DE69426409D1 - Phasenverschiebungsmaske, Verfahren zur Herstellung derselben und Belichtungsverfahren unter Verwendung einer solchen Phasenverschiebungsmaske - Google Patents

Phasenverschiebungsmaske, Verfahren zur Herstellung derselben und Belichtungsverfahren unter Verwendung einer solchen Phasenverschiebungsmaske

Info

Publication number
DE69426409D1
DE69426409D1 DE69426409T DE69426409T DE69426409D1 DE 69426409 D1 DE69426409 D1 DE 69426409D1 DE 69426409 T DE69426409 T DE 69426409T DE 69426409 T DE69426409 T DE 69426409T DE 69426409 D1 DE69426409 D1 DE 69426409D1
Authority
DE
Germany
Prior art keywords
phase shift
shift mask
manufacturing
same
exposure method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69426409T
Other languages
English (en)
Other versions
DE69426409T2 (de
Inventor
Shuji Nakao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE69426409D1 publication Critical patent/DE69426409D1/de
Application granted granted Critical
Publication of DE69426409T2 publication Critical patent/DE69426409T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
    • G03F1/30—Alternating PSM, e.g. Levenson-Shibuya PSM; Preparation thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
    • G03F1/32—Attenuating PSM [att-PSM], e.g. halftone PSM or PSM having semi-transparent phase shift portion; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70283—Mask effects on the imaging process

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE69426409T 1993-10-18 1994-08-22 Phasenverschiebungsmaske, Verfahren zur Herstellung derselben und Belichtungsverfahren unter Verwendung einer solchen Phasenverschiebungsmaske Expired - Lifetime DE69426409T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP26003493 1993-10-18
JP3872594A JP3257893B2 (ja) 1993-10-18 1994-03-09 位相シフトマスク、その位相シフトマスクの製造方法およびその位相シフトマスクを用いた露光方法

Publications (2)

Publication Number Publication Date
DE69426409D1 true DE69426409D1 (de) 2001-01-18
DE69426409T2 DE69426409T2 (de) 2001-06-07

Family

ID=26378014

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69426409T Expired - Lifetime DE69426409T2 (de) 1993-10-18 1994-08-22 Phasenverschiebungsmaske, Verfahren zur Herstellung derselben und Belichtungsverfahren unter Verwendung einer solchen Phasenverschiebungsmaske

Country Status (6)

Country Link
US (4) US5536602A (de)
EP (1) EP0650090B1 (de)
JP (1) JP3257893B2 (de)
KR (1) KR0162005B1 (de)
DE (1) DE69426409T2 (de)
TW (1) TW232077B (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3130777B2 (ja) * 1995-11-27 2001-01-31 日本電気株式会社 フォトマスク及びその製造方法
KR100215850B1 (ko) * 1996-04-12 1999-08-16 구본준 하프톤 위상 반전 마스크 및_그제조방법
US5869212A (en) * 1996-05-31 1999-02-09 Kabushiki Kaisha Toshiba Integrated circuit photofabrication masks and methods for making same
KR100219079B1 (ko) * 1996-06-29 1999-09-01 김영환 해프톤 위상 반전 마스크
KR100201040B1 (ko) * 1996-08-26 1999-06-15 다니구찌 이찌로오; 기타오카 다카시 위상 쉬프트 마스크 및 그 제조 방법
US5804338A (en) * 1996-10-31 1998-09-08 Samsung Electronics Co., Ltd. Photolithography masks including phase-shifting layers and related methods and structures
US6277526B1 (en) * 1998-12-28 2001-08-21 Micron Technology, Inc. Method for repairing MoSi attenuated phase shift masks
US6251546B1 (en) * 1999-09-16 2001-06-26 Agere Systems Guardian Corp. Method of fabricating devices using an attenuated phase-shifting mask and an attenuated phase-shifting mask
DE10001119A1 (de) * 2000-01-13 2001-07-26 Infineon Technologies Ag Phasenmaske
US6415431B1 (en) * 2000-02-18 2002-07-02 International Business Machines Corporation Repair of phase shift materials to enhance adhesion
US6358820B1 (en) * 2000-04-17 2002-03-19 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing semiconductor device
US6762132B1 (en) * 2000-08-31 2004-07-13 Micron Technology, Inc. Compositions for dissolution of low-K dielectric films, and methods of use
DE60234906D1 (de) 2001-02-15 2010-02-11 Dainippon Printing Co Ltd Verfahren zur herstellung einer phasenverschiebungsmaske und phasenverschiebungsmaske
US6902851B1 (en) 2001-03-14 2005-06-07 Advanced Micro Devices, Inc. Method for using phase-shifting mask
JP2002324743A (ja) * 2001-04-24 2002-11-08 Canon Inc 露光方法及び装置
AU2003254221A1 (en) * 2002-07-26 2004-02-16 Biogal Gyogyszergyar Rt. Preparation of 1h-imidazo (4,5-c) quinolin-4-amines via novel 1h-imidazo (4,5-c) quinolin-4-cyano and 1h-imidazo (4,5-c) quinolin-4-carboxamide intermediates
JP4297693B2 (ja) * 2003-01-31 2009-07-15 株式会社ルネサステクノロジ フォトマスク、フォトマスクの製造方法、およびフォトマスクの製造装置
DE10310136B4 (de) * 2003-03-07 2007-05-03 Infineon Technologies Ag Maskensatz zur Projektion von jeweils auf den Masken des Satzes angeordneten und aufeinander abgestimmten Strukturmustern auf einen Halbleiterwafer
US7326501B2 (en) * 2003-03-10 2008-02-05 Intel Corporation Method for correcting focus-dependent line shifts in printing with sidewall chrome alternating aperture masks (SCAAM)
JP2005070650A (ja) * 2003-08-27 2005-03-17 Tdk Corp レジストパターン形成方法
JP4566666B2 (ja) * 2004-09-14 2010-10-20 富士通セミコンダクター株式会社 露光用マスクとその製造方法
US20060105520A1 (en) * 2004-11-18 2006-05-18 Tan Sia K Structure and method to fabricate a protective sidewall liner for an optical mask
JP4695964B2 (ja) * 2005-11-09 2011-06-08 アルバック成膜株式会社 グレートーンマスク及びその製造方法
WO2016158649A1 (ja) * 2015-03-27 2016-10-06 Hoya株式会社 マスクブランク、位相シフトマスク及び位相シフトマスクの製造方法、並びに半導体装置の製造方法
JP6726553B2 (ja) * 2015-09-26 2020-07-22 Hoya株式会社 フォトマスクの製造方法、及び表示装置の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02211450A (ja) * 1989-02-10 1990-08-22 Fujitsu Ltd 位相シフトマスクおよびその製造方法
EP0395425B1 (de) * 1989-04-28 1996-10-16 Fujitsu Limited Maske, Herstellungsverfahren und Musterherstellung mit einer solchen Maske
JP2519815B2 (ja) * 1990-03-01 1996-07-31 三菱電機株式会社 フォトマスク及びその製造方法
JPH0442154A (ja) * 1990-06-07 1992-02-12 Mitsubishi Electric Corp 位相シフトマスクの作成方法
JP3036085B2 (ja) * 1990-12-28 2000-04-24 富士通株式会社 光学マスクとその欠陥修正方法
KR940003582B1 (ko) * 1991-04-30 1994-04-25 삼성전자 주식회사 위상변화 마스크의 제조방법
US5286581A (en) * 1991-08-19 1994-02-15 Motorola, Inc. Phase-shift mask and method for making
US5288569A (en) * 1992-04-23 1994-02-22 International Business Machines Corporation Feature biassing and absorptive phase-shifting techniques to improve optical projection imaging
JP3279758B2 (ja) * 1992-12-18 2002-04-30 株式会社日立製作所 半導体集積回路装置の製造方法
WO1994017450A1 (en) * 1993-01-21 1994-08-04 Sematech, Inc. Phase shifting mask structure with absorbing/attenuating sidewalls for improved imaging and method of fabricating phase shifters with absorbing/attenuating sidewalls

Also Published As

Publication number Publication date
US5858625A (en) 1999-01-12
JP3257893B2 (ja) 2002-02-18
KR950012571A (ko) 1995-05-16
EP0650090A1 (de) 1995-04-26
US5536602A (en) 1996-07-16
KR0162005B1 (ko) 1999-02-01
EP0650090B1 (de) 2000-12-13
TW232077B (en) 1994-10-11
JPH07168342A (ja) 1995-07-04
DE69426409T2 (de) 2001-06-07
US5853922A (en) 1998-12-29
US5698348A (en) 1997-12-16

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