DE69424099T2 - Niedertemperaturreinigung von Kaltwand-CVD-Einrichtungen - Google Patents

Niedertemperaturreinigung von Kaltwand-CVD-Einrichtungen

Info

Publication number
DE69424099T2
DE69424099T2 DE69424099T DE69424099T DE69424099T2 DE 69424099 T2 DE69424099 T2 DE 69424099T2 DE 69424099 T DE69424099 T DE 69424099T DE 69424099 T DE69424099 T DE 69424099T DE 69424099 T2 DE69424099 T2 DE 69424099T2
Authority
DE
Germany
Prior art keywords
low temperature
cold wall
temperature cleaning
wall cvd
cvd devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69424099T
Other languages
English (en)
Other versions
DE69424099D1 (de
Inventor
David Carlson
H Peter W Hey
James C Hann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of DE69424099D1 publication Critical patent/DE69424099D1/de
Application granted granted Critical
Publication of DE69424099T2 publication Critical patent/DE69424099T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4405—Cleaning of reactor or parts inside the reactor by using reactive gases

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
DE69424099T 1993-07-30 1994-07-05 Niedertemperaturreinigung von Kaltwand-CVD-Einrichtungen Expired - Fee Related DE69424099T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/100,582 US5421957A (en) 1993-07-30 1993-07-30 Low temperature etching in cold-wall CVD systems

Publications (2)

Publication Number Publication Date
DE69424099D1 DE69424099D1 (de) 2000-05-31
DE69424099T2 true DE69424099T2 (de) 2000-09-14

Family

ID=22280489

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69424099T Expired - Fee Related DE69424099T2 (de) 1993-07-30 1994-07-05 Niedertemperaturreinigung von Kaltwand-CVD-Einrichtungen

Country Status (4)

Country Link
US (1) US5421957A (de)
EP (2) EP0857796A3 (de)
JP (1) JPH0778808A (de)
DE (1) DE69424099T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10344612A1 (de) * 2003-09-25 2005-05-04 Infineon Technologies Ag Verfahren zur Reinigung von ALD-Kammern

Families Citing this family (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5486235A (en) * 1993-08-09 1996-01-23 Applied Materials, Inc. Plasma dry cleaning of semiconductor processing chambers
US5609721A (en) * 1994-03-11 1997-03-11 Fujitsu Limited Semiconductor device manufacturing apparatus and its cleaning method
US6110838A (en) * 1994-04-29 2000-08-29 Texas Instruments Incorporated Isotropic polysilicon plus nitride stripping
US5714011A (en) * 1995-02-17 1998-02-03 Air Products And Chemicals Inc. Diluted nitrogen trifluoride thermal cleaning process
JPH08319586A (ja) * 1995-05-24 1996-12-03 Nec Yamagata Ltd 真空処理装置のクリーニング方法
JPH0929002A (ja) * 1995-07-17 1997-02-04 Teisan Kk ガス回収装置
EP1050602B1 (de) * 1995-08-03 2004-05-26 ASM America, Inc. Prozesskammer mit innerer Tragstruktur
US6093252A (en) 1995-08-03 2000-07-25 Asm America, Inc. Process chamber with inner support
US5861065A (en) * 1997-01-21 1999-01-19 Air Products And Chemicals, Inc. Nitrogen trifluoride-oxygen thermal cleaning process
US5882424A (en) * 1997-01-21 1999-03-16 Applied Materials, Inc. Plasma cleaning of a CVD or etch reactor using a low or mixed frequency excitation field
US5868852A (en) * 1997-02-18 1999-02-09 Air Products And Chemicals, Inc. Partial clean fluorine thermal cleaning process
JP3801730B2 (ja) 1997-05-09 2006-07-26 株式会社半導体エネルギー研究所 プラズマｃｖｄ装置及びそれを用いた薄膜形成方法
US6022587A (en) * 1997-05-13 2000-02-08 Applied Materials, Inc. Method and apparatus for improving film deposition uniformity on a substrate
WO1999006611A1 (en) * 1997-08-01 1999-02-11 Applied Komatsu Technology, Inc. Method and apparatus for chamber cleaning
US5914050A (en) * 1997-09-22 1999-06-22 Applied Materials, Inc. Purged lower liner
KR100257903B1 (ko) * 1997-12-30 2000-08-01 윤종용 인시튜 모니터링가능한 플라즈마 식각장치, 그 인시튜 모니터링방법, 플라즈마 식각챔버내의 잔류물 제거를 위한 인시튜 세정방법
US6749687B1 (en) * 1998-01-09 2004-06-15 Asm America, Inc. In situ growth of oxide and silicon layers
US6042654A (en) * 1998-01-13 2000-03-28 Applied Materials, Inc. Method of cleaning CVD cold-wall chamber and exhaust lines
US6135128A (en) * 1998-03-27 2000-10-24 Eaton Corporation Method for in-process cleaning of an ion source
US6019839A (en) * 1998-04-17 2000-02-01 Applied Materials, Inc. Method and apparatus for forming an epitaxial titanium silicide film by low pressure chemical vapor deposition
US6067999A (en) * 1998-04-23 2000-05-30 International Business Machines Corporation Method for deposition tool cleaning
US6236023B1 (en) * 1998-07-13 2001-05-22 Mattson Technology, Inc. Cleaning process for rapid thermal processing system
US6395099B1 (en) * 1999-02-08 2002-05-28 Micron Technology Method of processing selected surfaces in a semiconductor process chamber based on a temperature differential between surfaces
US6245149B1 (en) * 1999-07-01 2001-06-12 Applied Materials, Inc. Inert barrier for high purity epitaxial deposition systems
US6383330B1 (en) 1999-09-10 2002-05-07 Asm America, Inc. Quartz wafer processing chamber
JP2001156065A (ja) * 1999-11-24 2001-06-08 Hitachi Kokusai Electric Inc 半導体装置の製造方法および半導体製造装置
US6786935B1 (en) * 2000-03-10 2004-09-07 Applied Materials, Inc. Vacuum processing system for producing components
KR20080103609A (ko) * 2001-05-30 2008-11-27 에이에스엠 아메리카, 인코포레이티드 저온 로딩 및 소성
JP3725822B2 (ja) * 2001-12-27 2005-12-14 レール・リキード−ソシエテ・アノニム・ア・ディレクトワール・エ・コンセイユ・ドゥ・スールベイランス・プール・レテュード・エ・レクスプロワタシオン・デ・プロセデ・ジョルジュ・クロード フッ素ガス生成及び供給装置
JP3758579B2 (ja) * 2002-01-23 2006-03-22 信越半導体株式会社 熱処理装置および熱処理方法
DE10219108A1 (de) * 2002-04-29 2004-01-29 Advanced Micro Devices, Inc., Sunnyvale Hocheffizienter Fernreinigungsprozess für Prozesskammern in Abscheideanlagen
TWI294155B (en) * 2002-06-21 2008-03-01 Applied Materials Inc Transfer chamber for vacuum processing system
US6955725B2 (en) 2002-08-15 2005-10-18 Micron Technology, Inc. Reactors with isolated gas connectors and methods for depositing materials onto micro-device workpieces
US7581511B2 (en) 2003-10-10 2009-09-01 Micron Technology, Inc. Apparatus and methods for manufacturing microfeatures on workpieces using plasma vapor processes
US7169233B2 (en) * 2003-11-21 2007-01-30 Asm America, Inc. Reactor chamber
US8133554B2 (en) 2004-05-06 2012-03-13 Micron Technology, Inc. Methods for depositing material onto microfeature workpieces in reaction chambers and systems for depositing materials onto microfeature workpieces
US20050252529A1 (en) * 2004-05-12 2005-11-17 Ridgeway Robert G Low temperature CVD chamber cleaning using dilute NF3
US7784164B2 (en) * 2004-06-02 2010-08-31 Applied Materials, Inc. Electronic device manufacturing chamber method
US20060201074A1 (en) * 2004-06-02 2006-09-14 Shinichi Kurita Electronic device manufacturing chamber and methods of forming the same
CN101866828B (zh) * 2004-06-02 2013-03-20 应用材料公司 电子装置制造室及其形成方法
US7699932B2 (en) 2004-06-02 2010-04-20 Micron Technology, Inc. Reactors, systems and methods for depositing thin films onto microfeature workpieces
US20060062913A1 (en) * 2004-09-17 2006-03-23 Yun-Ren Wang Process for depositing btbas-based silicon nitride films
US7819981B2 (en) * 2004-10-26 2010-10-26 Advanced Technology Materials, Inc. Methods for cleaning ion implanter components
JP4849829B2 (ja) * 2005-05-15 2012-01-11 株式会社ソニー・コンピュータエンタテインメント センタ装置
US20060254613A1 (en) * 2005-05-16 2006-11-16 Dingjun Wu Method and process for reactive gas cleaning of tool parts
US20070006893A1 (en) * 2005-07-08 2007-01-11 Bing Ji Free radical initiator in remote plasma chamber clean
US7718225B2 (en) * 2005-08-17 2010-05-18 Applied Materials, Inc. Method to control semiconductor film deposition characteristics
US8278222B2 (en) * 2005-11-22 2012-10-02 Air Products And Chemicals, Inc. Selective etching and formation of xenon difluoride
US20070117396A1 (en) * 2005-11-22 2007-05-24 Dingjun Wu Selective etching of titanium nitride with xenon difluoride
CN101473073B (zh) * 2006-04-26 2012-08-08 高级技术材料公司 半导体加工系统的清洁
US8278176B2 (en) 2006-06-07 2012-10-02 Asm America, Inc. Selective epitaxial formation of semiconductor films
KR100794661B1 (ko) * 2006-08-18 2008-01-14 삼성전자주식회사 기판 처리 장치 및 그 장치의 세정 방법
US7789965B2 (en) * 2006-09-19 2010-09-07 Asm Japan K.K. Method of cleaning UV irradiation chamber
US20080142039A1 (en) * 2006-12-13 2008-06-19 Advanced Technology Materials, Inc. Removal of nitride deposits
US20080289650A1 (en) * 2007-05-24 2008-11-27 Asm America, Inc. Low-temperature cleaning of native oxide
US7759199B2 (en) * 2007-09-19 2010-07-20 Asm America, Inc. Stressor for engineered strain on channel
KR101755970B1 (ko) 2008-02-11 2017-07-07 엔테그리스, 아이엔씨. 이온 공급원 챔버를 포함하는 이온 주입 시스템의 성능 향상 및 수명 연장 방법
EP2260494B1 (de) * 2008-04-10 2013-03-20 Siemens Aktiengesellschaft Transformatorkern
US7871937B2 (en) 2008-05-16 2011-01-18 Asm America, Inc. Process and apparatus for treating wafers
US20100273291A1 (en) * 2009-04-28 2010-10-28 Applied Materials, Inc. Decontamination of mocvd chamber using nh3 purge after in-situ cleaning
JP5036849B2 (ja) * 2009-08-27 2012-09-26 株式会社日立国際電気 半導体装置の製造方法、クリーニング方法および基板処理装置
JP5698950B2 (ja) 2009-10-23 2015-04-08 株式会社半導体エネルギー研究所 半導体装置の作製方法
US8367528B2 (en) 2009-11-17 2013-02-05 Asm America, Inc. Cyclical epitaxial deposition and etch
US9650726B2 (en) 2010-02-26 2017-05-16 Applied Materials, Inc. Methods and apparatus for deposition processes
US8658540B2 (en) 2010-06-09 2014-02-25 Applied Materials, Inc. Methods for low temperature conditioning of process chambers
US9885123B2 (en) 2011-03-16 2018-02-06 Asm America, Inc. Rapid bake of semiconductor substrate with upper linear heating elements perpendicular to horizontal gas flow
US8809170B2 (en) 2011-05-19 2014-08-19 Asm America Inc. High throughput cyclical epitaxial deposition and etch process
US9044793B2 (en) 2011-11-22 2015-06-02 Semiconductor Energy Laboratory Co., Ltd. Method for cleaning film formation apparatus and method for manufacturing semiconductor device
WO2014051909A1 (en) 2012-09-25 2014-04-03 Applied Materials, Inc. Chamber clean with in gas heating source
DE102012218747A1 (de) * 2012-10-15 2014-04-17 Wacker Chemie Ag Verfahren zur Abscheidung von polykristallinem Silicium
WO2014189622A1 (en) * 2013-05-23 2014-11-27 Applied Materials, Inc. A coated liner assembly for a semiconductor processing chamber
US10446420B2 (en) * 2016-08-19 2019-10-15 Applied Materials, Inc. Upper cone for epitaxy chamber
CN108538780A (zh) * 2018-04-18 2018-09-14 睿力集成电路有限公司 位线/存储节点接触栓塞和多晶硅接触薄膜的制造方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7906996A (nl) * 1979-09-20 1981-03-24 Philips Nv Werkwijze voor het reinigen van een reaktor.
GB2162207B (en) * 1984-07-26 1989-05-10 Japan Res Dev Corp Semiconductor crystal growth apparatus
JPH0740555B2 (ja) * 1985-04-10 1995-05-01 旭化成工業株式会社 ケミカル・ペーパー・デポジッション装置、不純物拡散炉及び半導体ウエハの洗浄方法
US4657616A (en) * 1985-05-17 1987-04-14 Benzing Technologies, Inc. In-situ CVD chamber cleaner
GB2183204A (en) * 1985-11-22 1987-06-03 Advanced Semiconductor Mat Nitrogen trifluoride as an in-situ cleaning agent
CA1328796C (en) * 1986-09-12 1994-04-26 Bernard Steele Meyerson Method and apparatus for low temperature, low pressure chemical vapor deposition of epitaxial silicon layers
US4820377A (en) * 1987-07-16 1989-04-11 Texas Instruments Incorporated Method for cleanup processing chamber and vacuum process module
JPH0250485A (ja) * 1988-08-12 1990-02-20 Fujitsu Ltd 光導電体
JP2740789B2 (ja) * 1988-10-31 1998-04-15 東京エレクトロン株式会社 処理方法
JPH02213480A (ja) * 1989-02-14 1990-08-24 Nippon Light Metal Co Ltd 高周波プラズマ発生用アルミニウム電極
US5022961B1 (en) * 1989-07-26 1997-05-27 Dainippon Screen Mfg Method for removing a film on a silicon layer surface
US5043299B1 (en) * 1989-12-01 1997-02-25 Applied Materials Inc Process for selective deposition of tungsten on semiconductor wafer
US5179677A (en) * 1990-08-16 1993-01-12 Applied Materials, Inc. Apparatus and method for substrate heating utilizing various infrared means to achieve uniform intensity
JPH04181734A (ja) * 1990-11-16 1992-06-29 Central Glass Co Ltd ＣＶＤＳｉＯ↓２のクリーニング方法
JPH04323389A (ja) * 1991-04-24 1992-11-12 Kyocera Corp 反応室内部の残留ハロゲン除去方法
JP3210359B2 (ja) * 1991-05-29 2001-09-17 株式会社東芝 ドライエッチング方法
JPH0529274A (ja) * 1991-07-25 1993-02-05 Mitsubishi Electric Corp 半導体製造装置およびそのクリーニング方法
JPH05323389A (ja) * 1992-05-20 1993-12-07 Nippon Telegr & Teleph Corp <Ntt> 光可変分波装置
JPH06330323A (ja) * 1993-05-18 1994-11-29 Mitsubishi Electric Corp 半導体装置製造装置及びそのクリーニング方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10344612A1 (de) * 2003-09-25 2005-05-04 Infineon Technologies Ag Verfahren zur Reinigung von ALD-Kammern

Also Published As

Publication number Publication date
EP0857796A3 (de) 1998-10-21
DE69424099D1 (de) 2000-05-31
EP0857796A2 (de) 1998-08-12
EP0638923B1 (de) 2000-04-26
EP0638923A2 (de) 1995-02-15
JPH0778808A (ja) 1995-03-20
US5421957A (en) 1995-06-06
EP0638923A3 (de) 1995-11-08

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