DE9314259U1 - Sondenadapter für elektonische Bauelemente - Google Patents

Sondenadapter für elektonische Bauelemente

Info

Publication number
DE9314259U1
DE9314259U1 DE9314259U DE9314259U DE9314259U1 DE 9314259 U1 DE9314259 U1 DE 9314259U1 DE 9314259 U DE9314259 U DE 9314259U DE 9314259 U DE9314259 U DE 9314259U DE 9314259 U1 DE9314259 U1 DE 9314259U1
Authority
DE
Germany
Prior art keywords
electronic components
probe adapter
adapter
probe
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE9314259U
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tektronix Inc
Original Assignee
Tektronix Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tektronix Inc filed Critical Tektronix Inc
Publication of DE9314259U1 publication Critical patent/DE9314259U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
DE9314259U 1992-09-29 1993-09-21 Sondenadapter für elektonische Bauelemente Expired - Lifetime DE9314259U1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US95461892A 1992-09-29 1992-09-29

Publications (1)

Publication Number Publication Date
DE9314259U1 true DE9314259U1 (de) 1994-02-10

Family

ID=25495695

Family Applications (1)

Application Number Title Priority Date Filing Date
DE9314259U Expired - Lifetime DE9314259U1 (de) 1992-09-29 1993-09-21 Sondenadapter für elektonische Bauelemente

Country Status (4)

Country Link
US (2) US5548223A (de)
JP (2) JPH06194385A (de)
DE (1) DE9314259U1 (de)
FR (1) FR2696283B3 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19603802A1 (de) * 1995-02-03 1996-08-14 Hewlett Packard Co Spannungssonde mit Vielfachanschlußleitungen

Families Citing this family (37)

* Cited by examiner, † Cited by third party
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US5859538A (en) * 1996-01-31 1999-01-12 Hewlett-Packard Company Method and apparatus for connecting a ball grid array device to a test instrument to facilitate the monitoring of individual signals or the interruption of individual signals or both
US5692911A (en) * 1996-03-27 1997-12-02 Electronic Products, Inc. Flexible electrical test fixure for integrated circuits on prototype and production printed circuit boards
US5896037A (en) * 1996-10-10 1999-04-20 Methode Electronics, Inc. Interface test adapter for actively testing an integrated circuit chip package
US6191594B1 (en) * 1996-10-28 2001-02-20 Tektronix, Inc. Adapter for a measurement test probe
JP3100930B2 (ja) * 1997-09-10 2000-10-23 株式会社双晶テック コンタクトプローブ
US6326797B2 (en) * 1998-03-04 2001-12-04 International Business Machines Corporation Apparatus and method for evaluating printed circuit board assembly manufacturing processes
JP3790041B2 (ja) * 1998-04-28 2006-06-28 富士通株式会社 プローブおよび検査装置
US6184576B1 (en) * 1998-09-21 2001-02-06 Advantest Corp. Packaging and interconnection of contact structure
US6106316A (en) * 1999-02-10 2000-08-22 International Business Machines Corporation Multistage connector for carriers with combined pin-array and pad-array
US6222378B1 (en) 1999-05-28 2001-04-24 Tektronix, Inc. Probe adapter for a ball-grid-array package
US6344736B1 (en) * 1999-07-22 2002-02-05 Tensolite Company Self-aligning interface apparatus for use in testing electrical
US6351392B1 (en) 1999-10-05 2002-02-26 Ironwood Electronics, Inc, Offset array adapter
US6428327B1 (en) * 1999-10-14 2002-08-06 Unisys Corporation Flexible adapter for use between LGA device and printed circuit board
US6394820B1 (en) 1999-10-14 2002-05-28 Ironwood Electronics, Inc. Packaged device adapter assembly and mounting apparatus
US6533589B1 (en) 1999-10-14 2003-03-18 Ironwood Electronics, Inc. Packaged device adapter assembly
US20090100295A1 (en) * 2000-01-06 2009-04-16 Super Talent Electronics, Inc. Reliable memory module testing and manufacturing method
US6540527B1 (en) 2000-04-28 2003-04-01 Unisys Corporation Method and adapter for reworking a circuit containing an LGA device
US6603323B1 (en) * 2000-07-10 2003-08-05 Formfactor, Inc. Closed-grid bus architecture for wafer interconnect structure
US6812048B1 (en) * 2000-07-31 2004-11-02 Eaglestone Partners I, Llc Method for manufacturing a wafer-interposer assembly
JP4734706B2 (ja) * 2000-11-01 2011-07-27 Ｊｓｒ株式会社 電気抵抗測定用コネクター並びに回路基板の電気抵抗測定装置および測定方法
US6686657B1 (en) * 2000-11-07 2004-02-03 Eaglestone Partners I, Llc Interposer for improved handling of semiconductor wafers and method of use of same
US6819126B2 (en) * 2000-12-29 2004-11-16 Storage Technology Corporation Signal sampling using flex circuits on direct inter-connects
US6717425B2 (en) * 2001-10-17 2004-04-06 Hewlett-Packard Development Company, L.P. High-density PCB test jack
US6655965B2 (en) * 2001-11-28 2003-12-02 Fci Americas Technology, Inc. Interconnect device for electrically coupling a test system to a circuit board adapted for use with a ball-grid array connector
US7173439B1 (en) 2003-02-14 2007-02-06 Lecroy Corporation Guide for tip to transmission path contact
US7317312B1 (en) 2003-02-14 2008-01-08 Lecroy Corporation Guide for tip to transmission path contact
US6877993B2 (en) * 2003-05-30 2005-04-12 Ironwood Electronics, Inc. Packaged device adapter assembly with alignment structure and methods regarding same
US7642791B2 (en) * 2003-11-07 2010-01-05 Intel Corporation Electronic component/interface interposer
US7518238B2 (en) * 2005-12-02 2009-04-14 Intel Corporation Mounting flexible circuits onto integrated circuit substrates
US7294995B1 (en) * 2006-05-08 2007-11-13 Tektronix, Inc. Current probing system
US7503767B2 (en) * 2006-08-01 2009-03-17 General Dynamics Advanced Information Systems, Inc. Method and apparatus for compliantly connecting stack of high-density electronic modules in harsh environments
IT1397222B1 (it) * 2009-12-30 2013-01-04 St Microelectronics Srl Metodo per controllare il corretto posizionamento di sonde di test su terminazioni di dispositivi elettronici integrati su semiconduttore e relativo dispositivo elettronico.
TWI442534B (zh) * 2010-04-12 2014-06-21 Hon Hai Prec Ind Co Ltd 晶片轉接板
US9263817B2 (en) 2013-06-12 2016-02-16 Ironwood Electronics, Inc. Adapter apparatus with suspended conductive elastomer interconnect
US9048565B2 (en) 2013-06-12 2015-06-02 Ironwood Electronics, Inc. Adapter apparatus with deflectable element socket contacts
US9986165B2 (en) * 2014-12-31 2018-05-29 Invent.ly LLC Remote analyte testing system
US9877404B1 (en) 2017-01-27 2018-01-23 Ironwood Electronics, Inc. Adapter apparatus with socket contacts held in openings by holding structures

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2907953A1 (de) * 1978-03-06 1979-10-04 Tektronix Inc Flache anschlusschelle
EP0078339A1 (de) * 1981-10-30 1983-05-11 Ibm Deutschland Gmbh Tastkopfanordnung für Leiterzugüberprüfung mit mindestens einem, eine Vielzahl von federnden Kontakten aufweisenden Tastkopf
US4554505A (en) * 1983-06-10 1985-11-19 Rockwell International Corporation Test socket for a leadless chip carrier
DD263359A1 (de) * 1987-07-31 1988-12-28 Tech Uni Pruefadapter
US5084672A (en) * 1989-02-21 1992-01-28 Giga Probe, Inc. Multi-point probe assembly for testing electronic device
US5166609A (en) * 1990-05-24 1992-11-24 Tektronix, Inc. Adapter and test fixture for an integrated circuit device package
US5202622A (en) * 1990-05-24 1993-04-13 Tektronix, Inc. Adapter and test fixture for an integrated circuit device package
US5221895A (en) * 1991-12-23 1993-06-22 Tektronix, Inc. Probe with microstrip transmission lines

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2023947A (en) * 1933-12-28 1935-12-10 Weston Electrical Instr Corp Radioanalyzer
US2578288A (en) * 1950-03-03 1951-12-11 James W Cook Test adapter
US3405361A (en) * 1964-01-08 1968-10-08 Signetics Corp Fluid actuable multi-point microprobe for semiconductors
US3596228A (en) * 1969-05-29 1971-07-27 Ibm Fluid actuated contactor
US4065717A (en) * 1970-09-15 1977-12-27 Signetics Corporation Multi-point microprobe for testing integrated circuits
JPS5830256A (ja) * 1981-08-17 1983-02-22 Nec Corp 通信制御装置
JPS59155769A (ja) * 1983-02-25 1984-09-04 Seiko Epson Corp 電子デイバイスの検査装置
US4636722A (en) * 1984-05-21 1987-01-13 Probe-Rite, Inc. High density probe-head with isolated and shielded transmission lines
US4922192A (en) * 1988-09-06 1990-05-01 Unisys Corporation Elastic membrane probe
US4963821A (en) * 1989-04-14 1990-10-16 Tektronix, Inc. Probe and method for testing a populated circuit board
US5087877A (en) * 1991-02-25 1992-02-11 Motorola Inc. Test contact fixture using flexible circuit tape
US5203075A (en) * 1991-08-12 1993-04-20 Inernational Business Machines Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders
JPH05313936A (ja) * 1992-05-08 1993-11-26 Nec Corp インサーキットエミュレータ

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2907953A1 (de) * 1978-03-06 1979-10-04 Tektronix Inc Flache anschlusschelle
EP0078339A1 (de) * 1981-10-30 1983-05-11 Ibm Deutschland Gmbh Tastkopfanordnung für Leiterzugüberprüfung mit mindestens einem, eine Vielzahl von federnden Kontakten aufweisenden Tastkopf
EP0078339B1 (de) * 1981-10-30 1986-07-30 Ibm Deutschland Gmbh Tastkopfanordnung für Leiterzugüberprüfung mit mindestens einem, eine Vielzahl von federnden Kontakten aufweisenden Tastkopf
US4554505A (en) * 1983-06-10 1985-11-19 Rockwell International Corporation Test socket for a leadless chip carrier
DD263359A1 (de) * 1987-07-31 1988-12-28 Tech Uni Pruefadapter
US5084672A (en) * 1989-02-21 1992-01-28 Giga Probe, Inc. Multi-point probe assembly for testing electronic device
US5166609A (en) * 1990-05-24 1992-11-24 Tektronix, Inc. Adapter and test fixture for an integrated circuit device package
US5202622A (en) * 1990-05-24 1993-04-13 Tektronix, Inc. Adapter and test fixture for an integrated circuit device package
US5221895A (en) * 1991-12-23 1993-06-22 Tektronix, Inc. Probe with microstrip transmission lines

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19603802A1 (de) * 1995-02-03 1996-08-14 Hewlett Packard Co Spannungssonde mit Vielfachanschlußleitungen

Also Published As

Publication number Publication date
FR2696283A3 (fr) 1994-04-01
JPH06194385A (ja) 1994-07-15
US5903162A (en) 1999-05-11
US5548223A (en) 1996-08-20
FR2696283B3 (fr) 1994-09-09
JPH10185947A (ja) 1998-07-14

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