DE69423684D1 - Verbindungsstruktur zur Übersprechverringerung um die Chip-Ausgangsselektivität zu verbessern - Google Patents

Verbindungsstruktur zur Übersprechverringerung um die Chip-Ausgangsselektivität zu verbessern

Info

Publication number
DE69423684D1
DE69423684D1 DE69423684T DE69423684T DE69423684D1 DE 69423684 D1 DE69423684 D1 DE 69423684D1 DE 69423684 T DE69423684 T DE 69423684T DE 69423684 T DE69423684 T DE 69423684T DE 69423684 D1 DE69423684 D1 DE 69423684D1
Authority
DE
Germany
Prior art keywords
improve
connection structure
chip output
crosstalk reduction
output selectivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69423684T
Other languages
English (en)
Other versions
DE69423684T2 (de
Inventor
David E Bockelman
Robert E Stengel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of DE69423684D1 publication Critical patent/DE69423684D1/de
Application granted granted Critical
Publication of DE69423684T2 publication Critical patent/DE69423684T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B3/00—Line transmission systems
    • H04B3/02—Details
    • H04B3/32—Reducing cross-talk, e.g. by compensating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/4905—Shape
    • H01L2224/4909—Loop shape arrangement
    • H01L2224/49095—Loop shape arrangement parallel in plane
    • H01L2224/49096—Loop shape arrangement parallel in plane horizontal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01055—Cesium [Cs]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H01L2924/30111—Impedance matching

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Cable Transmission Systems, Equalization Of Radio And Reduction Of Echo (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
DE69423684T 1993-08-31 1994-07-21 Verbindungsstruktur zur Übersprechverringerung um die Chip-Ausgangsselektivität zu verbessern Expired - Fee Related DE69423684T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/115,291 US5376902A (en) 1993-08-31 1993-08-31 Interconnection structure for crosstalk reduction to improve off-chip selectivity

Publications (2)

Publication Number Publication Date
DE69423684D1 true DE69423684D1 (de) 2000-05-04
DE69423684T2 DE69423684T2 (de) 2000-11-09

Family

ID=22360414

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69423684T Expired - Fee Related DE69423684T2 (de) 1993-08-31 1994-07-21 Verbindungsstruktur zur Übersprechverringerung um die Chip-Ausgangsselektivität zu verbessern

Country Status (15)

Country Link
US (1) US5376902A (de)
EP (1) EP0641034B1 (de)
JP (1) JPH07106810A (de)
KR (1) KR0137111B1 (de)
CN (1) CN1104373A (de)
AU (1) AU665718B2 (de)
BR (1) BR9403019A (de)
CA (1) CA2130225C (de)
DE (1) DE69423684T2 (de)
FI (1) FI943662A (de)
IL (1) IL110218A (de)
MY (1) MY115426A (de)
RU (1) RU2158992C2 (de)
TW (1) TW282583B (de)
ZA (1) ZA946141B (de)

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US5734268A (en) * 1996-04-08 1998-03-31 Motorola, Inc. Calibration and measurment technique and apparatus for same
US6687842B1 (en) * 1997-04-02 2004-02-03 Tessera, Inc. Off-chip signal routing between multiply-connected on-chip electronic elements via external multiconductor transmission line on a dielectric element
DE19914305B4 (de) * 1998-03-31 2004-11-25 Kanji Higashiyamato Otsuka Elektronische Vorrichtung
US6194774B1 (en) * 1999-03-10 2001-02-27 Samsung Electronics Co., Ltd. Inductor including bonding wires
EP1376747A3 (de) * 2002-06-28 2005-07-20 Texas Instruments Incorporated Gleichtaktunterdrückung bei differentiellen Leitungen durch Schlitze in der Massefläche
US8222721B2 (en) * 2003-09-15 2012-07-17 Silicon Laboratories Inc. Integrated circuit suitable for use in radio receivers
DE102005005887A1 (de) * 2005-02-09 2006-08-10 Rohde & Schwarz Gmbh & Co. Kg Verfahren und Anordnung zur Korrektur der Rückwirkung elektrischer Messwandler auf das Messobjekt
DE102006024457B4 (de) * 2006-05-24 2014-06-05 Infineon Technologies Ag Integrierte Schaltung zum Senden und/oder Empfangen von Signalen
DE102006024460B4 (de) * 2006-05-24 2016-08-04 Infineon Technologies Ag Vorrichtung und Verfahren zur Durchführung eines Tests
DE102006024458B4 (de) * 2006-05-24 2016-04-14 Infineon Technologies Ag Integrierte Mehrfachmischer-Schaltung
US7733265B2 (en) 2008-04-04 2010-06-08 Toyota Motor Engineering & Manufacturing North America, Inc. Three dimensional integrated automotive radars and methods of manufacturing the same
US8022861B2 (en) 2008-04-04 2011-09-20 Toyota Motor Engineering & Manufacturing North America, Inc. Dual-band antenna array and RF front-end for mm-wave imager and radar
US7830301B2 (en) 2008-04-04 2010-11-09 Toyota Motor Engineering & Manufacturing North America, Inc. Dual-band antenna array and RF front-end for automotive radars
US7990237B2 (en) 2009-01-16 2011-08-02 Toyota Motor Engineering & Manufacturing North America, Inc. System and method for improving performance of coplanar waveguide bends at mm-wave frequencies
FR2945895B1 (fr) * 2009-05-20 2014-04-18 Thales Sa Dispositif d'interconnexion pour circuits electroniques, notamment des circuits electroniques hyperfrequence
WO2011004453A1 (ja) * 2009-07-07 2011-01-13 エルメック株式会社 コモンモードフィルタ
US8786496B2 (en) 2010-07-28 2014-07-22 Toyota Motor Engineering & Manufacturing North America, Inc. Three-dimensional array antenna on a substrate with enhanced backlobe suppression for mm-wave automotive applications
TW201228090A (en) * 2010-12-31 2012-07-01 Ind Tech Res Inst Input apparatus on chip for differential signals and balun thereof
JP2013030722A (ja) * 2011-06-22 2013-02-07 Seiko Epson Corp 接続構造および接続方法
CN105781052A (zh) * 2014-04-29 2016-07-20 易欣 一种硅藻泥模块化制品
RU2600731C1 (ru) * 2015-09-30 2016-10-27 Российская Федерация, от имени которой выступает Государственная корпорация по атомной энергии "Росатом" Фильтр подавления электромагнитных помех
KR20170056774A (ko) * 2015-11-13 2017-05-24 에스케이하이닉스 주식회사 반도체 장치 및 반도체 패키지
CN105743334A (zh) * 2016-03-29 2016-07-06 上海中科深江电动车辆有限公司 低压供电回路滤波电路
JP6665759B2 (ja) * 2016-11-10 2020-03-13 三菱電機株式会社 高周波回路
US11516905B2 (en) * 2020-04-14 2022-11-29 Dell Products L.P. Method to improve PCB trace conductivity and system therefor

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US4350958A (en) * 1980-01-17 1982-09-21 Motorola, Inc. Impedance matching circuitry for radio frequency signal power amplifiers
US4386324A (en) * 1980-12-05 1983-05-31 Hughes Aircraft Company Planar chip-level power combiner
JPS5931042A (ja) * 1982-08-12 1984-02-18 Mitsubishi Electric Corp 高周波高出力半導体装置
JPS60134440A (ja) * 1983-12-23 1985-07-17 Hitachi Ltd 半導体集積回路装置
US4831497A (en) * 1986-09-11 1989-05-16 General Electric Company Reduction of cross talk in interconnecting conductors
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JPH05109924A (ja) * 1991-10-17 1993-04-30 Ngk Spark Plug Co Ltd 集積回路用パツケージ
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Also Published As

Publication number Publication date
BR9403019A (pt) 1995-06-27
RU94031099A (ru) 1997-04-20
FI943662A0 (fi) 1994-08-05
IL110218A (en) 1996-10-31
CA2130225A1 (en) 1995-03-01
IL110218A0 (en) 1994-10-21
AU6734894A (en) 1995-03-16
CA2130225C (en) 1999-07-20
EP0641034A3 (de) 1996-01-17
KR0137111B1 (ko) 1998-06-01
JPH07106810A (ja) 1995-04-21
FI943662A (fi) 1995-03-01
CN1104373A (zh) 1995-06-28
AU665718B2 (en) 1996-01-11
US5376902A (en) 1994-12-27
MY115426A (en) 2003-06-30
DE69423684T2 (de) 2000-11-09
RU2158992C2 (ru) 2000-11-10
KR950007088A (ko) 1995-03-21
ZA946141B (en) 1995-11-08
EP0641034B1 (de) 2000-03-29
EP0641034A2 (de) 1995-03-01
TW282583B (de) 1996-08-01

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