DE60030908D1 - Maskenfilm, Verfahren zu dessen Herstellung, und Verfahren zur Herstellung einer Leiterplatte unter Verwendung desselben - Google Patents

Maskenfilm, Verfahren zu dessen Herstellung, und Verfahren zur Herstellung einer Leiterplatte unter Verwendung desselben

Info

Publication number
DE60030908D1
DE60030908D1 DE60030908T DE60030908T DE60030908D1 DE 60030908 D1 DE60030908 D1 DE 60030908D1 DE 60030908 T DE60030908 T DE 60030908T DE 60030908 T DE60030908 T DE 60030908T DE 60030908 D1 DE60030908 D1 DE 60030908D1
Authority
DE
Germany
Prior art keywords
manufacturing
same
circuit board
mask film
mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60030908T
Other languages
English (en)
Other versions
DE60030908T2 (de
Inventor
Toshiaki Takenaka
Toshikazu Kondo
Kunio Kishimoto
Shinji Nakamura
Fumio Echigo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE60030908D1 publication Critical patent/DE60030908D1/de
Application granted granted Critical
Publication of DE60030908T2 publication Critical patent/DE60030908T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0522—Using an adhesive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laser Beam Processing (AREA)
DE60030908T 1999-05-18 2000-05-18 Maskenfilm, Verfahren zu dessen Herstellung, und Verfahren zur Herstellung einer Leiterplatte unter Verwendung desselben Expired - Lifetime DE60030908T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP13672199 1999-05-18
JP13672199A JP3344363B2 (ja) 1999-05-18 1999-05-18 マスクフィルムとその製造方法およびそれを用いた回路基板の製造方法

Publications (2)

Publication Number Publication Date
DE60030908D1 true DE60030908D1 (de) 2006-11-09
DE60030908T2 DE60030908T2 (de) 2007-01-04

Family

ID=15181951

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60030908T Expired - Lifetime DE60030908T2 (de) 1999-05-18 2000-05-18 Maskenfilm, Verfahren zu dessen Herstellung, und Verfahren zur Herstellung einer Leiterplatte unter Verwendung desselben

Country Status (6)

Country Link
US (2) US6694612B1 (de)
EP (1) EP1054582B1 (de)
JP (1) JP3344363B2 (de)
CN (1) CN1205845C (de)
DE (1) DE60030908T2 (de)
TW (1) TW491010B (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3344363B2 (ja) 1999-05-18 2002-11-11 松下電器産業株式会社 マスクフィルムとその製造方法およびそれを用いた回路基板の製造方法
JP4595284B2 (ja) * 2003-01-28 2010-12-08 三菱瓦斯化学株式会社 炭酸ガスレーザーによる孔あけ用補助シート
US7251884B2 (en) * 2004-04-26 2007-08-07 Formfactor, Inc. Method to build robust mechanical structures on substrate surfaces
DE102005062604A1 (de) * 2005-12-27 2007-07-05 Robert Bosch Gmbh Verfahren zur Herstellung eines elektronischen Schaltungsträgers, Veredelungsvorrichtung eines elektronischen Schaltungsträgers sowie Schaltungsträger
JP2009076699A (ja) * 2007-09-20 2009-04-09 Fujikura Ltd 多層プリント配線板の製造方法
JP5173358B2 (ja) * 2007-10-31 2013-04-03 東邦テナックス株式会社 保護フィルム付プリプレグ
US20120012371A1 (en) * 2009-04-02 2012-01-19 Panasonic Corporation Manufacturing method for circuit board, and circuit board
CN101976716A (zh) * 2010-10-21 2011-02-16 光颉科技股份有限公司 基板通孔的导电方法
JP5110613B2 (ja) * 2010-11-25 2012-12-26 東洋アルミ千葉株式会社 樹脂ベース基板用離型材およびその製造方法
TWI489342B (zh) * 2012-12-26 2015-06-21 Ind Tech Res Inst 凹版轉印組合物及凹版轉印製程
WO2019012655A1 (ja) * 2017-07-13 2019-01-17 株式会社寺岡製作所 多層マスキングシート

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1478341A (en) * 1973-06-07 1977-06-29 Hitachi Chemical Co Ltd Printed circuit board and method of making the same
US4915983A (en) * 1985-06-10 1990-04-10 The Foxboro Company Multilayer circuit board fabrication process
US4642160A (en) * 1985-08-12 1987-02-10 Interconnect Technology Inc. Multilayer circuit board manufacturing
JP2601128B2 (ja) * 1992-05-06 1997-04-16 松下電器産業株式会社 回路形成用基板の製造方法および回路形成用基板
US5358604A (en) * 1992-09-29 1994-10-25 Microelectronics And Computer Technology Corp. Method for producing conductive patterns
JP2768236B2 (ja) 1993-10-08 1998-06-25 松下電器産業株式会社 多層基板の製造方法
US5505321A (en) * 1994-12-05 1996-04-09 Teledyne Industries, Inc. Fabrication multilayer combined rigid/flex printed circuit board
JP3400164B2 (ja) * 1995-01-23 2003-04-28 三井金属鉱業株式会社 多層プリント配線板およびその製造方法
US5902438A (en) * 1997-08-13 1999-05-11 Fry's Metals, Inc. Process for the formation of anisotropic conducting material
US6120693A (en) * 1998-11-06 2000-09-19 Alliedsignal Inc. Method of manufacturing an interlayer via and a laminate precursor useful for same
US6163957A (en) * 1998-11-13 2000-12-26 Fujitsu Limited Multilayer laminated substrates with high density interconnects and methods of making the same
JP3344363B2 (ja) * 1999-05-18 2002-11-11 松下電器産業株式会社 マスクフィルムとその製造方法およびそれを用いた回路基板の製造方法
JP3903701B2 (ja) * 2000-08-17 2007-04-11 松下電器産業株式会社 多層回路基板とその製造方法

Also Published As

Publication number Publication date
US20030153197A1 (en) 2003-08-14
EP1054582A3 (de) 2005-09-07
US7066344B2 (en) 2006-06-27
CN1205845C (zh) 2005-06-08
US6694612B1 (en) 2004-02-24
EP1054582A2 (de) 2000-11-22
JP3344363B2 (ja) 2002-11-11
JP2000332375A (ja) 2000-11-30
CN1274257A (zh) 2000-11-22
TW491010B (en) 2002-06-11
EP1054582B1 (de) 2006-09-27
DE60030908T2 (de) 2007-01-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP