T2
DE69430036T2 DE69430036T DE69430036T DE69430036T2 DE 69430036 T2 DE69430036 T2 DE 69430036T2 DE 69430036 T DE69430036 T DE 69430036T DE 69430036 T DE69430036 T DE 69430036T DE 69430036 T2 DE69430036 T2 DE 69430036T2
Authority
DE
Germany
Prior art keywords
integrated circuit
test
flexible
contact structure
circuit die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69430036T
Other languages
German (de)
English (en)
Other versions
DE69430036D1 (de
Inventor
Mohi Sobhani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Application granted granted Critical
Publication of DE69430036D1 publication Critical patent/DE69430036D1/de
Publication of DE69430036T2 publication Critical patent/DE69430036T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
DE69430036T 1993-11-23 1994-11-14 Testvorrichtung für integrierte Schaltungen Expired - Fee Related DE69430036T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/157,556 US5455518A (en) 1993-11-23 1993-11-23 Test apparatus for integrated circuit die

Publications (2)

Publication Number Publication Date
DE69430036D1 DE69430036D1 (de) 2002-04-11
DE69430036T2 true DE69430036T2 (de) 2002-10-24

Family

ID=22564254

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69430036T Expired - Fee Related DE69430036T2 (de) 1993-11-23 1994-11-14 Testvorrichtung für integrierte Schaltungen

Country Status (6)

Country Link
US (1) US5455518A (fr)
EP (1) EP0654672B1 (fr)
JP (1) JP3316095B2 (fr)
KR (1) KR0135214B1 (fr)
DE (1) DE69430036T2 (fr)
IL (1) IL111589A (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5642054A (en) * 1995-08-08 1997-06-24 Hughes Aircraft Company Active circuit multi-port membrane probe for full wafer testing
US6303988B1 (en) 1998-04-22 2001-10-16 Packard Hughes Interconnect Company Wafer scale burn-in socket
US7132841B1 (en) * 2000-06-06 2006-11-07 International Business Machines Corporation Carrier for test, burn-in, and first level packaging
JP2005086044A (ja) * 2003-09-09 2005-03-31 Citizen Electronics Co Ltd 高信頼性パッケージ
US8884640B2 (en) * 2011-04-28 2014-11-11 Mpi Corporation Integrated high-speed probe system
US20120324305A1 (en) * 2011-06-20 2012-12-20 Texas Instruments Incorporated Testing interposer method and apparatus

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4554505A (en) * 1983-06-10 1985-11-19 Rockwell International Corporation Test socket for a leadless chip carrier
KR880004322A (ko) * 1986-09-05 1988-06-03 로버트 에스. 헐스 집적회로 프로브시스템
US4783719A (en) * 1987-01-20 1988-11-08 Hughes Aircraft Company Test connector for electrical devices
US4899099A (en) * 1988-05-19 1990-02-06 Augat Inc. Flex dot wafer probe
JPH07109840B2 (ja) * 1989-03-10 1995-11-22 松下電器産業株式会社 半導体ｉｃの試験装置及び試験方法
US4956605A (en) * 1989-07-18 1990-09-11 International Business Machines Corporation Tab mounted chip burn-in apparatus
US5156983A (en) * 1989-10-26 1992-10-20 Digtial Equipment Corporation Method of manufacturing tape automated bonding semiconductor package
US5148103A (en) * 1990-10-31 1992-09-15 Hughes Aircraft Company Apparatus for testing integrated circuits

Also Published As

Publication number Publication date
US5455518A (en) 1995-10-03
JP3316095B2 (ja) 2002-08-19
IL111589A (en) 1997-11-20
IL111589A0 (en) 1995-01-24
EP0654672A3 (fr) 1996-02-14
KR0135214B1 (ko) 1998-05-15
EP0654672A2 (fr) 1995-05-24
JPH07302821A (ja) 1995-11-14
EP0654672B1 (fr) 2002-03-06
DE69430036D1 (de) 2002-04-11
KR950014898A (ko) 1995-06-16

Similar Documents

Publication Publication Date Title
DE2319011C2 (de) Verfahren zum Prüfen eines Leiternetzes auf einem isolierenden Substrat und Anordnung zur Durchführung des Verfahrens
DE69228214T2 (de) Verbinderanordnungen zum Testen integrierter Schaltungen im Gehäuse
DE19701336C2 (de) Sondenanordnung für ein Kugelrasterarray
DE2242337C2 (de) Vorrichtung zur Halterung von Schaltungskarten
DE9314259U1 (de) Sondenadapter für elektonische Bauelemente
EP0838688B1 (fr) Appareil et procédé de test de circuits imprimés
DE112007000389T5 (de) Abstandswandler, Herstellungsverfahren des Abstandswandlers und Prüfkarte, die den Abstandswandler enthält
DE10044408A1 (de) Pinblockstruktur zur Halterung von Anschlußpins
DE3887849T2 (de) Integrierte Schaltungspackung.
DE69019436T2 (de) Adapter für integrierte Schaltkreiselemente und Verfahren unter Verwendung des Adapters zur Prüfung von zusammengebauten Elementen.
DE69430004T2 (de) Verbindungstechnik hoher dichte
DE2744299A1 (de) Verfahren zum ausrichten einer reihe von sonden auf eine reihe von kontakten
EP1111397B1 (fr) Dispositif pour tester des pouces avec un circuit intégré
DE4315082C2 (de) Verbinderanordnung zum Testen eines integrierten Schaltungsbausteins
DE2547323C3 (de) Trägerplatte für wenigstens eine integrierte Halbleitershaltung
DE19931278B4 (de) Prüfkarte und IC-Prüfgerät
DE69430036T2 (de) Testvorrichtung für integrierte Schaltungen
DE10153666A1 (de) Kontaktanordnung mit hoher Dichte
DE10056882C2 (de) Verfahren zum Kalibrieren eines Testsystems für Halbleiterbauelemente und Testsubstrat
DE102004042305A1 (de) Verbindungspin
DE69024292T2 (de) Interfacekarte für eine zu prüfende Anordnung sowie Verbindungen elektronischer Prüfkarten in Halbleiterprüfsystemen
DE102004034357A1 (de) Prüfkarten Trägerelement
DE10043193B4 (de) Prüfgerät für Halbleitersubstrate
DE4424963A1 (de) Fassung für eine direkte elektrische Verbindung mit einem integrierten Schaltungschip
DE10060585A1 (de) Vorrichtung und Verfahren zur Untersuchung einer integrierten Halbleiterschaltung

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee